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  6. High Current Compatible Flexible Circuit Board BigElec

High Current Compatible Flexible Circuit Board BigElec

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last updated:Oct 14, 2024

山下マテリアル
山下マテリアル
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The Big Elec flexible circuit board compatible with high current has three features.

Big Elec is a flexible circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-section. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high-current electronic components. Big Elec's low inductance reduces voltage spikes, contributing to the reliability of high-current electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible circuit boards. 【Feature 3】 High Design Freedom It ensures the same design freedom and usability as printed circuit boards. Pattern wiring and external shapes can be customized to meet specific requirements. It also supports the mounting of electronic components and connectors using paste solder.

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写真(2端子:プロ写真).jpg

High Current Compatible Flexible Circuit Board BigElec

写真(2端子:プロ写真).jpg
写真(2端子:プロ写真).jpg 写真(1端子ジャバラ:開き状態).jpg 写真(2端子:スクリュ写真).png 写真(2端子ジャバラ:開き状態).jpg 写真(1端子ジャバラ:開き状態)2.JPG bigelec_test-1920x885.png bigelec_resolt-1920x733.png
  • Related Link - https://www.yamashita-net.co.jp/lp/
  • Special site - Product/service details - https://pr.mono.ipros.com/yamashita-net/product/

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basic information

Maximum current value: 10A to 100A Maximum dimensions: 480mm × 200mm Supported layers: 2 layers to 8 layers Conductor thickness per layer: up to 100μm thick

Price range

P3

Delivery Time

P4

※The price and delivery time will vary depending on the structure, quantity, and specifications.

Applications/Examples of results

【Intended Use】 Secondary batteries Linear/round motors Internal wiring for power supplies 【Track Record】 Semiconductor testing equipment Fiber optic fusion splicer Line lighting Ultrashort pulse lasers Inverters

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High Current Compatible FPC BigElec

High Current Compatible FPC BigElec

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News about this product(6)

【May 21, 2025 - May 23, 2025】Automotive Technology Exhibition 2025 YOKOHAMA: Displaying the high-current flexible circuit board "BigElec" at the booth of Daitron Co., Ltd.

  • Seminar・Event

At the "2025 YOKOHAMA Automotive Technology Exhibition," we will be showcasing Yamashita Material Co., Ltd.'s high-current flexible circuit board "BigElec" at Daitron Co., Ltd.'s exhibition booth. This exhibition is one of the largest automotive technology exhibitions in Japan, presenting the latest technologies and products to the world. Dates: May 21 (Wednesday) to May 23 (Friday), 2024 Venue: Pacifico Yokohama Exhibition Booth: 398 (within Daitron's exhibition booth) This is a valuable opportunity to experience innovative technologies. We encourage you to stop by when you visit. For more details about the exhibition, please refer to the following URL: https://www.daitron.co.jp/news/2025/04/expo_aee-yokohama2025.html

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Notice of Yamashita Material's participation in KIMES 2025 (Booth Number: D730) from March 20 to March 23, 2025.

  • Seminar・Event

At the "KIMES2025" exhibition booth of Daitron Korea Co., Ltd., we will be showcasing Yamashita Material Co., Ltd.'s SAP-FPC, All-LCP, long FPC, and more. This exhibition is one of the largest medical device and healthcare technology exhibitions in Korea. Dates: March 20 to March 23, 2025 Venue: COEX (Seoul, Korea) Exhibition Booth: D730 (within the Daitron Korea booth) In addition to the above, we plan to display various other samples, so please come and experience them at the venue. We sincerely look forward to your visit. For more details about the exhibition, please refer to the following URL: https://www.kimes.kr/eng/exhibitor/detail/2148798972_2025_kor

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Notice of Yamashita Material's participation in SEMICON Japan 2024 (Booth Number: 3436) from December 11 to December 13, 2024.

  • Seminar・Event

Thank you very much for your continued support. This is the Sales Department of Yamashita Material Co., Ltd., Circutec Division. We will be exhibiting at SEMICON Japan 2024 from December 11 (Wednesday) to December 13 (Friday). You will be able to see examples and samples of solutions using flexible substrates. We would be grateful if you could stop by the Yamashita Material booth during your visit. *Exhibition Overview* SEMICON Japan 2024 - Dates: December 11 (Wednesday) to December 13 (Friday), 2024 - Venue: Tokyo Big Sight, East Exhibition Hall, East 3 Hall - Booth Number: 3436 *An entry badge is required for admission to the exhibition. Please register in advance on the website linked below and print out your entry badge before your visit.* [Main Exhibits] - Long-term high-temperature durable FPC - Low-loss FPC - Big Elec (high current FPC) We understand you may be busy, but we sincerely look forward to your visit.

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【May 22, 2024 - May 24, 2024】Automotive Technology Exhibition 2024 YOKOHAMA: Displaying the high-current flexible substrate "BigElec" at the booth of Daitron Co., Ltd.

  • Seminar・Event

At the "2024 YOKOHAMA Automotive Technology Exhibition," we will be showcasing Yamashita Material Co., Ltd.'s high-current flexible circuit board "BigElec" at Daitron Co., Ltd.'s exhibition booth. This exhibition is one of the largest automotive technology exhibitions in Japan, presenting the latest technologies and products to the world. Dates: From May 22 (Wednesday) to May 24 (Friday), 2024 Venue: Pacifico Yokohama Exhibition Booth: 299 (within Daitron's exhibition booth) This is a valuable opportunity to experience innovative technologies. We hope you will stop by when you visit. For more details about the exhibition, please refer to the following URL: https://www.daitron.co.jp/news/2024/04/expo_aee-yokohama2024.html

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山下マテリアル

山下マテリアル

Electronic Components and Semiconductors

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We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.

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