Photonix Tokyo 2024: Light and Laser Technology Exhibition

Area sensor for internal defect inspection after welding as a substitute for X-rays, with over 15,000 units of monitoring systems during welding in operation.

1. Area sensor for internal defect inspection in welding - Field sensor Capable of simultaneous measurement of 110,000 points with image output. Replaces electron microscopes that require X-ray, CT scans, and work cuts. 2. Non-contact thickness measurement sensor for opaque materials - Enovasense Capable of measuring the thickness of resins, coatings, and metal coatings. Measurement range is 10nm to 1mm, with a measurement speed of 1 second or more, and measurement variation is approximately 0.5% to 3%. 3. Line camera for burr inspection after battery foil cutting - CVC A line camera with a maximum of 100kHz, capable of inline burr detection. 4. Insulation layer thickness measurement sensor - FSS Measures the thickness profile of battery insulation layers inline with a resolution of a few nm. 5. Dual point sensor for electrode thickness measurement - DPS Enables high-precision thickness measurement with a distance sensor of a few nm resolution. ■ Others 6. Line sensor for 3D shape measurement of battery can welds - CLS 7. - LWM

• Defect Inspection Equipment

High-speed opaque film thickness mapping and area detection of internal defects using a laser photothermal sensor.

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. This new product is an area sensor that can simultaneously measure approximately 110,000 points, unlike conventional single-point sensors. It can detect not only the thickness mapping of opaque materials but also the presence of defects, chips, and delaminations beneath the surface layer. ■ Features - Non-contact measurement of the following: ☆ Thickness mapping of opaque materials ☆ Detection of defects beneath opaque surface material layers No destructive testing is required. - As an area sensor, it can measure approximately 110,000 points simultaneously in one second. - It can also be applied to detect defects in areas such as welds, where conventional X-ray or CT scans are typically required. - Measurement is possible with various combinations of materials, regardless of the base material. ■ Applications Automotive industry, aerospace industry, consumer goods, industrial products, medical industry, semiconductor field. It can be used in various applications such as coating thickness, metal plating thickness, paint films, and welds. *For more details, please check the PDF download or contact us.

• Defect Inspection Equipment

It is possible to obtain the quality assessment results of the product simultaneously with the completion of laser welding. It is equipped with a user-friendly GUI that facilitates easy operations such as data linking, review, and analysis.

■ Monitoring plasma light, radiation temperature, and laser reflection light during laser welding to determine product quality. ■ The software used for judgment and analysis has improved its judgment capability, performance, and functionality through over 20 years of sales experience and customer feedback. ■ Easy to add not only to new equipment but also to existing equipment. ■ Proven track record as an inspection device for various laser welding applications in the automotive industry, EVs, home appliances, and more. We have demo units available and look forward to your inquiries. Whether you are familiar with the previous LWM or are trying it for the first time, we encourage you to experience the latest LWM.

• Welding Machine

Introducing the measurement principles of each sensor, corresponding sensors, product information, and ease of use!

This document introduces the performance of various sensors for component inspection handled by PreciTech Japan Co., Ltd. It includes the measurement principles, compatible sensors, and ease of use for each sensor, such as the "Chromatic Aberration Confocal Single Point Sensor" and "Optical Point Sensor." Our company provides intelligent and reliable solutions for laser material processing and optical measurement technology. [Overview] ■ Measurement with the Chromatic Aberration Confocal Single Point Sensor ■ Shape and thickness measurement inspection with the Chromatic Aberration Line Sensor ■ Quality control of welding ■ Area scan measurement of thickness, flatness, and shape in specified areas *For more details, please refer to the PDF document or feel free to contact us.

• Sensors
• Welding Machine

For high-precision thickness measurement of opaque materials, Enovasense's laser photo-thermal sensor can measure thickness from a minimum of 10nm, regardless of the material.

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. ■Features - Non-contact measurement of the thickness of opaque materials is possible, eliminating the need for destructive testing. - A wide measurement range from a minimum of 10nm to a maximum of 1mm. - High precision measurements of 0.5% to 3% or less are achievable, recommended for those lacking accuracy. - Capable of measuring various combinations of materials regardless of the base material. ■Applications Used in a wide range of fields including the automotive industry, aerospace industry, consumer goods, industrial products, medical industry, and semiconductors, for various applications such as coating thickness, metal plating thickness, and paint film thickness. *Currently, Enovasense is a group company of the German optical sensor manufacturer Precitec. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Coating thickness gauge

Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

The "CHROCODILE CLS2" and "CHROCODILE CLS2 PRO" can achieve non-contact high-speed three-dimensional shape measurement at a maximum of 48 million points per second (standard is 16.8 million points per second). The resolution is also extremely high, with a maximum of Y1um and Z0.025um, allowing for very precise measurements. Compared to previous generations, there has been a significant reduction in measurement time, and improvements have been made for high NA and increased light volume suitable for wafer edges, wire bonding, and micro bump measurements. There are numerous applications including shape, surface roughness, step height (thickness), flatness, and TTV. It is suitable not only as a tabletop device but also for use as a sensor for in-situ, monitoring, and inline equipment integration. 【Features】 - Three-dimensional shape measurement over a wide area Maximum line width of 20mm - Wide tolerance angle Can accommodate ±53° on reflective surfaces, suitable for edges and steep slopes - Contributes to reduced development costs and shortened development lead times, with a compact unit and a software development kit for equipment integration (such as DLLs) also available - Rich track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field *For more details, please refer to the documentation.

• 3D measuring device

High-speed area scanning unaffected by vibrations. For online, offline, quality control, and wafer inspection applications.

The "Flying Spot Scanner" is an optical measuring device that can perform wide-area scans (up to φ80) using XY2-axis galvanometer mirrors. Since stage scanning is not required, there is no influence from vibrations of the stage. Thanks to the principle of spectral interference, it can measure thickness, dimensional shapes, and inspect surface defects. Additionally, because the incident and reflected light are in a coaxial optical system, good results can be obtained even on glossy surfaces. 【Features】 ■ Wide-area scanning ~φ80mm ■ High resolution XY 6.5μm~, Z 1nm~ Minimum beam spot diameter 13μm, high Z resolution due to spectral interference method ■ No XY stage required, no stage vibrations Area scanning using galvanometer mirrors ■ Reduced development costs and shortened development lead times Software development kit (DLL, etc.) available for device integration ■ Applications Thickness measurement of glass substrates for FPD and LCD, measurement of wafer warp (distortion), lens shape inspection, PCB board shape inspection, height measurement of small precision parts, etc. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Other inspection equipment and devices
• Optical Measuring Instruments

This is a high-speed, high-precision line camera for inline appearance inspection, also suitable for wafer inspection applications.

The "CHRomatic Vision Camera" is a line camera for high-speed appearance inspection. Utilizing the principle of chromatic aberration confocal, it has a wide depth of field of up to 3mm. Focusing is unnecessary, allowing for high-contrast images to be captured even on uneven surfaces. It can obtain two-dimensional images. Additionally, with a high-speed scan of up to 140kHz, inline appearance inspection (for shape defects such as cracks and scratches, as well as foreign object inspection) is possible. 【Features】 ■ High resolution XY 0.9um~2.9um (the 3mm depth of field type is 2.9um) ■ High contrast for various materials ■ High speed and resistant to vibration ■ Contributes to reduced development costs and shortened development lead times, with a software development kit (DLL, etc.) available for device integration. Interfaces such as CameraLink and GigE are supported. ■ Proven results in appearance inspection for semiconductors, consumer electronics, and glass. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Sensors
• Optical Measuring Instruments

The latest published paper utilized Abby. This will be an online seminar featuring Associate Professor Yosuke Katsuta from the Graduate School of Advanced Science and Technology, Kumamoto University, who is also a co-founder of StapleBio. He is working on RNA hacking technology development aimed at altering the higher-order structure of target mRNA using short nucleic acids named Staple nucleic acids, with the goal of controlling gene expression. He will present the latest data focusing on the results of cell experiments and animal experiments in the development of this technology. Related paper on the lecture content: "Staple oligomers induce a stable RNA G-quadruplex structure for protein translation inhibition in therapeutics" | Nature Biomedical Engineering

Are you casually adopting AC adapters just because they are cheap? AC adapters carry inherent risks of electric shock and smoke or fire hazards, and incidents of fires due to design flaws from choosing low-cost products have occurred. When accidents involving electric shock or smoke and fire occur, not only do they lead to significant costs for post-incident handling and recall responses, but they also result in a decline in brand image, which can severely impact management. Therefore, it is essential to eliminate defect risks at the adoption stage. In this webinar, we aim to provide insights for evaluation during the adoption process by introducing case studies of market failure analysis of AC adapters that our company has experienced over the past several decades. We explain the content as simply and clearly as possible, so even those without prior knowledge of AC adapters are welcome to attend.

[Speaker] Shota Imai, President and CEO of GenesisAI, Inc. / Visiting Professor at the Graduate School of Advanced Science and Technology, Hokuriku University [Key Lecture Content] Generative AI is likely the greatest technological revolution in human history. As of 2025, generative AI possesses knowledge comparable to that of PhD holders and is capable of generating moving images that take physical laws into account. Furthermore, generative AI, which was previously focused on content generation, has evolved into AI agents capable of handling lengthy and complex tasks, enabling automation in research, software development, and scientific inquiry. While there are significant economic benefits from increased productivity, the concern of "losing jobs to AI" has become a realistic issue. This lecture will explain the outlook for the development of these AI technologies and their impact on society based on research conducted as of 2025. [Lecture Items] 1. Latest Research on Generative AI 2. Latest Research on AI Agents 3. Physical AI and World Models 4. Future Prospects for AI Development Based on Scaling Laws 5. AI for Scientific Research 6. AI and Labor 7. Q&A / Business Card Exchange

[Key Lecture Content] 1. Research and Development of NTT's LLM "tsuzumi2" NTT Corporation Human Information Research Laboratory, Thought Processing Research Project Group Leader: Kuniko Saito 1. Objectives of "tsuzumi2" Development 2. Key Points of "tsuzumi2" Evolution 3. Introduction to "tsuzumi2" Utilization Images 4. Q&A / Business Card Exchange 2. Business Trends of NTT's LLM "tsuzumi2" Research and Development Marketing Headquarters, Marketing Division R&D Marketing Manager: Ichiro Kudo 1. Market Trends and NTT's Initiatives in AI Business 2. Areas of Utilization and Applications of "tsuzumi2" 3. Collaborations with Partners for "tsuzumi2" 4. Key Points for Practical Utilization 5. Q&A / Business Card Exchange

Daitron will host a webinar with Professor Yamamoto from Nagoya University’s Institute of Future Materials and Systems on the topic of "The Capabilities of Chinese EV Manufacturers in Electric Vehicle Design and the Technological Strategies the Japanese Automotive Industry Should Adopt Against Tesla's Pioneering Efforts." We sincerely look forward to your registration.