Photonix Tokyo 2024: Light and Laser Technology Exhibition

Area sensor for internal defect inspection after welding as a substitute for X-rays, with over 15,000 units of monitoring systems during welding in operation.

1. Area sensor for internal defect inspection in welding - Field sensor Capable of simultaneous measurement of 110,000 points with image output. Replaces electron microscopes that require X-ray, CT scans, and work cuts. 2. Non-contact thickness measurement sensor for opaque materials - Enovasense Capable of measuring the thickness of resins, coatings, and metal coatings. Measurement range is 10nm to 1mm, with a measurement speed of 1 second or more, and measurement variation is approximately 0.5% to 3%. 3. Line camera for burr inspection after battery foil cutting - CVC A line camera with a maximum of 100kHz, capable of inline burr detection. 4. Insulation layer thickness measurement sensor - FSS Measures the thickness profile of battery insulation layers inline with a resolution of a few nm. 5. Dual point sensor for electrode thickness measurement - DPS Enables high-precision thickness measurement with a distance sensor of a few nm resolution. ■ Others 6. Line sensor for 3D shape measurement of battery can welds - CLS 7. - LWM

• Defect Inspection Equipment

High-speed opaque film thickness mapping and area detection of internal defects using a laser photothermal sensor.

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. This new product is an area sensor that can simultaneously measure approximately 110,000 points, unlike conventional single-point sensors. It can detect not only the thickness mapping of opaque materials but also the presence of defects, chips, and delaminations beneath the surface layer. ■ Features - Non-contact measurement of the following: ☆ Thickness mapping of opaque materials ☆ Detection of defects beneath opaque surface material layers No destructive testing is required. - As an area sensor, it can measure approximately 110,000 points simultaneously in one second. - It can also be applied to detect defects in areas such as welds, where conventional X-ray or CT scans are typically required. - Measurement is possible with various combinations of materials, regardless of the base material. ■ Applications Automotive industry, aerospace industry, consumer goods, industrial products, medical industry, semiconductor field. It can be used in various applications such as coating thickness, metal plating thickness, paint films, and welds. *For more details, please check the PDF download or contact us.

• Defect Inspection Equipment

It is possible to obtain the quality assessment results of the product simultaneously with the completion of laser welding. It is equipped with a user-friendly GUI that facilitates easy operations such as data linking, review, and analysis.

■ Monitoring plasma light, radiation temperature, and laser reflection light during laser welding to determine product quality. ■ The software used for judgment and analysis has improved its judgment capability, performance, and functionality through over 20 years of sales experience and customer feedback. ■ Easy to add not only to new equipment but also to existing equipment. ■ Proven track record as an inspection device for various laser welding applications in the automotive industry, EVs, home appliances, and more. We have demo units available and look forward to your inquiries. Whether you are familiar with the previous LWM or are trying it for the first time, we encourage you to experience the latest LWM.

• Welding Machine

Introducing the measurement principles of each sensor, corresponding sensors, product information, and ease of use!

This document introduces the performance of various sensors for component inspection handled by PreciTech Japan Co., Ltd. It includes the measurement principles, compatible sensors, and ease of use for each sensor, such as the "Chromatic Aberration Confocal Single Point Sensor" and "Optical Point Sensor." Our company provides intelligent and reliable solutions for laser material processing and optical measurement technology. [Overview] ■ Measurement with the Chromatic Aberration Confocal Single Point Sensor ■ Shape and thickness measurement inspection with the Chromatic Aberration Line Sensor ■ Quality control of welding ■ Area scan measurement of thickness, flatness, and shape in specified areas *For more details, please refer to the PDF document or feel free to contact us.

• Sensors
• Welding Machine

For high-precision thickness measurement of opaque materials, Enovasense's laser photo-thermal sensor can measure thickness from a minimum of 10nm, regardless of the material.

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. ■Features - Non-contact measurement of the thickness of opaque materials is possible, eliminating the need for destructive testing. - A wide measurement range from a minimum of 10nm to a maximum of 1mm. - High precision measurements of 0.5% to 3% or less are achievable, recommended for those lacking accuracy. - Capable of measuring various combinations of materials regardless of the base material. ■Applications Used in a wide range of fields including the automotive industry, aerospace industry, consumer goods, industrial products, medical industry, and semiconductors, for various applications such as coating thickness, metal plating thickness, and paint film thickness. *Currently, Enovasense is a group company of the German optical sensor manufacturer Precitec. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Coating thickness gauge

Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

The "CHROCODILE CLS2" and "CHROCODILE CLS2 PRO" can achieve non-contact high-speed three-dimensional shape measurement at a maximum of 48 million points per second (standard is 16.8 million points per second). The resolution is also extremely high, with a maximum of Y1um and Z0.025um, allowing for very precise measurements. Compared to previous generations, there has been a significant reduction in measurement time, and improvements have been made for high NA and increased light volume suitable for wafer edges, wire bonding, and micro bump measurements. There are numerous applications including shape, surface roughness, step height (thickness), flatness, and TTV. It is suitable not only as a tabletop device but also for use as a sensor for in-situ, monitoring, and inline equipment integration. 【Features】 - Three-dimensional shape measurement over a wide area Maximum line width of 20mm - Wide tolerance angle Can accommodate ±53° on reflective surfaces, suitable for edges and steep slopes - Contributes to reduced development costs and shortened development lead times, with a compact unit and a software development kit for equipment integration (such as DLLs) also available - Rich track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field *For more details, please refer to the documentation.

• 3D measuring device

High-speed area scanning unaffected by vibrations. For online, offline, quality control, and wafer inspection applications.

The "Flying Spot Scanner" is an optical measuring device that can perform wide-area scans (up to φ80) using XY2-axis galvanometer mirrors. Since stage scanning is not required, there is no influence from vibrations of the stage. Thanks to the principle of spectral interference, it can measure thickness, dimensional shapes, and inspect surface defects. Additionally, because the incident and reflected light are in a coaxial optical system, good results can be obtained even on glossy surfaces. 【Features】 ■ Wide-area scanning ~φ80mm ■ High resolution XY 6.5μm~, Z 1nm~ Minimum beam spot diameter 13μm, high Z resolution due to spectral interference method ■ No XY stage required, no stage vibrations Area scanning using galvanometer mirrors ■ Reduced development costs and shortened development lead times Software development kit (DLL, etc.) available for device integration ■ Applications Thickness measurement of glass substrates for FPD and LCD, measurement of wafer warp (distortion), lens shape inspection, PCB board shape inspection, height measurement of small precision parts, etc. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Other inspection equipment and devices
• Optical Measuring Instruments

This is a high-speed, high-precision line camera for inline appearance inspection, also suitable for wafer inspection applications.

The "CHRomatic Vision Camera" is a line camera for high-speed appearance inspection. Utilizing the principle of chromatic aberration confocal, it has a wide depth of field of up to 3mm. Focusing is unnecessary, allowing for high-contrast images to be captured even on uneven surfaces. It can obtain two-dimensional images. Additionally, with a high-speed scan of up to 140kHz, inline appearance inspection (for shape defects such as cracks and scratches, as well as foreign object inspection) is possible. 【Features】 ■ High resolution XY 0.9um~2.9um (the 3mm depth of field type is 2.9um) ■ High contrast for various materials ■ High speed and resistant to vibration ■ Contributes to reduced development costs and shortened development lead times, with a software development kit (DLL, etc.) available for device integration. Interfaces such as CameraLink and GigE are supported. ■ Proven results in appearance inspection for semiconductors, consumer electronics, and glass. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Sensors
• Optical Measuring Instruments

We will be holding the second webinar on aluminum foil, which received great acclaim last time. This is an opportunity to deepen your knowledge about aluminum foil, so please join us. 【Webinar Details】 Content: Introduction to the Manufacturing Methods and Functional Aluminum Foils vol.2 Date: February 20 (Friday) Time: 15:00 - 16:00 Participation Fee: Free How to Participate: A Zoom viewing URL will be sent to those who register by the day before. Capacity: 100 people 【Recommended for the Following Individuals】 - Those who have challenges related to metal foils or resin films - Those interested in joint research with foil manufacturers or new business development - Those interested in functional aluminum foils with high smoothness, high corrosion resistance, high strength, and luxurious designs ▼ Register here (Microsoft Forms) https://forms.cloud.microsoft/r/UA5g4N2fGU (dummy) ▼ If you have any further questions, please contact us at the email address below. foil-marketing@toyal.co.jp

This is a seminar introducing the new features of the latest version, Ver. 30, of the general-purpose 2D CAD system "EASYDRAW." Customers currently using EASYDRAW can achieve further efficiency and utilize convenient features by taking advantage of the new functionalities, so we encourage you to consider attending this seminar.

In aerospace, automotive, and other fields, rapid advancements in material development and manufacturing technology are being made to achieve further weight reduction aimed at improving fuel efficiency and reducing carbon dioxide emissions. This seminar will provide an easy-to-understand explanation for beginners about the trends in new material development at advanced companies that are energetically working towards ultra-lightweight solutions using lightweight materials such as carbon fiber, aluminum, and ceramics, as well as various additive manufacturing (AM) and manufacturing technologies and product case studies utilizing these materials through complex shape integration, lattice/honeycomb structure fabrication, porous structure fabrication, and topology optimization with 3D printers, which are impossible with conventional processing methods and technologies. The lightweighting of parts that can significantly differentiate from conventional and competitor parts is an urgent and critical issue, and intense technological development competition is unfolding both domestically and internationally. 3D printers, which are seen as the next-generation manufacturing method, offer a completely new perspective on AM technology, enabling the creation of innovative and attractive lightweight parts that are difficult to achieve with existing processing methods and technologies, as well as realizing short-term, low-cost, and high-quality manufacturing. Development cannot be expected to progress along the lines of existing technologies. By merging lightweight materials with 3D printing and utilizing topology optimization, astonishing weight reduction of parts can be achieved. We encourage you to take on this challenge.

At the beginning of this seminar, we will focus on the research and development related to ceramics 3D additive manufacturing that the National Institute of Advanced Industrial Science and Technology has been working on. We will discuss 3D additive manufacturing, powder preparation for manufacturing, debinding and sintering processes, as well as case studies of ceramics 3D additive manufacturing centered on alumina and reaction-sintered silicon carbide. Next, we will introduce Canon's latest developments in high-performance ceramic materials that significantly reduce "shrinkage" during sintering, which excel in selective laser melting (SLM) for 3D printers. We will also cover the characteristics of parts that can be manufactured using this method, layering technology, target fields, contract manufacturing services, and collaboration with Metal Research Institute, which has started high-precision semi-conductor part manufacturing services using metal 3D printers with these materials. After that, we will have advanced explanations from instructors of Shin-Toh V-Ceramics and As One about the development trends of various ceramics 3D printers from world-leading companies 3DCeram Sinto and Lithoz. We will discuss the latest additive manufacturing technologies that enable the creation of innovative parts, rapid part development, prototyping, and manufacturing, significant reductions in the number of parts, lightweight miniaturization, and reductions in manufacturing processes and workforce through the production of complex shapes, hollow and porous structures, and lattice structures that were previously impossible.

The complex shape manufacturing, integrated manufacturing, lattice/honeycomb structure manufacturing, porous structure manufacturing, hybrid structure manufacturing, direct manufacturing from 3D data, as well as topology optimization and collaboration with generative design, which were difficult with conventional processing methods and technologies, can lead to the creation of innovative aluminum parts that are not found in traditional or other companies. This includes rapid development, prototyping, and manufacturing of parts, dramatic reductions in the number of parts, ultra-lightweight and compact designs, and significant reductions in manufacturing time, costs, processes, and workforce. In this seminar, pioneering users such as J·3D, ODEC, and the pioneers of white copper, who are utilizing metal 3D printers to rapidly develop, prototype, and manufacture complex aluminum parts, will specifically explain the key points and precautions for introduction and utilization, various manufacturing methods and technologies, unique next-generation AM technologies developed in-house, and groundbreaking case studies that significantly differentiate their parts from those of other companies, sharing both success and failure stories. With the remarkable advancements in metal AM technology, the use of metal 3D printers for aluminum parts manufacturing will become commonplace in a few years. The secrets to success will be discussed by instructors with numerous research achievements and extensive manufacturing experience, providing clear and concrete lectures for those considering implementation, beginners with interest, and those who are new to the field.