Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.
The "CHROCODILE CLS2" and "CHROCODILE CLS2 PRO" can achieve non-contact high-speed three-dimensional shape measurement at a maximum of 48 million points per second (standard is 16.8 million points per second). The resolution is also extremely high, with a maximum of Y1um and Z0.025um, allowing for very precise measurements. Compared to previous generations, there has been a significant reduction in measurement time, and improvements have been made for high NA and increased light volume suitable for wafer edges, wire bonding, and micro bump measurements. There are numerous applications including shape, surface roughness, step height (thickness), flatness, and TTV. It is suitable not only as a tabletop device but also for use as a sensor for in-situ, monitoring, and inline equipment integration. 【Features】 - Three-dimensional shape measurement over a wide area Maximum line width of 20mm - Wide tolerance angle Can accommodate ±53° on reflective surfaces, suitable for edges and steep slopes - Contributes to reduced development costs and shortened development lead times, with a compact unit and a software development kit for equipment integration (such as DLLs) also available - Rich track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field *For more details, please refer to the documentation.
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【Application】 Non-contact 3D shape measurement is possible. It is also possible to replace contact methods with non-contact methods. ■ Home Appliances (Smartphones) - LCD glass - OLED mask inspection - Fine scratches and other surface defects - Wire bonding - AR glasses ■ Semiconductor Manufacturing Process - Wafer edge shape measurement - Wafer edge defect inspection - Wafer dicing groove appearance inspection - BGA inspection - IC package and circuit inspection ■ Automotive - Valve inspection - Car interior - Glass inspection - Inspection of airbag welding beads
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Wafer shape measurement before and after wafer processing (such as polishing), during processing, edge appearance inspection, measurement of misalignment of bonded wafers, TTV, flatness, wire bonding shape, micro bump shape, weld shape, PCB shape, non-contact distance sensors mounted on CMM, etc. [Keywords: Applications, Measurement Items, Benefits, etc.] Optical sensors, non-contact sensors, confocal, height, surface roughness, shape, appearance, edge, slope, measurement, inspection, high speed, 3D shape, line sensors, line scan, full surface measurement, high precision, high speed, In-Situ, during processing, before and after processing, semiconductors, semiconductor wafers, Si wafers, GaAs, InP, SiC, LiNbO3 (LN), LiTaO3 (LT), GaN, SiP, Al2O3 (sapphire), dicing grooves, transparent, transparent bodies, black, glossy, mirror finish, simple.
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Presitech is a specialist in laser material processing and optical measurement technology. We are not just a supplier of systems and components, but a professional partner in ensuring a smooth processing process for our customers. We offer consultations from the foundational stage and accurately consult with customers on their requests and objectives. We understand that the key to success in unique processing processes lies in the four components of exhibition, monitoring, processing, and control. Only by doing so can we provide appropriate solutions for our customers' applications. Our high-quality products, such as laser processing heads, quality monitoring systems, and optical measurement systems for spacing/thickness measurement, allow customers to directly benefit from our decades of experience. Our optical sensors are characterized by the highest precision and dynamic adaptability. Furthermore, they detect accurate values even in high-speed measurements.