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  3. Measurement and Analysis
  4. Other measuring instruments
  5. Coating thickness gauge
  6. Optical Area Scanner Flying Spot Scanner 310

Optical Area Scanner Flying Spot Scanner 310

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Flying Spot Scanner FSS310

last updated:Oct 22, 2025

プレシテック・ジャパン
プレシテック・ジャパン
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Capable of measuring the total thickness of 12-inch wafers. High-speed measurement without the influence of vibrations, without a scanning stage. Suitable for online, offline, and wafer inspection applications.

The Flying Spot Scanner 310 is an optical measuring device that can perform wide-area (up to φ310) scans using XY2-axis galvanometer mirrors. Since stage scanning is not required, there is no influence from vibrations of the stage. It can measure thickness, dimensional shapes, and inspect surface defects based on the principle of spectral interference. Additionally, due to the coaxial optical system for incident and reflected light, it is possible to obtain good results even on glossy surfaces. 【Features】 ■ Wide-area scan φ310mm ■ High resolution XY20um Beam spot diameter 40um, high Z resolution through spectral interference method ■ No XY stage required, no stage vibrations Area scanning using galvanometer mirrors ■ Reduced development costs and shortened development lead times Software development kit for device integration (DLL, etc.) available ■ Applications Thickness measurement of 12-inch wafer surfaces, thickness measurement of bonded wafers, void inspection *For more details, please refer to the documentation.

    3D measuring deviceCoating thickness gauge
FSS310.png

Optical Area Scanner Flying Spot Scanner 310

FSS310.png
FSS310.png
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For more details, please refer to the PDF document or feel free to contact us.

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P7

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Applications/Examples of results

12-inch wafer surface thickness measurement Bonded wafer thickness measurement Bonded wafer void inspection

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Elias Scanner Flying Spot Scanner 310

Elias Scanner Flying Spot Scanner 310

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White Paper: Thickness Measurement of High Concentration Doped Wafer

White Paper: Thickness Measurement of High Concentration Doped Wafer

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Presitech CHRocodile Sensor Lineup Spectral Interference Thickness Measurement

Presitech CHRocodile Sensor Lineup Spectral Interference Thickness Measurement

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Data Sheet Spectral Interference Sensor Version 20250423

Data Sheet Spectral Interference Sensor Version 20250423

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News about this product(2)

Semicon Japan 2024

  • Seminar・Event

We will be exhibiting at Semicon Japan 2024, which will be held at Tokyo Big Sight from December 11 (Wednesday) to December 12 (Friday). If you are interested, please come to the venue. ■ Products to be exhibited 1. Spectral interference optical thickness sensor CHRocodile 2 DW/ 2IT 2. Area scanner for measuring the thickness and shape of 12" wafers - Flying Spot Scanner (FSS) 3. Chromatic aberration confocal optical line sensor CLS2.0 4. Chromatic aberration confocal line camera CVC 5. Chromatic aberration confocal optical single-point sensor CHRocodile Mini 6. Non-contact thickness measurement sensor for opaque materials Enovasnese 7. Sensor for detecting internal defects non-contactly - Field sensor

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The 1st Kyushu Semiconductor Industry Exhibition

  • Seminar・Event

We will be exhibiting at the Kyushu Semiconductor Industry Exhibition held at Marine Messe Fukuoka on September 25 (Wednesday) and September 26 (Thursday), 2024. If you are interested, please come to the venue. ■ Products to be exhibited - Spectral interference optical thickness sensor CHRocodile 2 DW/2IT - Chromatic aberration confocal optical line sensor CLS2.0 - Chromatic aberration confocal optical single-point sensor CHRocodile 2S, C, Mini *This time, there will be no actual display of the FSS for 12" wafer thickness mapping measurement, but if you need an explanation or would like to request a demo, please come to our booth.

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プレシテック・ジャパン

プレシテック・ジャパン

Testing, Analysis and Measurement

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Presitech is a specialist in laser material processing and optical measurement technology. We are not just a supplier of systems and components, but a professional partner in ensuring a smooth processing process for our customers. We offer consultations from the foundational stage and accurately consult with customers on their requests and objectives. We understand that the key to success in unique processing processes lies in the four components of exhibition, monitoring, processing, and control. Only by doing so can we provide appropriate solutions for our customers' applications. Our high-quality products, such as laser processing heads, quality monitoring systems, and optical measurement systems for spacing/thickness measurement, allow customers to directly benefit from our decades of experience. Our optical sensors are characterized by the highest precision and dynamic adaptability. Furthermore, they detect accurate values even in high-speed measurements.

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