Guidance on the recovery methods for sludge generated during "super hard/grinding processing" (case study publication).

Recovery of sludge from coolant liquid in (super hard and grinding processing) / Success case

◆ Issues (Before Implementation) 　● Maintenance tasks such as tank cleaning are difficult with only paper filters. 　● Fine sludge in the coolant adversely affects processing quality. 　● Looking for a separator that can "recover" "hard" sludge, among other things. ◇ Implementation Effects 　〇 Sludge recovery rate improved by approximately 4 to 5 times compared to conventional "filtration devices." 　〇 Processing quality improved as fine "hard sludge" no longer causes scratches. 　〇 High dewatering performance with almost no moisture in the sludge, reducing the burden of recovery tasks, among other benefits.

• Separation device

The strongest magnetic drum in history / Surface magnetic force of 9000 gauss! The "UK" has been newly added to the Fine Mag series, which has the highest customer rating No. 1.

● Magnetic force of 9000 Gauss (drum surface) ● Recovery capacity is an impressive 1.7 times that of the K-type (our standard model)! (Grinding sludge 5-15um) ● Demonstrates powerful recovery for hard-to-magnetize sludge (e.g., from carbide tool grinding)! (Here’s what’s different!) 1. High effectiveness in recovering hard-to-magnetize sludge generated in "carbide tool processing," which has been difficult to recover with conventional methods, as well as "ultra-fine sludge" from honing, lapping, super finishing, and electrical discharge machining. 2. Contributes to resource recycling by recovering "rare metals" (such as tungsten) contained in carbide sludge. 3. No parts that require regular replacement, such as "secondary filtration devices" (paper, diatomaceous earth, line filters), significantly reducing running costs and replacement labor.

• Separation device
• Solid-liquid separation filter
• Filtration Equipment

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)