The 1st Kyushu Semiconductor Industry Exhibition

Affordable distance sensors for measuring film and coating thickness, as well as non-contact thickness measurement. Strong performance on slopes, achieving a distance direction resolution of 20nm!

Our optical distance sensor/thickness sensor 'CHRocodile C / CHRocodile Mini' from PreciTech Japan is a compact non-contact sensor with a wide measurement range. It is robust against slopes and offers high resolution in the distance direction starting from 20nm, all at an affordable price of approximately 1 million yen (excluding tax). 【Examples of Use Cases】 ● Complete inspection through height and distance measurement of manufactured products within equipment ● Quality improvement through thickness management of glass, film, and graphite coatings ⇒ Adopted by manufacturers of production equipment, inspection equipment, and integrators. 【Features】 ・Combines high resolution with a price point that lowers the purchasing barrier ・Non-contact measurement of film and coating thickness ・Strong against slopes with an angle tolerance of up to ±45 degrees ・Distance direction resolution starting from 20nm ・Flexible software creation possible with the provided software development kit ・Can be embedded in equipment ・Compatible with rough and mirror surfaces, independent of surface or shape *For product details, please refer to the materials available for download in PDF format. Feel free to contact us for inquiries.

• Distance measuring device

Optical sensor for measuring a wide range of thickness from 0.5 to 200 um. High-speed sampling at 5 kHz. Ideal for monitoring applications during processing.

Non-contact optical thickness measurement. Applicable for thickness measurement of semiconductor wafers where high precision is required. The new product 'CHRocodile 2 SX' is a device that can measure the thickness of materials such as wafers and coatings without contact. It supports high-speed sampling of up to 5 kHz, making it suitable for inline applications. In addition to measuring the thickness of semiconductor wafers like Si, it can also measure the thickness of films, resins, glass, solar cells, and more. In particular, when thickness monitoring is desired during wafer grinding, it can measure thicknesses from 200 µm to 0.5 µm for Si wafers. 【Features】 ■ Wide range of thickness measurement, compatible with various materials With a rich lineup of probes, it can measure thicknesses from thin films (around 2 µm) to thick films (1000 µm) at optical lengths, and from 0.5 to 200 µm for Si. ■ High resolution (sub-micron, minimum 3 nm @ optical length) ■ Contributes to reducing development costs and shortening development lead times, with a software development kit (DLL, etc.) available for device integration ■ Extensive track record in the semiconductor industry *For more details, please refer to the documentation.

• Coating thickness gauge

Capable of measuring the total thickness of 12-inch wafers. High-speed measurement without the influence of vibrations, without a scanning stage. Suitable for online, offline, and wafer inspection applications.

The Flying Spot Scanner 310 is an optical measuring device that can perform wide-area (up to φ310) scans using XY2-axis galvanometer mirrors. Since stage scanning is not required, there is no influence from vibrations of the stage. It can measure thickness, dimensional shapes, and inspect surface defects based on the principle of spectral interference. Additionally, due to the coaxial optical system for incident and reflected light, it is possible to obtain good results even on glossy surfaces. 【Features】 ■ Wide-area scan φ310mm ■ High resolution XY20um Beam spot diameter 40um, high Z resolution through spectral interference method ■ No XY stage required, no stage vibrations Area scanning using galvanometer mirrors ■ Reduced development costs and shortened development lead times Software development kit for device integration (DLL, etc.) available ■ Applications Thickness measurement of 12-inch wafer surfaces, thickness measurement of bonded wafers, void inspection *For more details, please refer to the documentation.

• 3D measuring device
• Coating thickness gauge

Non-contact optical thickness measurement. Applicable even for thickness measurements of semiconductor wafers where high precision is required.

The new product "CHRocodile 2LR ver2" is a device that can non-contact measure the thickness of materials such as wafers and coatings. It adopts a new detector different from the previous "CHRocodile 2LR," allowing for approximately twice the thickness measurement range and more precise measurements. It can also be applied inline, and the CHRocodile 2LR has a proven track record with many customers. It is capable of measuring the thickness of semiconductor wafers like Si, as well as films, resins, glass, and solar cells. It supports interference film thickness of up to 16 layers. 【Features】 　■ Wide thickness measurement range, compatible with various materials 　　　With a rich lineup of probes, it covers thicknesses from thin films (around 32μm) to thick films (3900μm). (The high-precision measurement range is 16~1900μm with linearity of 0.35μm) 　■ High resolution (sub-micron, minimum 1nm) 　■ Contributes to reducing development costs and shortening development lead times, 　　　with a software development kit (DLL, etc.) available for device integration 　■ Extensive track record in the semiconductor industry *For more details, please refer to the documentation.

• Coating thickness gauge
• Other inspection equipment and devices

In addition to the conventional chromatic aberration confocal method and spectral interference method, a thickness measurement sensor utilizing laser heating has also emerged. It can measure the thickness of both transparent and opaque materials non-contactly.

Presitech is a German manufacturer of non-contact sensors. It develops and manufactures optical sensors using chromatic aberration confocal method and spectral interference method. At the end of 2022, it acquired the French company Enovasense, adding sensors that utilize laser heating to measure the thickness of opaque materials to its lineup. The company specializes in high-speed and high-precision thickness measurement, which is used for inspecting wafers, coatings, films, paint films, anti-corrosion coatings, and more. It offers a wide measurement range, tolerance angles, and can accommodate various materials, including line sensors and area scanners suitable for full surface measurement. There are numerous achievements in integrating these sensors into semiconductor manufacturing equipment, and they are also used in LCD manufacturing equipment and inline inspection of films. Additionally, they are utilized as embedded sensors for tabletop machines such as standalone units. Enovasense's sensors have also demonstrated success in measuring coating thickness for aerospace-related components. *For product details, please refer to the materials available for download in PDF format. Feel free to contact us with any inquiries.*

• Sensors

Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

The "CHROCODILE CLS2" and "CHROCODILE CLS2 PRO" can achieve non-contact high-speed three-dimensional shape measurement at a maximum of 48 million points per second (standard is 16.8 million points per second). The resolution is also extremely high, with a maximum of Y1um and Z0.025um, allowing for very precise measurements. Compared to previous generations, there has been a significant reduction in measurement time, and improvements have been made for high NA and increased light volume suitable for wafer edges, wire bonding, and micro bump measurements. There are numerous applications including shape, surface roughness, step height (thickness), flatness, and TTV. It is suitable not only as a tabletop device but also for use as a sensor for in-situ, monitoring, and inline equipment integration. 【Features】 - Three-dimensional shape measurement over a wide area Maximum line width of 20mm - Wide tolerance angle Can accommodate ±53° on reflective surfaces, suitable for edges and steep slopes - Contributes to reduced development costs and shortened development lead times, with a compact unit and a software development kit for equipment integration (such as DLLs) also available - Rich track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field *For more details, please refer to the documentation.

• 3D measuring device

The "CHRocodile 2 IT sensor" can measure the thickness of wafers during work processing.

In the semiconductor industry, it is necessary to measure the physical thickness of wafers at multiple manufacturing stages, such as CMP and mechanical grinding. To monitor and optimize the entire process, it is important to have a grasp of the thickness; however, this task is currently mainly performed using mechanical contact probes. These probes have significant drawbacks, including the need for contact with the wafer, surface damage, and reference values for thickness measurement from the chuck table, and they also wear out, necessitating frequent replacements. Our "CHRocodile 2 IT sensor" can measure the thickness of wafers during processing using non-contact, non-destructive optical measurement technology. 【Features】 - Optical sensor provides more accurate results than conventional contact measurement devices. - Direct feedback improves the reproducibility of wafer thickness from several micrometers to less than 0.5 micrometers. - High-speed measurement and non-contact passive probes allow for the acquisition of a large amount of thickness data across the entire wafer area simply by moving the probe over the sample. - Variability in wafer thickness is revealed from the results, enabling the management of variability during the grinding process. *Product details can be viewed in the materials available for download in PDF format.

• Sensors

The "CHRocodile 2 DPS color aberration confocal sensor" is equipped with two independent measurement channels.

In grinding operations, it is necessary to adjust the thickness of the wafer during processing. If using a non-contact, non-destructive optical measurement method, the thickness of the wafer can be monitored during processing without applying stress to the workpiece or damaging it, making it a suitable solution. Our "CHRocodile 2 DPS Chromatic Aberration Confocal Sensor" is equipped with two independent measurement channels. The sensor processes two chromatic aberration probes and synchronizes measurements and outputs in real-time, providing the final height and thickness of the wafer. 【Features】 ■ Development of chromatic aberration probes for harsh environments based on over 10 years of know-how in CMP and grinding interference measurement. ■ Non-contact measurement of wafer thickness in harsh environments. ■ Data acquisition rate of 10 kHz per probe. *For more details, please refer to the PDF document or feel free to contact us.

• Sensors

Use an appropriate light source wavelength for doped wafers to accommodate challenging doped wafer thickness measurements.

The "CHRocodile 2DW Series" is a device that can non-contact measure the thickness of materials such as wafers and coatings. It is capable of measuring doped wafers and can be applied in-line, with a proven track record among many customers. In addition to measuring the thickness of semiconductor wafers like sapphire, Si, and SiC, it can also measure the thickness of films, resins, glass, and solar cells. It supports interference film thickness of up to 16 layers. 【Features】 　■ Wide range of thickness measurement, compatible with various materials 　　　With a rich lineup of probes, it covers thickness from thin films (a few micrometers) to thick films (780 micrometers). It supports doped wafers. 　■ High resolution (sub-micron, minimum 1nm) 　■ Contributes to reducing development costs and shortening development lead times, 　　　with a software development kit (DLL, etc.) available for device integration 　■ Extensive track record in the semiconductor industry *For more details, please refer to the documentation. Feel free to contact us with any inquiries.

• Other measurement, recording and measuring instruments
• Sensors

12" wafer full inspection accelerated, can also be used for full inspection of wafers.

The TTV, Bow, and Warp measurements of the entire wafer can be performed. With a measurement speed of up to 70,000 points per second, it is possible to measure the entire surface in about 2 minutes with a pitch of 160 µm in the XY direction. This is a full system equipped with software compliant with SEMI standards. The sensors used can be selected from our spectral interference sensor 2IT DW series, allowing for high-precision measurements with a Z resolution of 1 nm or better. The high-speed measurement of the entire wafer is made possible by our area scanner FSS310, which is incorporated into the system.

• Coating thickness gauge

The latest published paper utilized Abby. This will be an online seminar featuring Associate Professor Yosuke Katsuta from the Graduate School of Advanced Science and Technology, Kumamoto University, who is also a co-founder of StapleBio. He is working on RNA hacking technology development aimed at altering the higher-order structure of target mRNA using short nucleic acids named Staple nucleic acids, with the goal of controlling gene expression. He will present the latest data focusing on the results of cell experiments and animal experiments in the development of this technology. Related paper on the lecture content: "Staple oligomers induce a stable RNA G-quadruplex structure for protein translation inhibition in therapeutics" | Nature Biomedical Engineering

Are you casually adopting AC adapters just because they are cheap? AC adapters carry inherent risks of electric shock and smoke or fire hazards, and incidents of fires due to design flaws from choosing low-cost products have occurred. When accidents involving electric shock or smoke and fire occur, not only do they lead to significant costs for post-incident handling and recall responses, but they also result in a decline in brand image, which can severely impact management. Therefore, it is essential to eliminate defect risks at the adoption stage. In this webinar, we aim to provide insights for evaluation during the adoption process by introducing case studies of market failure analysis of AC adapters that our company has experienced over the past several decades. We explain the content as simply and clearly as possible, so even those without prior knowledge of AC adapters are welcome to attend.

[Speaker] Shota Imai, President and CEO of GenesisAI, Inc. / Visiting Professor at the Graduate School of Advanced Science and Technology, Hokuriku University [Key Lecture Content] Generative AI is likely the greatest technological revolution in human history. As of 2025, generative AI possesses knowledge comparable to that of PhD holders and is capable of generating moving images that take physical laws into account. Furthermore, generative AI, which was previously focused on content generation, has evolved into AI agents capable of handling lengthy and complex tasks, enabling automation in research, software development, and scientific inquiry. While there are significant economic benefits from increased productivity, the concern of "losing jobs to AI" has become a realistic issue. This lecture will explain the outlook for the development of these AI technologies and their impact on society based on research conducted as of 2025. [Lecture Items] 1. Latest Research on Generative AI 2. Latest Research on AI Agents 3. Physical AI and World Models 4. Future Prospects for AI Development Based on Scaling Laws 5. AI for Scientific Research 6. AI and Labor 7. Q&A / Business Card Exchange

[Key Lecture Content] 1. Research and Development of NTT's LLM "tsuzumi2" NTT Corporation Human Information Research Laboratory, Thought Processing Research Project Group Leader: Kuniko Saito 1. Objectives of "tsuzumi2" Development 2. Key Points of "tsuzumi2" Evolution 3. Introduction to "tsuzumi2" Utilization Images 4. Q&A / Business Card Exchange 2. Business Trends of NTT's LLM "tsuzumi2" Research and Development Marketing Headquarters, Marketing Division R&D Marketing Manager: Ichiro Kudo 1. Market Trends and NTT's Initiatives in AI Business 2. Areas of Utilization and Applications of "tsuzumi2" 3. Collaborations with Partners for "tsuzumi2" 4. Key Points for Practical Utilization 5. Q&A / Business Card Exchange

Daitron will host a webinar with Professor Yamamoto from Nagoya University’s Institute of Future Materials and Systems on the topic of "The Capabilities of Chinese EV Manufacturers in Electric Vehicle Design and the Technological Strategies the Japanese Automotive Industry Should Adopt Against Tesla's Pioneering Efforts." We sincerely look forward to your registration.