Photonix Tokyo 2024: Light and Laser Technology Exhibition

Area sensor for internal defect inspection after welding as a substitute for X-rays, with over 15,000 units of monitoring systems during welding in operation.

1. Area sensor for internal defect inspection in welding - Field sensor Capable of simultaneous measurement of 110,000 points with image output. Replaces electron microscopes that require X-ray, CT scans, and work cuts. 2. Non-contact thickness measurement sensor for opaque materials - Enovasense Capable of measuring the thickness of resins, coatings, and metal coatings. Measurement range is 10nm to 1mm, with a measurement speed of 1 second or more, and measurement variation is approximately 0.5% to 3%. 3. Line camera for burr inspection after battery foil cutting - CVC A line camera with a maximum of 100kHz, capable of inline burr detection. 4. Insulation layer thickness measurement sensor - FSS Measures the thickness profile of battery insulation layers inline with a resolution of a few nm. 5. Dual point sensor for electrode thickness measurement - DPS Enables high-precision thickness measurement with a distance sensor of a few nm resolution. ■ Others 6. Line sensor for 3D shape measurement of battery can welds - CLS 7. - LWM

• Defect Inspection Equipment

High-speed opaque film thickness mapping and area detection of internal defects using a laser photothermal sensor.

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. This new product is an area sensor that can simultaneously measure approximately 110,000 points, unlike conventional single-point sensors. It can detect not only the thickness mapping of opaque materials but also the presence of defects, chips, and delaminations beneath the surface layer. ■ Features - Non-contact measurement of the following: ☆ Thickness mapping of opaque materials ☆ Detection of defects beneath opaque surface material layers No destructive testing is required. - As an area sensor, it can measure approximately 110,000 points simultaneously in one second. - It can also be applied to detect defects in areas such as welds, where conventional X-ray or CT scans are typically required. - Measurement is possible with various combinations of materials, regardless of the base material. ■ Applications Automotive industry, aerospace industry, consumer goods, industrial products, medical industry, semiconductor field. It can be used in various applications such as coating thickness, metal plating thickness, paint films, and welds. *For more details, please check the PDF download or contact us.

• Defect Inspection Equipment

It is possible to obtain the quality assessment results of the product simultaneously with the completion of laser welding. It is equipped with a user-friendly GUI that facilitates easy operations such as data linking, review, and analysis.

■ Monitoring plasma light, radiation temperature, and laser reflection light during laser welding to determine product quality. ■ The software used for judgment and analysis has improved its judgment capability, performance, and functionality through over 20 years of sales experience and customer feedback. ■ Easy to add not only to new equipment but also to existing equipment. ■ Proven track record as an inspection device for various laser welding applications in the automotive industry, EVs, home appliances, and more. We have demo units available and look forward to your inquiries. Whether you are familiar with the previous LWM or are trying it for the first time, we encourage you to experience the latest LWM.

• Welding Machine

Introducing the measurement principles of each sensor, corresponding sensors, product information, and ease of use!

This document introduces the performance of various sensors for component inspection handled by PreciTech Japan Co., Ltd. It includes the measurement principles, compatible sensors, and ease of use for each sensor, such as the "Chromatic Aberration Confocal Single Point Sensor" and "Optical Point Sensor." Our company provides intelligent and reliable solutions for laser material processing and optical measurement technology. [Overview] ■ Measurement with the Chromatic Aberration Confocal Single Point Sensor ■ Shape and thickness measurement inspection with the Chromatic Aberration Line Sensor ■ Quality control of welding ■ Area scan measurement of thickness, flatness, and shape in specified areas *For more details, please refer to the PDF document or feel free to contact us.

• Sensors
• Welding Machine

For high-precision thickness measurement of opaque materials, Enovasense's laser photo-thermal sensor can measure thickness from a minimum of 10nm, regardless of the material.

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. ■Features - Non-contact measurement of the thickness of opaque materials is possible, eliminating the need for destructive testing. - A wide measurement range from a minimum of 10nm to a maximum of 1mm. - High precision measurements of 0.5% to 3% or less are achievable, recommended for those lacking accuracy. - Capable of measuring various combinations of materials regardless of the base material. ■Applications Used in a wide range of fields including the automotive industry, aerospace industry, consumer goods, industrial products, medical industry, and semiconductors, for various applications such as coating thickness, metal plating thickness, and paint film thickness. *Currently, Enovasense is a group company of the German optical sensor manufacturer Precitec. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Coating thickness gauge

Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

The "CHROCODILE CLS2" and "CHROCODILE CLS2 PRO" can achieve non-contact high-speed three-dimensional shape measurement at a maximum of 48 million points per second (standard is 16.8 million points per second). The resolution is also extremely high, with a maximum of Y1um and Z0.025um, allowing for very precise measurements. Compared to previous generations, there has been a significant reduction in measurement time, and improvements have been made for high NA and increased light volume suitable for wafer edges, wire bonding, and micro bump measurements. There are numerous applications including shape, surface roughness, step height (thickness), flatness, and TTV. It is suitable not only as a tabletop device but also for use as a sensor for in-situ, monitoring, and inline equipment integration. 【Features】 - Three-dimensional shape measurement over a wide area Maximum line width of 20mm - Wide tolerance angle Can accommodate ±53° on reflective surfaces, suitable for edges and steep slopes - Contributes to reduced development costs and shortened development lead times, with a compact unit and a software development kit for equipment integration (such as DLLs) also available - Rich track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field *For more details, please refer to the documentation.

• 3D measuring device

High-speed area scanning unaffected by vibrations. For online, offline, quality control, and wafer inspection applications.

The "Flying Spot Scanner" is an optical measuring device that can perform wide-area scans (up to φ80) using XY2-axis galvanometer mirrors. Since stage scanning is not required, there is no influence from vibrations of the stage. Thanks to the principle of spectral interference, it can measure thickness, dimensional shapes, and inspect surface defects. Additionally, because the incident and reflected light are in a coaxial optical system, good results can be obtained even on glossy surfaces. 【Features】 ■ Wide-area scanning ~φ80mm ■ High resolution XY 6.5μm~, Z 1nm~ Minimum beam spot diameter 13μm, high Z resolution due to spectral interference method ■ No XY stage required, no stage vibrations Area scanning using galvanometer mirrors ■ Reduced development costs and shortened development lead times Software development kit (DLL, etc.) available for device integration ■ Applications Thickness measurement of glass substrates for FPD and LCD, measurement of wafer warp (distortion), lens shape inspection, PCB board shape inspection, height measurement of small precision parts, etc. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Other inspection equipment and devices
• Optical Measuring Instruments

This is a high-speed, high-precision line camera for inline appearance inspection, also suitable for wafer inspection applications.

The "CHRomatic Vision Camera" is a line camera for high-speed appearance inspection. Utilizing the principle of chromatic aberration confocal, it has a wide depth of field of up to 3mm. Focusing is unnecessary, allowing for high-contrast images to be captured even on uneven surfaces. It can obtain two-dimensional images. Additionally, with a high-speed scan of up to 140kHz, inline appearance inspection (for shape defects such as cracks and scratches, as well as foreign object inspection) is possible. 【Features】 ■ High resolution XY 0.9um~2.9um (the 3mm depth of field type is 2.9um) ■ High contrast for various materials ■ High speed and resistant to vibration ■ Contributes to reduced development costs and shortened development lead times, with a software development kit (DLL, etc.) available for device integration. Interfaces such as CameraLink and GigE are supported. ■ Proven results in appearance inspection for semiconductors, consumer electronics, and glass. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Sensors
• Optical Measuring Instruments

We will be exhibiting at the "P-MEC Japan 2025 Pharmaceutical Ingredients and Equipment Exhibition" held at Tokyo Big Sight. During the event, we will showcase various products. We invite all relevant parties to come and visit us. 【Suppliers】 ・LAUDA

Thank you very much for visiting our booth this time. Thanks to you, we had the opportunity to introduce our products and technologies to many customers, making it a very meaningful time. If you have any questions regarding the exhibition content or if you would like to discuss specific considerations or estimates, please feel free to contact us. We will be happy to provide proposals tailored to your needs.

[Lecture Topics] 1. About AI Robotics Tomoya Yokoyama, Section Chief, Robot Policy Office, Industrial Machinery Division, Ministry of Economy, Trade and Industry *The content of the lecture may change. 2. Development of Remote-Controlled Robots Aiming for a Realistic Operating Experience ~Visual and auditory transmission through ultra-low latency, high presence, and high immersion~ Hiroshi Inagaki, Senior Manager, Collaborative Robotics Group, R-Frontier Department, Future Creation Center, Toyota Motor Corporation 3. The Impact of Japanese-Made Humanoids Yasuke Ono, President, Donut Robotics Inc.

[Speaker] Inclusive Design Designer Yoko Nakao [Key Lecture Content] Products are not selling, differentiation is difficult, and regulations are changing. As product development and facility management reach a significant turning point, inclusive design, which involves engaging people who have previously been excluded from the development process to collaboratively think of solutions, is gaining attention as a method for creating new value. Additionally, practicing inclusive design is expected to enhance not only customer engagement but also employee engagement. In this seminar, based on 20 years of experience leading universal design and inclusive design with diverse characteristics both inside and outside a comprehensive electronics manufacturer, I will specifically explain how to practice inclusive design to create new value. [Lecture Items] 1. Inclusive Design as a New Growth Engine 2. Increasing the Resolution of Diversity 3. Inclusive Design Process 4. Side Effects - Ripple Effects on Talent Development and Recruitment 5. Conclusion 6. Q&A / Business Card Exchange

[Lecture Topics] 1. Future Directions of Broadcasting Policy Reiko Kondo, Director-General for Policy Coordination, Ministry of Internal Affairs and Communications 2. The Nature of Broadcasting Systems in the Broadcasting Era Noriaki Saeki, Director of Broadcasting Policy Division, Ministry of Internal Affairs and Communications 3. Latest Trends in Broadcasting Technology Tomoki Nemoto, Director of Broadcasting Technology Division, Ministry of Internal Affairs and Communications 4. Policy Trends Related to Broadcasting Operations and Future Outlook Toshiyuki Sakairi, Director of Broadcasting Operations Division, Ministry of Internal Affairs and Communications 5. Latest Trends in Maintaining and Strengthening Broadcasting Infrastructure and Facility Development Policy Yukari Iimura, Director of Broadcasting Facility Development Promotion Division, Ministry of Internal Affairs and Communications 6. Latest Trends in Broadcasting and Distribution Content Promotion Policy Hiroki Yoshida, Director of Information and Communication Works Promotion Division, Ministry of Internal Affairs and Communications