MES2024 34th Microelectronics Symposium Exhibition Booth Participation Information

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

We have completely revamped the platform compared to the conventional model, increasing the probe movement speed by up to 50% and dramatically improving contact position accuracy. With a new high-precision, wide-range measurement system that offers great flexibility and a groundbreaking 4-head 6-flying probe mechanism, we can significantly reduce inspection costs and enhance quality in the assembly process, regardless of substrate variety or production volume. ★You can bring your own substrates for evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch★ We can conduct a series of tests, including creating inspection programs, inspecting using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Circuit Board Inspection Equipment

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class industry level. (Supported board size for inspection: up to 985×610)

The APT-1340J maintains its basic performance while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 10kg, making it suitable for inspecting boards used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★You can bring your boards to our demo room at our Okayama headquarters for evaluation tests★ We can conduct a series of tests including creating inspection programs, inspecting actual boards, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below. *For product information, please download the PDF or feel free to contact us.*

• Circuit Board Inspection Equipment

This is a flagship model that arranges probe heads on both the top and bottom, enabling simultaneous in-circuit testing of the front and back of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in its category. By using the flying probes on both the top and bottom simultaneously, a combination inspection with up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★ You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing ★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Circuit Board Inspection Equipment

The probe head is arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

The simultaneous use of upper and lower flying probes enables a combination inspection of up to 6 probes, allowing for the inspection of components that can make contact at both points on the top and bottom of the substrate. This model boasts world-class standards in speed and positioning accuracy while expanding the compatible substrate size to W635×D610mm. Furthermore, by adding an optional split inspection function, it is capable of inspecting long substrates up to W985×D610mm. It can accommodate component heights of up to 60mm and substrate weights of up to 10kg, making it suitable for inspecting substrates used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★Evaluation tests can be conducted by bringing your substrates to the demo room at our Okayama headquarters★ The entire process from creating inspection programs, inspecting using actual substrates, to summarizing evaluation results can be tested in a single flow. If you are interested, please apply through the 'Contact Us' section below.

• Circuit Board Inspection Equipment

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with a flying probe tester excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires specialized fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures to connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors) by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

• Circuit Board Inspection Equipment

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

Our company will be exhibiting at the "13th Chubu Lifeguard TECH 2025 - Disaster Prevention, Mitigation, and Crisis Management Exhibition" held at Port Messe Nagoya. This exhibition aims to build a resilient society that can confront the next major disaster, showcasing products, technologies, and services that contribute to "disaster prevention, mitigation, and crisis management." It also seeks to enhance the disaster response capabilities and crisis management abilities of businesses and society, promote related industries, and contribute to the formation of a safer society, in cooperation with the Nankai Trough Earthquake Countermeasure Chubu Region Strategy Conference. At our booth, we plan to display actual NMG generators and controllers. We sincerely look forward to your visit.

[Speaker] Hajime Hiraki, CEO of Chemistry Cube Co., Ltd., Innovation Consultant [Key Lecture Content] Until now, in many companies, managers who operate and manage organizations and specialists in specific technical fields have been established as the career paths for engineers and researchers. However, as uncertainty increases, there is a growing demand for value creation capabilities that anticipate societal challenges and customer needs and generate innovation. In this context, the importance of a new career path, "Technical Leader," distinct from traditional managers and specialists, is on the rise. In this lecture, we will focus on the "Technical Leader," who plays a central role in value creation centered on technology, and explain their role, the required abilities, and the approach to their development, using case studies. [Lecture Items] 1. The Era of Technical Leaders 2. What is a Technical Leader? 3. Practicing Technical Leadership - Management Techniques for Technical Leaders 4. Development of Technical Leaders 5. Q&A / Business Card Exchange

[Lecture Topics] 1. Smart City Policies by the Cabinet Office Yusuke Nakamura, Planning Officer, Cabinet Office, Science and Technology Innovation Promotion Secretariat 1. Policy Positioning of Smart Cities 2. Smart City Policies of the Cabinet Office 3. Revision of SCRA 4. Q&A / Business Card Exchange 2. Digital Policies of the Ministry of Internal Affairs and Communications Promoting Community DX Tatsuhiko Saruta, Deputy Director (Smart City and Subsidy Projects), Digital Economy Promotion Office, Information and Communications Bureau, Ministry of Internal Affairs and Communications 1. Current Status and Challenges of Local Communities 2. Expected Roles of Digital Technology and Strategies for Problem Solving 3. Status of Initiatives in FY R7 by the Ministry of Internal Affairs and Communications 4. Future Initiatives 5. Q&A / Business Card Exchange 3. Initiatives for Promoting Smart Cities by the Ministry of Land, Infrastructure, Transport and Tourism Masahiro Kobayashi, Planning Specialist, Digital Information Utilization Promotion Office, International and Digital Policy Division, Urban Bureau, Ministry of Land, Infrastructure, Transport and Tourism 1. Initiatives to Promote the Spread of Smart Cities 2. Urban Development DX and Project PLATEAU 3. Q&A / Business Card Exchange

[Speaker] Toru Kumagai, Journalist from Germany [Lecture Topics] 1. The German government holds a summit meeting to support the automotive industry 2. Will the EU change the ban on new internal combustion engine vehicle sales by 2035? 3. The main players at the Munich Auto Show IAA Mobility are China and BEVs 4. The strategy of Chinese OEMs steadily expanding their foothold in Europe 5. Reasons for the recovery of new BEV registrations in Europe by 2025 6. Is the hollowing out of the German automotive industry progressing due to Trump tariffs? 7. Q&A