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  3. EXSEAL CO., LTD. Head office
  4. We will be exhibiting at "OPIE'24".
SEMINAR_EVENT
  • Apr 17, 2024
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Apr 17, 2024

We will be exhibiting at "OPIE'24".

EXSEAL CO., LTD. EXSEAL CO., LTD. Head office
We will be exhibiting at "OPIE'24," one of the largest specialized exhibitions related to light in Japan. At our booth, we will showcase products that are active in the semiconductor industry! You can actually see samples and try them out for confirmation. ○ Ideal for holding and storing precision parts and chips! 'Completely silicone-free' siloxane-free precision parts transport case [Gel Base] 'Siloxane-free' semiconductor chip transport case [Gel Base V Type] ○ For dust removal from printed circuit boards and devices, and for picking small parts! 'Reusable with water washing' foreign matter collection adhesive pen [Gel Cleaner Pen] ○ Perfect for removing fine dust from fingertips! Reusable with water washing! 'Non-silicone and plasticizer-free' adhesive gel for fingertips [Tip Remover] We sincerely look forward to your visit. ★ Visit us here ★ OPIE'24 ◎ Dates: April 24 (Wed) - April 26 (Fri), 2024, 10:00 - 17:00 ◎ Venue: Pacifico Yokohama (Exhibition Hall) ◎ Booth Number: D-50
Gel-based image
Gel-based image
Date and time Wednesday, Apr 24, 2024 ~ Friday, Apr 26, 2024
10:00 AM ~ 05:00 PM
Capital Pacifico Yokohama (Exhibition Hall) No. D-50
Entry fee Free
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Silicone-free chip transport case "Gel Base" without adhesive materials.

Protect semiconductor chips and precision devices from vibrations for safe storage and transportation! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. It protects precision parts from vibrations and is also highly effective for securing devices during the transport of components like semiconductors. It can be used with peace of mind as it is free of adhesive materials and siloxanes. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe handling. ■ No silicone used, so there is no impact from siloxanes. Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! The loading surface uses a self-adhesive gel, and since no adhesive materials are used, there is no transfer of glue to the parts. ■ Anti-static treatment! It prevents static destruction of components. ■ Trays and cases can be stacked! Both cases and trays can be held, transported, and stored while stacked. ■ Can be picked up even without a vacuum device!

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For cleaning the base! Gently removes dust from details with the 'Gel Cleaner Pen'

Are you having trouble removing dust from small areas? A soft pen catches foreign objects! Dust collection pen for printed circuit boards.

The gel cleaner pen can collect dust using the self-adhesive properties of the gel itself. The soft material conforms to the fine irregularities of the circuit board and devices, capturing dust and dirt in detail. 【Important Points of the Gel Cleaner Pen】 ■ No adhesive materials used! No worry about glue transfer! Since it captures dust with the gel's self-adhesive properties, no adhesive materials are used. You can use it with peace of mind without worrying about glue transferring to the circuit board or devices. ■ The tip of the pen does not use silicone. ■ Washable to remove dirt! When it gets dirty, washing it with water or transferring dirt to a transfer sheet (sold separately) restores its stickiness, allowing for repeated use. *For more details, please download and view the catalog.

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"Just grip it!" Tip remover to clean dirt from fingertips during work.

Are you troubled by dirt on your fingertips while working? Simply grip to remove fine dust from the gloves. Can be reused by washing with water!

Tip remover is a fingertip adhesive gel designed to remove dirt and grease from gloves. It allows you to remove foreign substances attached to gloves without interrupting your workflow. Its hollow structure makes it easy to grip and conforms well to your fingers. By gently rubbing it with your palm under running water, dirt is removed, and the adhesive power is restored. ★Using a dedicated cleaner also allows for disinfection★ 【Important Points of Tip Remover】 ■ Easy-to-grip structure that effectively catches fine dust on fingertips! Made from soft gel material. Its hollow structure adheres closely to the fingertips. ■ No silicone or plasticizers used in the materials. ■ No adhesive materials used! It utilizes the gel's self-adhesive properties to remove dirt. It does not transfer glue to gloves and does not become sticky. It can be installed in any preferred location such as desks, walls, or ceilings according to your needs, and can also be removed. (Note: Installation may not be possible depending on the material of the surface.) ■ Wash with water to remove dirt! Can be washed completely! When it gets dirty, washing it with water restores its adhesive properties, allowing for repeated use. Using a dedicated cleaner also enables disinfection. *For more details, please download and view the catalog.

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Silicone-free semiconductor chip transport case "Gel Base V Type"

Protect semiconductor chips and precision devices from vibrations for safe storage and transport! This is a transport case for precision devices that is free of siloxane.

Gelbase can be used for the internal and process transport of small parts such as semiconductor chips and precision devices, as well as for overseas transport. During transport, it protects precision parts from vibrations and is also highly effective for fixing semiconductor components. It can be used with peace of mind as it is free of adhesive materials and siloxane. During transport, parts are securely fixed, and they can be easily picked up by creating a vacuum with a vacuum device. 【Features】 ■ Protects precision parts from vibrations during transport, preventing damage. The soft gel material significantly reduces vibrations and shocks during transport, supporting safe transportation. ■ Minimal change in adhesive strength over time! The adhesive strength remains stable over time, maintaining ease of pickup. ■ No siloxane influence due to non-silicone specifications! Silicone is not used in the materials or separators. ■ No adhesive transfer to parts! A self-adhesive gel is used on the loading surface, and since no adhesive materials are used, there is no transfer of adhesive to the parts.

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Related catalog(5)

Precision Parts Storage and Transport Case "Gelbase" Leaflet

Precision Parts Storage and Transport Case "Gelbase" Leaflet

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Hold parts with the power of gel! Precision parts transport case 'Gel Base'

Hold parts with the power of gel! Precision parts transport case 'Gel Base'

PRODUCT
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Finger Adhesive Gel 'Tip Remover' Leaflet

Finger Adhesive Gel 'Tip Remover' Leaflet

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Foreign Object Collection Adhesive Pen "Gel Cleaner Pen" Leaflet

Foreign Object Collection Adhesive Pen "Gel Cleaner Pen" Leaflet

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Vacuum Type Precision Parts Storage and Transport Case 'Gelbase V Type' Leaflet

Vacuum Type Precision Parts Storage and Transport Case 'Gelbase V Type' Leaflet

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EXSEAL CO., LTD.
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[Seminar] Initiatives for the Utilization of Natural Hydrogen and Latest Trends in the Hydrogen Market, Both Domestic and International

  • NEW
  • SEMINAR_EVENT

[Key Lecture Content] 1. Expectations for Natural Hydrogen and NEDO's Efforts Towards Its Utilization New Energy and Industrial Technology Development Organization (NEDO) Innovation Strategy Center (TSC) Sustainable Energy Unit Unit Head: Mr. Haru Shigeki 1. What is natural hydrogen? 2. Why natural hydrogen now? 3. Global trends 4. Research and development at NEDO 5. NEDO's future initiatives 6. Q&A / Business card exchange 2. Trends in Hydrogen-related Markets and Domestic and International Developments Mizuho Bank Industrial Research Department Resource and Energy Team Senior Analyst: Mr. Takahashi Kōdō 1. The environment surrounding energy 2. The environment surrounding hydrogen 3. Trends in hydrogen policy in Europe and the United States 4. Initiatives in Japan 5. Measures to create demand for hydrogen 6. Q&A / Business card exchange

Dec 18, 2025

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[Seminar] Towards the Implementation of Frequency Auctions (Price Competition)

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  • SEMINAR_EVENT

[Speaker] Ministry of Internal Affairs and Communications, Radio Department Mobile Communication Planning Officer Teruhiko Sato [Key Lecture Content] In April 2025, the Radio Law will be amended, introducing a new system for frequency allocation through price competition (auction) targeting frequency bands above 6GHz. In light of this, efforts are underway to aim for early allocation through price competition for the 26GHz band, with discussions ongoing regarding the specific implementation methods and rules for the price competition. In this lecture, I will explain the background and circumstances surrounding the introduction of frequency auctions (price competition), including recent trends in the overall 5G network, as well as the current status of discussions aimed at implementing Japan's first price competition. [Lecture Items] 1. Trends in the overall 5G network 2. Background and circumstances surrounding the introduction of frequency auctions (price competition) 3. Towards the implementation of price competition for the 26GHz band - Background and circumstances of the discussions - Policy for the allocation of the 26GHz band - Method of price competition - Other rules related to price competition 4. Q&A / Business card exchange

Dec 18, 2025

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[Seminar] About the GX-ETS and the Tokyo Stock Exchange Carbon Credit Market

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  • SEMINAR_EVENT

[Speaker] Mr. Takumi Matsuo, Director of the Carbon Credit Market Development Office, Tokyo Stock Exchange, Inc. [Key Lecture Content] Two years have passed since the Tokyo Stock Exchange launched the carbon credit market in October 2023, and the market environment has changed significantly. In particular, discussions are currently underway by the government regarding the details of the second phase of the GX-ETS, which will be fully operational from fiscal year 2026. From the perspective of companies subject to the system fulfilling their obligations to reduce emissions, the role of the J-Credit market at the Tokyo Stock Exchange is expected to become increasingly important. In this lecture, I will provide a broad explanation of the current state of the carbon credit market and future market outlook, taking these policy trends into account. [Lecture Items] 1. What is emissions trading? 2. GX League (Phase 1) and the Tokyo Stock Exchange Carbon Credit Market 3. Initiatives in the Tokyo Stock Exchange "Carbon Credit Market" (FY 2023 and beyond) (1) Introduction of the market maker system (J-Credit) (2) Addition of excess reduction credits to the trading targets 4. GX-ETS (Phase 2) and the Tokyo Stock Exchange Carbon Credit Market 5. Q&A / Business card exchange

Dec 18, 2025

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◆On-Demand Webinar Distribution◆ A Ray of Hope for Challenges in LNP Research and Development

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  • SEMINAR_EVENT

The development of lipid nanoparticles (LNP) requires flexible tools that can accommodate everything from screening to GMP manufacturing. The ideal manufacturing equipment should be capable of handling a wide range of applications, from small-scale, easy-to-handle experiments to multi-parameter, multi-sample, large-scale continuous operations. Additionally, not only is the production of LNP important, but the evaluation of characteristics such as encapsulation efficiency (EE%), RNA amount, particle size, and PDI is also crucial; traditionally, these measurements have been complicated and required multiple instruments. In this webinar, we will introduce scalable LNP manufacturing by Sunshine and one-stop measurements of EE%, total RNA, particle size, PDI, and particle concentration using Stunner AF. Furthermore, you will also be able to watch a demo video showcasing the actual operation of the Sun series (Sunshine, Sunscreen) and Stunner! Instructor: Takuma Iwasaki | Field Application Scientist *This webinar is a recording of a session hosted by Unchained Labs, Inc. in October 2025.

Dec 18, 2025

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[Case Seminar] In-house Data Integration! Panasonic IS, which has supported over 500 companies in integration, will explain the case.

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  • SEMINAR_EVENT

"I want to find a way to manage the workload of addressing system integrations one by one," and "Data integration has become reliant on specific individuals, and after their departure, it ended up being left to the vendor," are among the various challenges faced in promoting data integration. As the importance of data integration increases for driving digital transformation (DX), it is essential to not only rely on external resources but also to pursue in-house development. In this seminar, Panasonic IS, which has supported data integration for over 500 companies, will provide insights on in-house development based on case studies of the data integration tool "ASTERIA Warp." This seminar is recommended for those who want to learn about utilizing no-code data integration tools and those looking to bring data integration in-house. <Recommended for> - Those who want to know the latest trends in data integration for large and medium-sized enterprises - Those who want to learn how to utilize data integration tools effectively - Those who are looking for tips on conducting data integration within their own company Target audience: Information system managers, information system personnel, DX promotion personnel.

Dec 18, 2025

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