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  1. Home
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  3. 山下マテリアル
  4. 【May 22, 2024 - May 24, 2024】Automotive Technology Exhibition 2024 YOKOHAMA: Displaying the high-current flexible substrate "BigElec" at the booth of Daitron Co., Ltd.
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  • May 07, 2024
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May 07, 2024

【May 22, 2024 - May 24, 2024】Automotive Technology Exhibition 2024 YOKOHAMA: Displaying the high-current flexible substrate "BigElec" at the booth of Daitron Co., Ltd.

山下マテリアル 山下マテリアル
At the "2024 YOKOHAMA Automotive Technology Exhibition," we will be showcasing Yamashita Material Co., Ltd.'s high-current flexible circuit board "BigElec" at Daitron Co., Ltd.'s exhibition booth. This exhibition is one of the largest automotive technology exhibitions in Japan, presenting the latest technologies and products to the world. Dates: From May 22 (Wednesday) to May 24 (Friday), 2024 Venue: Pacifico Yokohama Exhibition Booth: 299 (within Daitron's exhibition booth) This is a valuable opportunity to experience innovative technologies. We hope you will stop by when you visit. For more details about the exhibition, please refer to the following URL: https://www.daitron.co.jp/news/2024/04/expo_aee-yokohama2024.html
Date and time Wednesday, May 22, 2024 ~ Friday, May 24, 2024
10:00 AM ~ 06:00 PM
(Only on the final day from 9:00 to 16:00)
Capital 【Venue】 Pacifico Yokohama 【Booth Number】 299 (Daitron Co., Ltd. Exhibition Booth) 【Access by Train】 1. Take the Minatomirai Line (direct from Tokyu Toyoko Line and Fukutoshin Line) to Minatomirai Station. It is about a 5-minute walk from Minatomirai Station to Pacifico Yokohama. 2. Take the JR Keihin Tohoku Line or Yokohama City Subway to Sakuragicho Station. It is about a 12-minute walk from Sakuragicho Station to Pacifico Yokohama. 【Access by Car】 It is about a 2-minute drive from the "Minatomirai" ramp on the Kanagawa Route 1 of the Metropolitan Expressway. Due to heavy congestion in nearby parking areas during the exhibition, we recommend using public transportation.
Entry fee Free
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flyer_2024.5_aee.expo.pdf[2156297]

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High Current Compatible Flexible Circuit Board BigElec

The Big Elec flexible circuit board compatible with high current has three features.

Big Elec is a flexible circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-section. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high-current electronic components. Big Elec's low inductance reduces voltage spikes, contributing to the reliability of high-current electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible circuit boards. 【Feature 3】 High Design Freedom It ensures the same design freedom and usability as printed circuit boards. Pattern wiring and external shapes can be customized to meet specific requirements. It also supports the mounting of electronic components and connectors using paste solder.

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キャプチャ.JPG

High Current Compatible Flexible Circuit Board BigElec

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

Big Elec is a flexible printed circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-sectional area. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high current-compatible electronic components. The low inductance of Big Elec reduces voltage spikes, contributing to the reliability of high current-compatible electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible printed circuit boards. 【Feature 3】 High Design Freedom It ensures design freedom and usability similar to printed circuit boards. Pattern wiring and external shapes can be customized according to requirements. It also supports the mounting of electronic components and connectors using paste solder.

  • Harness

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BigElec実装写真?.jpg

Big Elec SMT Connect (High Current FPC Shunt Specification)

Flexible substrate that bends freely and supports high current! Easily connects in tight spaces! Big Elec SMT Connect.

Attention all users of electric wires, wire harnesses, busbars, and bus bars! "Big Elec SMT Connect" (High Current FPC Surface Mount Connector Split Specification) is a compact flexible circuit board that allows for high current wiring even in extremely small spaces, thanks to its flat shape. It can be offered as a solution that significantly enhances design flexibility. The highly flexible circuit board allows for component mounting and can be used in bent configurations, making installation in tight spaces easy. Furthermore, its thinness contributes to space-saving. We propose an excellent high current wiring solution. Please give Big Elec SMT Connect a try!

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Big Elec SMT Connect (High Current FPC Shunt Specification)

Big Elec SMT Connect (High Current FPC Shunt Specification)

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High Current Compatible FPC BigElec

High Current Compatible FPC BigElec

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[Free Webinar] Introduction to "Environmentally Resistant Remote I/O" that can be installed in outdoor and harsh environments - A comprehensive introduction to all 23 types with wide temperature support, noise resistance, Ethernet, and RS-485 compatibility.

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In recent years, the implementation of maintenance DX to achieve "non-stop factories" has become an urgent necessity in manufacturing sites. Amid the trend of factory IoT and data utilization, the use of remote I/O, which can remotely aggregate and collect sensor information and control signals from equipment and sensors dispersed inside and outside the factory, is gaining importance as a foundation for predictive maintenance and condition monitoring. On the other hand, the installation environment for remote I/O is not necessarily limited to control panels or well-conditioned factory interiors. There is an increasing need to collect data in harsh environments, such as outdoor equipment and conditions involving high temperatures, low temperatures, vibrations, and strong electrical noise. Conventional remote I/O systems have struggled to operate stably under such conditions, requiring measures like installation location constraints and additional protective enclosures. Environmentally robust remote I/O with wide temperature support and noise resistance can address these challenges, enabling the expansion of the scope of factory IoT and predictive maintenance to outdoor and remote equipment. In this seminar, we will introduce the lineup of Contec's environmentally robust remote I/O, the "CONPROSYS(R) Robust I/O Series," which includes a total of 23 products.

Sep 06, 2025

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[Seminar] Corporate Investment in Accelerating Green Infrastructure

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[Speaker] Miyamoto Mariko, Senior Researcher, Public Policy Research Department, SOMPO Institute Plus Inc. [Lecture Items] 1. Overview and Latest Trends of Green Infrastructure (1) Background of Growing Attention and Market Expansion Outlook (2) Current Situation and Challenges for Promotion 2. Economic Effects of Green Infrastructure (1) Domestic Examples (Parks, Road Facilities, etc.) (2) International Examples 3. Evaluation and Certification Systems (1) Systems Related to Buildings (2) Systems Related to Sites and Urban Spaces 4. Financing Methods for Green Infrastructure (1) PPP/PFI (2) Sustainable Finance 5. Q&A / Business Card Exchange

Sep 06, 2025

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[Seminar] Overview of Drone Flight Path Utilization and Legal Issues

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[Lecturers] Nishimura & Asahi Law Offices, Foreign Law Joint Enterprise Attorney and Associate Iku Akamatsu Attorney and Associate Yasukazu Yamazaki (Note: "Saki" is a variant character) [Key Lecture Content] In the logistics sector and other areas, discussions are underway regarding the social implementation of drone flight routes. Drone flight routes involve various stakeholders, including drone route operators, drone operation businesses, surrounding municipalities, and ground-related parties, who collaborate and divide roles to realize these routes. Therefore, drone route operators and businesses utilizing drone routes need to enter into contracts regarding the use of drone routes with relevant parties, clarify roles, and implement appropriate risk management. This lecture will explain the legal points that must be considered when entering into contracts for the use of drone flight routes. [Lecture Items] 1. Overview of drone flight routes and recent examination status 2. Stakeholders and their roles related to drone flight routes 3. Items to consider specifying in contracts for the use of drone flight routes 4. Legal points to be aware of in contracts for the use of drone flight routes 5. Q&A / Business card exchange

Sep 06, 2025

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[Seminar] The Potential for Business Transformation Surrounding the Expanding Blue Economy

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[Speaker] Keiichi Koga, Senior Development Manager, Innovation Strategy Center, Japan Research Institute, Ltd. [Key Lecture Content] After the transition to the Trump administration, significant changes have emerged in the global business environment concerning the oceans, particularly regarding decarbonization and nature conservation. On the other hand, considering the accumulation of knowledge and shared understanding of the realities of the marine environment, what growth strategies should companies outline? In the financial sector, which is focusing on the expansion of the blue economy, there is a growing recognition that advancing nature-positive businesses can lead to sustainable corporate value enhancement. The sectors related to the ocean encompass not only fisheries and shipping but also a wide range of areas such as water pollution, plastic waste, tourism, and energy-related industries. This lecture will discuss the seeds for considering how businesses can transform. [Lecture Items] 1. The Blue Economy so far 2. International Trends 3. Financing Trends related to the Blue Economy 4. Directions for Business Transformation based on the Blue Economy 5. Case Studies 6. Q&A / Business Card Exchange

Sep 06, 2025

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[Seminar] Know-how for Overseas Market Research and Information Gathering Using AI

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[Speaker] Daisuke Imaizumi, President and CEO, Infra Commons Inc. [Key Lecture Content] When companies expand their overseas operations, obtaining reliable market research and regulatory information is essential. However, reliance on traditional paid databases and specialized research firms has become a significant burden in terms of both cost and time. This seminar will introduce a new approach to overseas market research using generative AI. Specifically, we will cover a wide range of use cases, including understanding the distribution structure of niche markets, extracting key points from financial reports and research materials, collecting and summarizing information in local languages, exploring potential M&A candidates and investment trends, organizing key points of EU regulations, monitoring trends by industry and country, and understanding trends in defense and geopolitical risks. For each theme, we will specifically explain the selection of information sources, efficient research procedures utilizing generative AI, and methods for verifying sources, allowing participants to gain insights that they can immediately apply to their own work. This content is ideal for those who regularly handle overseas information in areas such as corporate planning, overseas business, new business development, and research departments. [Lecture Items] 1. Introduction 2. Utilization methods by use case 3. Summary and points to note 4. Q&A

Sep 06, 2025

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