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  5. 3D measuring device
  6. 3D Line Sensor CHROCODILE CLS2 Series

3D Line Sensor CHROCODILE CLS2 Series

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CHRocodile CLS 2, CLS2 PRO

last updated:Mar 25, 2025

プレシテック・ジャパン
プレシテック・ジャパン
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Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

The "CHROCODILE CLS2" and "CHROCODILE CLS2 PRO" can achieve non-contact high-speed three-dimensional shape measurement at a maximum of 48 million points per second (standard is 16.8 million points per second). The resolution is also extremely high, with a maximum of Y1um and Z0.025um, allowing for very precise measurements. Compared to previous generations, there has been a significant reduction in measurement time, and improvements have been made for high NA and increased light volume suitable for wafer edges, wire bonding, and micro bump measurements. There are numerous applications including shape, surface roughness, step height (thickness), flatness, and TTV. It is suitable not only as a tabletop device but also for use as a sensor for in-situ, monitoring, and inline equipment integration. 【Features】 - Three-dimensional shape measurement over a wide area Maximum line width of 20mm - Wide tolerance angle Can accommodate ±53° on reflective surfaces, suitable for edges and steep slopes - Contributes to reduced development costs and shortened development lead times, with a compact unit and a software development kit for equipment integration (such as DLLs) also available - Rich track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field *For more details, please refer to the documentation.

    3D measuring device
CHRocodile_CLS2.0_chromatic_line_sensor_product_image.JPG

3D Line Sensor CHROCODILE CLS2 Series

CHRocodile_CLS2.0_chromatic_line_sensor_product_image.JPG
CHRocodile_CLS2.0_chromatic_line_sensor_product_image.JPG
  • Special site - Product/service details - https://pr.mono.ipros.com/precitec-group/product/

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【Application】 Non-contact 3D shape measurement is possible. It is also possible to replace contact methods with non-contact methods. ■ Home Appliances (Smartphones) - LCD glass - OLED mask inspection - Fine scratches and other surface defects - Wire bonding - AR glasses ■ Semiconductor Manufacturing Process - Wafer edge shape measurement - Wafer edge defect inspection - Wafer dicing groove appearance inspection - BGA inspection - IC package and circuit inspection ■ Automotive - Valve inspection - Car interior - Glass inspection - Inspection of airbag welding beads

Price range

P6

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Applications/Examples of results

Wafer shape measurement before and after wafer processing (such as polishing), during processing, edge appearance inspection, measurement of misalignment of bonded wafers, TTV, flatness, wire bonding shape, micro bump shape, weld shape, PCB shape, non-contact distance sensors mounted on CMM, etc. [Keywords: Applications, Measurement Items, Benefits, etc.] Optical sensors, non-contact sensors, confocal, height, surface roughness, shape, appearance, edge, slope, measurement, inspection, high speed, 3D shape, line sensors, line scan, full surface measurement, high precision, high speed, In-Situ, during processing, before and after processing, semiconductors, semiconductor wafers, Si wafers, GaAs, InP, SiC, LiNbO3 (LN), LiTaO3 (LT), GaN, SiP, Al2O3 (sapphire), dicing grooves, transparent, transparent bodies, black, glossy, mirror finish, simple.

catalog(5)

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Collection of Measurement Examples: Application of Non-contact Sensors in Semiconductors - Thickness Measurement - Flatness Management

Collection of Measurement Examples: Application of Non-contact Sensors in Semiconductors - Thickness Measurement - Flatness Management

TECHNICAL
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Semiconductor Packaging Bond Line Thickness (BLT) Measurement White Paper

Semiconductor Packaging Bond Line Thickness (BLT) Measurement White Paper

TECHNICAL
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Introduction to Products and Applications of Color Aberration Confocal 3D Line Sensors

Introduction to Products and Applications of Color Aberration Confocal 3D Line Sensors

APPLICATION_NOTE
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Case Study Collection: Thickness Measurement and 3D Shape Measurement of Semiconductor Wafers Using Non-Contact Sensors

Case Study Collection: Thickness Measurement and 3D Shape Measurement of Semiconductor Wafers Using Non-Contact Sensors

TECHNICAL
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Data Sheet Color Aberration Confocal Sensor Version 20250522

Data Sheet Color Aberration Confocal Sensor Version 20250522

PRODUCT
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News about this product(4)

Semicon Japan 2024

  • Seminar・Event

We will be exhibiting at Semicon Japan 2024, which will be held at Tokyo Big Sight from December 11 (Wednesday) to December 12 (Friday). If you are interested, please come to the venue. ■ Products to be exhibited 1. Spectral interference optical thickness sensor CHRocodile 2 DW/ 2IT 2. Area scanner for measuring the thickness and shape of 12" wafers - Flying Spot Scanner (FSS) 3. Chromatic aberration confocal optical line sensor CLS2.0 4. Chromatic aberration confocal line camera CVC 5. Chromatic aberration confocal optical single-point sensor CHRocodile Mini 6. Non-contact thickness measurement sensor for opaque materials Enovasnese 7. Sensor for detecting internal defects non-contactly - Field sensor

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The 1st Kyushu Semiconductor Industry Exhibition

  • Seminar・Event

We will be exhibiting at the Kyushu Semiconductor Industry Exhibition held at Marine Messe Fukuoka on September 25 (Wednesday) and September 26 (Thursday), 2024. If you are interested, please come to the venue. ■ Products to be exhibited - Spectral interference optical thickness sensor CHRocodile 2 DW/2IT - Chromatic aberration confocal optical line sensor CLS2.0 - Chromatic aberration confocal optical single-point sensor CHRocodile 2S, C, Mini *This time, there will be no actual display of the FSS for 12" wafer thickness mapping measurement, but if you need an explanation or would like to request a demo, please come to our booth.

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Photonix Osaka Exhibition - Light and Laser Technology Exhibition

  • Seminar・Event

We will be exhibiting at the Photonix Osaka exhibition held at Intex Osaka from May 14 (Wednesday) to May 16 (Friday), 2025. If you are interested, please come to the venue. ■ Products to be exhibited - Laser photo-thermal sensor from Enovasense - Chromatic aberration confocal 3D line sensor - ProCutter Prime variable laser spot diameter high-power laser cutting head - LWM laser welding monitoring device - CoaxPrinter coaxial wire head for metal 3D printer (complete package: with wire feeding, pyrometer, IDM) - ScanMaster high-speed shape recognition, parameter optimization, OCT, scanner welding - ScanWelder/WM new camera 1-axis oscillating head for seam tracking, high-speed image processing & shape recognition

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Photonix Tokyo 2024: Light and Laser Technology Exhibition

  • Seminar・Event

We will be exhibiting at the Photonix Tokyo exhibition held at Makuhari Messe from October 29 (Tuesday) to October 31 (Thursday), 2024. If you are interested, please come to the venue. ■ Products to be exhibited Laser photothermal sensor by Enovasense ProCutter 2.0 60kW cutting head WeldMaster YW52 CANUNDA-HP LWM

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プレシテック・ジャパン

プレシテック・ジャパン

Testing, Analysis and Measurement

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Presitech is a specialist in laser material processing and optical measurement technology. We are not just a supplier of systems and components, but a professional partner in ensuring a smooth processing process for our customers. We offer consultations from the foundational stage and accurately consult with customers on their requests and objectives. We understand that the key to success in unique processing processes lies in the four components of exhibition, monitoring, processing, and control. Only by doing so can we provide appropriate solutions for our customers' applications. Our high-quality products, such as laser processing heads, quality monitoring systems, and optical measurement systems for spacing/thickness measurement, allow customers to directly benefit from our decades of experience. Our optical sensors are characterized by the highest precision and dynamic adaptability. Furthermore, they detect accurate values even in high-speed measurements.

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