Semicon Japan 2024

For high-precision thickness measurement of opaque materials, Enovasense's laser photo-thermal sensor can measure thickness from a minimum of 10nm, regardless of the material.

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. ■Features - Non-contact measurement of the thickness of opaque materials is possible, eliminating the need for destructive testing. - A wide measurement range from a minimum of 10nm to a maximum of 1mm. - High precision measurements of 0.5% to 3% or less are achievable, recommended for those lacking accuracy. - Capable of measuring various combinations of materials regardless of the base material. ■Applications Used in a wide range of fields including the automotive industry, aerospace industry, consumer goods, industrial products, medical industry, and semiconductors, for various applications such as coating thickness, metal plating thickness, and paint film thickness. *Currently, Enovasense is a group company of the German optical sensor manufacturer Precitec. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Coating thickness gauge

Affordable distance sensors for measuring film and coating thickness, as well as non-contact thickness measurement. Strong performance on slopes, achieving a distance direction resolution of 20nm!

Our optical distance sensor/thickness sensor 'CHRocodile C / CHRocodile Mini' from PreciTech Japan is a compact non-contact sensor with a wide measurement range. It is robust against slopes and offers high resolution in the distance direction starting from 20nm, all at an affordable price of approximately 1 million yen (excluding tax). 【Examples of Use Cases】 ● Complete inspection through height and distance measurement of manufactured products within equipment ● Quality improvement through thickness management of glass, film, and graphite coatings ⇒ Adopted by manufacturers of production equipment, inspection equipment, and integrators. 【Features】 ・Combines high resolution with a price point that lowers the purchasing barrier ・Non-contact measurement of film and coating thickness ・Strong against slopes with an angle tolerance of up to ±45 degrees ・Distance direction resolution starting from 20nm ・Flexible software creation possible with the provided software development kit ・Can be embedded in equipment ・Compatible with rough and mirror surfaces, independent of surface or shape *For product details, please refer to the materials available for download in PDF format. Feel free to contact us for inquiries.

• Distance measuring device

High-speed opaque film thickness mapping and area detection of internal defects using a laser photothermal sensor.

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. This new product is an area sensor that can simultaneously measure approximately 110,000 points, unlike conventional single-point sensors. It can detect not only the thickness mapping of opaque materials but also the presence of defects, chips, and delaminations beneath the surface layer. ■ Features - Non-contact measurement of the following: ☆ Thickness mapping of opaque materials ☆ Detection of defects beneath opaque surface material layers No destructive testing is required. - As an area sensor, it can measure approximately 110,000 points simultaneously in one second. - It can also be applied to detect defects in areas such as welds, where conventional X-ray or CT scans are typically required. - Measurement is possible with various combinations of materials, regardless of the base material. ■ Applications Automotive industry, aerospace industry, consumer goods, industrial products, medical industry, semiconductor field. It can be used in various applications such as coating thickness, metal plating thickness, paint films, and welds. *For more details, please check the PDF download or contact us.

• Defect Inspection Equipment

Optical sensor for measuring a wide range of thickness from 0.5 to 200 um. High-speed sampling at 5 kHz. Ideal for monitoring applications during processing.

Non-contact optical thickness measurement. Applicable for thickness measurement of semiconductor wafers where high precision is required. The new product 'CHRocodile 2 SX' is a device that can measure the thickness of materials such as wafers and coatings without contact. It supports high-speed sampling of up to 5 kHz, making it suitable for inline applications. In addition to measuring the thickness of semiconductor wafers like Si, it can also measure the thickness of films, resins, glass, solar cells, and more. In particular, when thickness monitoring is desired during wafer grinding, it can measure thicknesses from 200 µm to 0.5 µm for Si wafers. 【Features】 ■ Wide range of thickness measurement, compatible with various materials With a rich lineup of probes, it can measure thicknesses from thin films (around 2 µm) to thick films (1000 µm) at optical lengths, and from 0.5 to 200 µm for Si. ■ High resolution (sub-micron, minimum 3 nm @ optical length) ■ Contributes to reducing development costs and shortening development lead times, with a software development kit (DLL, etc.) available for device integration ■ Extensive track record in the semiconductor industry *For more details, please refer to the documentation.

• Coating thickness gauge

Capable of measuring the total thickness of 12-inch wafers. High-speed measurement without the influence of vibrations, without a scanning stage. Suitable for online, offline, and wafer inspection applications.

The Flying Spot Scanner 310 is an optical measuring device that can perform wide-area (up to φ310) scans using XY2-axis galvanometer mirrors. Since stage scanning is not required, there is no influence from vibrations of the stage. It can measure thickness, dimensional shapes, and inspect surface defects based on the principle of spectral interference. Additionally, due to the coaxial optical system for incident and reflected light, it is possible to obtain good results even on glossy surfaces. 【Features】 ■ Wide-area scan φ310mm ■ High resolution XY20um Beam spot diameter 40um, high Z resolution through spectral interference method ■ No XY stage required, no stage vibrations Area scanning using galvanometer mirrors ■ Reduced development costs and shortened development lead times Software development kit for device integration (DLL, etc.) available ■ Applications Thickness measurement of 12-inch wafer surfaces, thickness measurement of bonded wafers, void inspection *For more details, please refer to the documentation.

• 3D measuring device
• Coating thickness gauge

Non-contact optical thickness measurement. Applicable even for thickness measurements of semiconductor wafers where high precision is required.

The new product "CHRocodile 2LR ver2" is a device that can non-contact measure the thickness of materials such as wafers and coatings. It adopts a new detector different from the previous "CHRocodile 2LR," allowing for approximately twice the thickness measurement range and more precise measurements. It can also be applied inline, and the CHRocodile 2LR has a proven track record with many customers. It is capable of measuring the thickness of semiconductor wafers like Si, as well as films, resins, glass, and solar cells. It supports interference film thickness of up to 16 layers. 【Features】 　■ Wide thickness measurement range, compatible with various materials 　　　With a rich lineup of probes, it covers thicknesses from thin films (around 32μm) to thick films (3900μm). (The high-precision measurement range is 16~1900μm with linearity of 0.35μm) 　■ High resolution (sub-micron, minimum 1nm) 　■ Contributes to reducing development costs and shortening development lead times, 　　　with a software development kit (DLL, etc.) available for device integration 　■ Extensive track record in the semiconductor industry *For more details, please refer to the documentation.

• Coating thickness gauge
• Other inspection equipment and devices

Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

The "CHROCODILE CLS2" and "CHROCODILE CLS2 PRO" can achieve non-contact high-speed three-dimensional shape measurement at a maximum of 48 million points per second (standard is 16.8 million points per second). The resolution is also extremely high, with a maximum of Y1um and Z0.025um, allowing for very precise measurements. Compared to previous generations, there has been a significant reduction in measurement time, and improvements have been made for high NA and increased light volume suitable for wafer edges, wire bonding, and micro bump measurements. There are numerous applications including shape, surface roughness, step height (thickness), flatness, and TTV. It is suitable not only as a tabletop device but also for use as a sensor for in-situ, monitoring, and inline equipment integration. 【Features】 - Three-dimensional shape measurement over a wide area Maximum line width of 20mm - Wide tolerance angle Can accommodate ±53° on reflective surfaces, suitable for edges and steep slopes - Contributes to reduced development costs and shortened development lead times, with a compact unit and a software development kit for equipment integration (such as DLLs) also available - Rich track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field *For more details, please refer to the documentation.

• 3D measuring device

The "CHRocodile 2 IT sensor" can measure the thickness of wafers during work processing.

In the semiconductor industry, it is necessary to measure the physical thickness of wafers at multiple manufacturing stages, such as CMP and mechanical grinding. To monitor and optimize the entire process, it is important to have a grasp of the thickness; however, this task is currently mainly performed using mechanical contact probes. These probes have significant drawbacks, including the need for contact with the wafer, surface damage, and reference values for thickness measurement from the chuck table, and they also wear out, necessitating frequent replacements. Our "CHRocodile 2 IT sensor" can measure the thickness of wafers during processing using non-contact, non-destructive optical measurement technology. 【Features】 - Optical sensor provides more accurate results than conventional contact measurement devices. - Direct feedback improves the reproducibility of wafer thickness from several micrometers to less than 0.5 micrometers. - High-speed measurement and non-contact passive probes allow for the acquisition of a large amount of thickness data across the entire wafer area simply by moving the probe over the sample. - Variability in wafer thickness is revealed from the results, enabling the management of variability during the grinding process. *Product details can be viewed in the materials available for download in PDF format.

• Sensors

Use an appropriate light source wavelength for doped wafers to accommodate challenging doped wafer thickness measurements.

The "CHRocodile 2DW Series" is a device that can non-contact measure the thickness of materials such as wafers and coatings. It is capable of measuring doped wafers and can be applied in-line, with a proven track record among many customers. In addition to measuring the thickness of semiconductor wafers like sapphire, Si, and SiC, it can also measure the thickness of films, resins, glass, and solar cells. It supports interference film thickness of up to 16 layers. 【Features】 　■ Wide range of thickness measurement, compatible with various materials 　　　With a rich lineup of probes, it covers thickness from thin films (a few micrometers) to thick films (780 micrometers). It supports doped wafers. 　■ High resolution (sub-micron, minimum 1nm) 　■ Contributes to reducing development costs and shortening development lead times, 　　　with a software development kit (DLL, etc.) available for device integration 　■ Extensive track record in the semiconductor industry *For more details, please refer to the documentation. Feel free to contact us with any inquiries.

• Other measurement, recording and measuring instruments
• Sensors

12" wafer full inspection accelerated, can also be used for full inspection of wafers.

The TTV, Bow, and Warp measurements of the entire wafer can be performed. With a measurement speed of up to 70,000 points per second, it is possible to measure the entire surface in about 2 minutes with a pitch of 160 µm in the XY direction. This is a full system equipped with software compliant with SEMI standards. The sensors used can be selected from our spectral interference sensor 2IT DW series, allowing for high-precision measurements with a Z resolution of 1 nm or better. The high-speed measurement of the entire wafer is made possible by our area scanner FSS310, which is incorporated into the system.

• Coating thickness gauge

Embedded optical sensor for high-precision and high-speed measurement of thickness and shape.

This is a single-point sensor using a chromatic aberration confocal method from Pretech, characterized by high precision and high-speed measurement. It has a proven track record in reducing measurement time for thickness and shape, as well as in full inspection. Due to the chromatic aberration confocal method, it is also possible to use probes with a large angular tolerance. There is also a budget sensor lineup available, starting from approximately 800,000 yen. *For more details, please refer to the materials. Feel free to contact us as well.*

• Distance measuring device

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

In this webinar, we will explain "Why packed columns continue to be chosen today" from a practical perspective of gas analysis. We will also introduce the various types and characteristics of packing materials offered by Restek, along with application examples, and share insights on how to make optimal choices based on analytical objectives. Furthermore, we will discuss the differences in hardware passivation techniques and how to differentiate their use, as well as examples of custom packed column designs tailored to specific purposes. Topics covered in the webinar: ✅ Types of packing materials for packed columns and their characteristics ✅ Differences in separation selectivity based on analytical examples for each packing material ✅ Examples of custom packed column designs Benefits: For beginners: You will gain an understanding of separation selectivity based on differences in packing materials and the basics of column selection. For intermediate and advanced users: You will gain a concrete understanding of how to select packing materials and the usefulness of custom packed columns to improve separations that do not satisfy with existing columns. Participant benefits: We will provide a collection of packed column applications that are not publicly available.

We will be exhibiting at the "P-MEC Japan 2025 Pharmaceutical Ingredients and Equipment Exhibition" held at Tokyo Big Sight. During the event, we will showcase various products. We invite all relevant parties to come and visit us. 【Suppliers】 ・LAUDA

In conversations with engineers in the manufacturing industry, I have increasingly received the following inquiries: - Confusion in interpreting experimental results - Taking time to organize hypotheses regarding the causes of troubles - Uncertainty about how to evaluate the impact of changes in raw materials or processes - Anxiety about the judgment of results from external testing organizations Considering the themes being discussed internally, I thought, "Could there be an opportunity to provide support as a third-party engineer for brainstorming?" Therefore, we have decided to establish a trial "Technical Consultation Opportunity." 【Overview of Technical Consultation】 - Target: Engineers and research and development personnel in the manufacturing industry, etc. - Content: Organizing experimental plans, interpreting results, organizing trouble hypotheses, etc. - Format: Online (approximately 60 minutes) - Cost: Free for the first consultation - Recruitment: Limited to 5 companies *Please note that we will take sufficient care to respect the confidentiality of each company's information and will not disclose anything externally. We hope you can consult with us with confidence. This will be more of a space for open exchange of opinions between researchers and engineers rather than a sales proposal. If you have any themes you are currently considering, please feel free to reach out. If you are interested, please contact us with "Request for Technical Consultation," and we will provide you with further details.