Application Note: Approach to Inspection of Stainless Steel and Dissimilar Metal Welds Using the Latest Ultrasonic Sensing [PDF Download Available]

Eddyfi manufactured probes support all ultrasonic inspections.

Eddyfi Technologies is committed to revolutionizing non-destructive testing (NDT) across various industries, including aerospace, oil and gas, mining, and power generation. We provide comprehensive phased array ultrasonic testing (PAUT) solutions tailored to the precise needs of applications, with a focus on ensuring the safety of critical equipment. Our cutting-edge equipment, software, scanners, crawlers, and advanced probes deliver dynamic inspection solutions. Our phased array ultrasonic transducers are designed with detailed probe design parameters in mind, aiming to further enhance non-destructive testing methods and address individual inspection requirements in various product inspections and equipment maintenance.

• Other measurement, recording and measuring instruments

The most powerful TFM imaging performance, fast approaches with real-time multi-TFM and PWI, providing a realistic inspection environment compliant with standards!

EMERALD is designed based on inspection technologies such as industry-leading phased array ultrasonic testing (PAUT), total focusing method (TFM) imaging performance, and TOFD, delivering fast and intelligent inspection results. It features exceptional signal quality and achieves high signal amplification without distortion. By combining onboard (and offline-supported) real-time multi-TFM processing with full matrix capture (FMC) and plane wave imaging (PWI) data recording capabilities, you can experience unprecedented rapid and precise inspection results. "Features" • Full matrix capture (FMC) with up to 128 elements • Real-time high-speed multi-TFM achieved through onboard processing • PAUT inspection compliant with standards utilizing 64 channels • Processing of PA channels using parallel firing • TOFD inspection • Multi-channel, continuous (scan), FMC data recording capabilities • High analog signal amplification dynamic range

• Flaw detection testing
• Other inspection equipment and devices
• Image Processing Equipment

A completely integrated portable flaw detection device equipped with the power to drive 64 channels and advanced features such as Total Focusing Method (TFM)!

We are pleased to announce the TOPAZ64, a 64-channel portable phased array ultrasonic testing device that consolidates the required capabilities into a single unit, achieving more accurate and rapid inspections. It possesses the power to simultaneously excite 64 elements (aperture) in phased array UT applications, along with cutting-edge features represented by Full Matrix Capture (FMC) and Total Focusing Method (TFM). The TOPAZ64 offers a smart approach to challenging inspections utilizing the latest technologies as introduced below. 【Features】 • Inspections compliant with 64/128PR phased array ultrasonic testing methods • High-resolution Full Matrix Capture (FMC) • Total Focusing Method with up to 1 million data points per frame • Time of Flight Diffraction (TOFD) inspection *For more details, please request materials or view the PDF data from the download section.*

• Flaw detection testing
• Other inspection equipment and devices
• Image Processing Equipment

The outstanding performance brought by a compact body, the latest ultrasound examination device.

Eddyfi Technologies' Panther2 is based on the presence of a compact phased array ultrasonic testing device that combines unparalleled speed and performance. Designed as a product for industrial inspection integrators and research and development departments in quality control and manufacturing technology, the Panther2 is a reliable solution for achieving flexible and scalable non-destructive testing applications. **Features** - Maintains high productivity without sacrificing detection performance - Very high data acquisition cycle - Standard support for SDK for automatic inspection systems, making integration easy - Units that can be linked with PAUT and TFM - Advanced PAUT functionality included as standard - Supports multi-channel probes with up to 256 channels - Real-time acquisition of elementary A-scan - Built-in CIVA simulator

• Flaw detection testing

A phased array ultrasonic flaw detector equipped with TFM and the latest adaptive ATFM features, prioritizing the voice of the user!

The Gekko is designed with robust and compact housing, incorporating all basic functions and advanced UT capabilities for on-site use. It comes standard with all beam-forming phased array UT technologies and encoders (3-axis) for conventional UT, TOFD, single beam, and multi-group inspections, enabling it to handle challenging inspections. The Gekko also supports real-time TFM/FMC (Full Matrix Capture). The bumpers and connectors are designed with durability and accessory versatility in mind. The touch panel can be used under harsh outdoor conditions. It is equipped with two hot-swappable batteries, allowing for up to 6 hours of operation. It can connect up to 128 channels of probes, providing excellent signal and TFM resolution, enhancing detection performance and reliability. It achieves fast scan speeds and productivity. With connection methods such as USB 3.0 and Gigabit Ethernet output, data transfer speeds are accelerated, allowing for remote control of inspections even in difficult situations. Additionally, it features a 256GB SSD, enabling unlimited data file sizes, making the operator's work more comfortable and reducing on-site working time.

• Flaw detection testing
• Other inspection equipment and devices
• Image Processing Equipment

Features: ● Equipped with Intel Core Ultra 5 125H/Ultra 7 155H・155U ● DDR5 5600MHz SO-DIMM x2 slots (up to 96GB) (sold separately) ● LVDS x1, eDP x1, DP x1, HDMI x1 ● LAN x3, SATA 6Gb/s x1, 8-bit GPIO ● USB 3.2 Gen2 x2, USB 2.0 x4 ● M.2 2280 M-Key x1 (PCIe 4.0 [x4]/SATA), M.2 3052 B-Key x1, M.2 2230 E-Key x1 ● DC 9~36V input * Heat spreader and fan-equipped heat sink sold separately GENE-MTH6-FAN: Fan-equipped heat sink GENE-MTH6-HSP: Heat spreader * Memory, storage, and OS are sold separately.

Features: ● Equipped with Intel Core i3-N305 / Processor N97 ● DDR5 4800MHz SO-DIMM x1 slot (up to 16GB) (sold separately) ● LVDS Dual Channel 18/24 bit x1, VGA x1, HDMI x1 ● Intel 2.5GbE x2, SATA 6Gb/s x1, 8bit GPIO ● USB 3.2 Gen2 x2, USB 2.0 x4 ● Full size mPCIe/mSATA ● M.2 3052 B-Key x1, M.2 2230 E-Key x1 ● DC 9~36V input * Heatsink included * Memory, storage, and OS sold separately

Features: ● Equipped with Intel Core Ultra 5 225H/7 255H (Arrow Lake) ● DDR5 6400MHz dual-channel SODIMM x 2 (up to 96GB) (sold separately) ● LVDS x 1, eDP x 1, HDMI x 1 ● LAN x 3, SATA 6Gb/s x 1, 8-bit GPIO ● USB 3.2 Gen2 x 2, USB 2.0 x 4 ● M.2 2280 M-key x 1, M.2 3052 B-key x 1, M.2 2230 E-key x 1 ● Supports DC input of 9 to 36V ● Fan-equipped heat sink available separately GENE-MTH6-FAN: Heat sink with fan GENE-MTH6-HSP: Heat spreader (requires heat dissipation in the enclosure) * This model does not include OS/memory/storage.

Ejectors tend to be avoided due to their enormous consumption of compressed air. However, they also have many advantages, such as noise reduction, no heat generation, and no vibrations. When used properly, they can also achieve energy savings. ■ Space-saving, noise reduction, and heat prevention! Goodbye, electric pumps Large ejectors are ideal for replacing electric pumps. Their impact is significant and greatly contributes to improving the environment in manufacturing sites. Moreover, maintenance can be done without tools. For more details, visit: https://www.ipros.jp/catalog/detail/718575

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed without causing any thermal impact on the base material. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.