Thank you for attending: Nepco Japan 2024 Autumn @ Makuhari Messe, September 4-6.

High-precision die bonder compatible with submicron technology. Compact tabletop model for prototyping, small-scale production, and research and development purposes.

Lambda2 is a new standard model of high-precision die bonder and flip chip bonder that achieves a mounting accuracy of 0.5 microns, despite its compact desktop size. It supports both face-down (flip chip) and face-up methods, and is capable of flexibly accommodating various bonding technologies, including thermal compression, ultrasonic, adhesive methods, and UV curing. The software is also developed in-house, allowing for intuitive and easy editing of detailed parameters and profiles, significantly reducing the time required for product and process development. With its high performance and compact desktop size, it offers a very user-friendly scale for equipment installation, and with future expandability through a modular system, it represents a highly cost-effective model. Lambda2 is a new standard model from Fine Tech, a German manufacturer specializing in die bonders, which has poured its unique know-how into it. The ultra-high precision and usability achieved through its unique design philosophy are unmatched by other manufacturers. For more details, please refer to the PDF materials or feel free to contact us.

• Bonding Equipment

Compatible with various assembly processes such as adhesives, soldering, heat pressing, and ultrasonic methods! Suitable for rapid and flexible product development and prototype creation.

The "pico 2" is a multipurpose die bonder with a mounting accuracy within 3μm. With quick setup and easy operation, it is suitable for rapid and flexible product development and prototyping in corporate laboratories and universities. Additionally, thanks to its modular design philosophy, new functions can be added even after the equipment has been installed, allowing for easy integration throughout the equipment's lifespan. 【Features】 ■ Compact tabletop die bonder ideal for prototyping and research and development ■ Simple operation for alignment using a unique vision alignment system ■ Supports various mounting processes such as thermocompression, soldering, ultrasonic, and adhesive ■ Integrated process control (heat, temperature, load, etc.) via IPM commands ■ Accommodates a wide range of component sizes (0.05mm to 100mm) ■ Cost-effective equipment configuration through a modular system *For more details, please refer to the PDF document or feel free to contact us.

• Bonding Equipment

The FINEPLACER sigma is the top model of semi-automatic flip chip bonders/die bonders, encompassing high precision and high functionality.

The model name sigma of the "FINEPLACER series" has achieved sub-micron level placement accuracy and bonding loads of up to 1000N in a 300mm working area. It adapts to various die bonding methods and high-precision flip chip technology, accommodating MEMS/MOEMS assembly, bonding of image sensors, and chip packaging at the wafer level. FINEPLACER sigma is a model designed for development applications that support assembly technologies aimed at the future, catering to a variety of technologies and applications.

• Bonding Equipment

Fully automatic high-precision die bonding machine

The model name femto2 from the "FINEPLACER series" is a fully automatic high-precision die bonder with a mounting accuracy of 0.3μm@3sigma. With its equipment enclosure, it operates in a completely controlled environment, catering to demanding applications. The system completely shields against external influences, achieving a top-class yield and a stable assembly process. *For more details, please download the PDF or contact us.*

• Other semiconductor manufacturing equipment

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

When conducting structural analysis of organic compounds, IR, NMR, and MS can be considered the three sacred treasures. If the analysis is performed correctly, it is possible to elucidate the structure of even quite complex compounds. However, actual spectra are often not of a single compound, as seen in textbooks, which can lead to significant challenges in interpreting results for beginners in analysis. Additionally, while database searches are a useful tool in structural analysis, the ability to read spectra is necessary to select the correct structure from among the candidates, not just pattern matching. In this course, we will lecture on the basic ways to interpret IR, NMR, and MS spectra, including simple explanations of principles, points to be aware of during analysis, and how to proceed with actual analysis, incorporating some exercises as well.

◆Mechatrotech Japan 2025 —◆ Troax Safety Systems Co., Ltd. will be exhibiting at "Mechatrotech Japan 2025." ■ When it comes to steel safety fences, think "TROAX" - We will showcase steel safety fences used around robots, equipment, and conveyor lines. ■ The safety guard "FlexGuard" absorbs impact with flexible materials and boasts excellent durability - This safety guard ensures the safety of workers in environments where people and "machines/vehicles" interact, such as manufacturing sites, truck areas, and packing areas. At our booth, our staff will be available to answer various questions and address challenges related to products and safety measures on-site. We sincerely look forward to your visit.

Luminex Japan Co., Ltd. will exhibit at the 33rd Annual Meeting of the Japanese Society for Organ Transplantation, held at Nagasaki University from October 3 (Friday) to October 5 (Sunday). Please feel free to consult us at our booth regarding any questions about Luminex systems. We would also love to hear your feedback and requests!

[Speaker] Yuri Ishii, Deputy Director, Environmental Economics Division, Minister's Secretariat, Ministry of the Environment [Key Lecture Content] This guide has been created with the intention of assisting companies in responding to the increasing demands for disclosure in various environmental fields, such as climate change and natural capital, and was published in June of the 7th year of Reiwa. The "integrated approach" introduced in this guide suggests that companies should not respond individually to the disclosure requirements in each environmental field, but rather engage with an awareness of their interconnections. Through this initiative, we aim to improve business processes under management involvement, effectively and efficiently address various environmental issues, and facilitate disclosure. The key points of the guide will be explained. [Lecture Items] 1. Expansion of environmental issues to be addressed 2. Significance of integrated initiatives and disclosure 3. Trends in sustainability-related information disclosure 4. Methods and benefits of integrated initiatives and disclosure; case studies of companies 5. Utilization of environmental due diligence for information disclosure 6. Q&A / Business card exchange