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High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.

Lambda2 is a new standard model of high-precision die bonder and flip chip bonder that achieves a mounting accuracy of 0.5 microns, despite its compact desktop size. It supports both face-down (flip chip) and face-up methods, and is capable of flexibly accommodating various bonding technologies, including thermal compression, ultrasonic, adhesive methods, and UV curing. The software is also developed in-house, allowing for intuitive and easy editing of detailed parameters and profiles, significantly reducing the time required for product and process development. With its high performance and compact desktop size, it offers a very user-friendly scale for equipment installation, and with future expandability through a modular system, it represents a highly cost-effective model. Lambda2 is a new standard model from Fine Tech, a German manufacturer specializing in die bonders, which has poured its unique know-how into it. The ultra-high precision and usability achieved through its unique design philosophy are unmatched by other manufacturers. For more details, please refer to the PDF materials or feel free to contact us.

• Bonding Equipment

Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.

The "pico 2" is a multipurpose die bonder with a mounting accuracy within 3μm. With quick setup and easy operation, it is suitable for rapid and flexible product development and prototyping in corporate laboratories and universities. Additionally, thanks to its modular design philosophy, new functions can be added even after the equipment has been installed, allowing for easy integration throughout the equipment's lifespan. 【Features】 ■ Compact tabletop die bonder ideal for prototyping and research and development ■ Simple operation for alignment using a unique vision alignment system ■ Supports various mounting processes such as thermocompression, soldering, ultrasonic, and adhesive ■ Integrated process control (heat, temperature, load, etc.) via IPM commands ■ Accommodates a wide range of component sizes (0.05mm to 100mm) ■ Cost-effective equipment configuration through a modular system *For more details, please refer to the PDF document or feel free to contact us.

• Bonding Equipment

The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders, encompassing high precision and high functionality.

The model name sigma of the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N in a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, accommodating MEMS/MOEMS assembly, bonding of image sensors, and chip packaging at the wafer level. FINEPLACER sigma is a model designed for development applications that support assembly technologies aimed at the future, catering to a variety of technologies and applications.

• Bonding Equipment

Fully automatic high-precision die bonding machine

The model name femto2 from the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.3μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely shields against external influences, achieving a top-class yield and a stable assembly process. *For more details, please download the PDF or contact us.*

• Other semiconductor manufacturing equipment

[Speaker] Tadahiro Maruyama, Director of the Business Creation Division, Chubu Electric Power Co., Inc. (Also Deputy COO of Chuden Telemetering LLC) [Key Lecture Content] Chubu Electric Power is expanding telemetering through a smart meter communication network to gas and water services. In the next phase, we aim to integrate these accumulated data into a multi-infrastructure DX business, merging with energy and water services, and striving for a circular and sustainable community across our entire group. This time, I will explain the actual initiatives related to these efforts. [Lecture Items] 1. Automatic Meter Reading by Chubu Electric Power 2. Current Status of Chubu Electric Power's Telemetry Business 3. Business Transformation through Infrastructure DX in the Electric Power Sector 4. Horizontal Expansion of Infrastructure DX to Water Services 5. Smart City Services through Data Utilization 6. Q&A / Business Card Exchange

[Speaker] Daihei Yamamoto, CEO of F6 Design, Inc. Strategic Consultant / Data Scientist [Lecture Topics] 1. Why is it difficult for "self-driven talent" to emerge from Japanese workplaces? 2. Shifting to a "non-teaching teaching method" - How to change interactions with subordinates 3. Strengthening communication skills through WHI (Why-How-If) 4. Creating an environment that allows for "safe failures" and systems that support self-drive 5. Q&A

To learn more about solar cells, to understand measurement methods, to acquire know-how related to measurements, and to actually try using measuring instruments, we have established a "PV Technical Center" on our headquarters premises, which also serves as a showroom. This center provides support services in the field of measurements for solar power generation, addressing various questions and requests from customers. At the PV Technical Center, we hold PV seminars (free of charge). Please apply through the detailed application URL provided.

In recent years, many people have been facing the challenge of "how to ensure retention and quickly turn new employees into productive members" due to the difficulty in hiring new graduates and the diversification of the environment and values in which young employees have grown. In this seminar, we will introduce some key points of "OJT Leader Development" from the training of the public course "OJT Leader Development Course" scheduled for March next year, based on the know-how cultivated in actual OJT leader training. We will share points that can be immediately practiced in the field, and we look forward to your enthusiastic participation! *Please apply through our company website below. *We have prepared two dates. Please choose a date that is convenient for you. Date: December 17, 2025 (Wednesday) 12:00 PM - 1:00 PM Format: Zoom Webinar Cost: Free Application Deadline: December 15 (Monday) Capacity: 50 people *Registration will close once the capacity is reached. [Content] - Positive role recognition - Understanding the environment and values that have developed - Imagining the "ideal self" as an OJT leader - Skill set for development and more.

In recent years, many people have been facing the challenge of "how to ensure retention and quickly turn new employees into productive members" due to the difficulty in hiring new graduates and the diversification of the environment and values in which young employees have grown. In this seminar, we will introduce some key points of "OJT Leader Development," which is part of the public course "OJT Leader Development Course" scheduled for March next year, based on the know-how cultivated in actual OJT leader training. We will share points that can be immediately applied in the field, and we look forward to your enthusiastic participation! *Please apply through our company website below. *We have prepared two days for the schedule. Please choose a date that works best for you. Date: December 18, 2025 (Thursday) 14:00–15:00 Format: Zoom Webinar Cost: Free Application Deadline: December 15 (Monday) Capacity: 50 people *Registration will close as soon as we reach capacity. [Content] - Positive role recognition - Understanding the environment and values that have developed - Visualizing the "ideal self" as an OJT leader - Skill set for development and more.