Photonix Osaka Exhibition - Light and Laser Technology Exhibition

Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

The "CHROCODILE CLS2" and "CHROCODILE CLS2 PRO" can achieve non-contact high-speed three-dimensional shape measurement at a maximum of 48 million points per second (standard is 16.8 million points per second). The resolution is also extremely high, with a maximum of Y1um and Z0.025um, allowing for very precise measurements. Compared to previous generations, there has been a significant reduction in measurement time, and improvements have been made for high NA and increased light volume suitable for wafer edges, wire bonding, and micro bump measurements. There are numerous applications including shape, surface roughness, step height (thickness), flatness, and TTV. It is suitable not only as a tabletop device but also for use as a sensor for in-situ, monitoring, and inline equipment integration. 【Features】 - Three-dimensional shape measurement over a wide area Maximum line width of 20mm - Wide tolerance angle Can accommodate ±53° on reflective surfaces, suitable for edges and steep slopes - Contributes to reduced development costs and shortened development lead times, with a compact unit and a software development kit for equipment integration (such as DLLs) also available - Rich track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field *For more details, please refer to the documentation.

• 3D measuring device

For high-precision thickness measurement of opaque materials, Enovasense's laser photo-thermal sensor can measure thickness from a minimum of 10nm, regardless of the material.

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. ■Features - Non-contact measurement of the thickness of opaque materials is possible, eliminating the need for destructive testing. - A wide measurement range from a minimum of 10nm to a maximum of 1mm. - High precision measurements of 0.5% to 3% or less are achievable, recommended for those lacking accuracy. - Capable of measuring various combinations of materials regardless of the base material. ■Applications Used in a wide range of fields including the automotive industry, aerospace industry, consumer goods, industrial products, medical industry, and semiconductors, for various applications such as coating thickness, metal plating thickness, and paint film thickness. *Currently, Enovasense is a group company of the German optical sensor manufacturer Precitec. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Coating thickness gauge

An all-in-one scanner that can weld workpieces under optimal conditions through ultra-fast shape recognition.

■ A scanner optical system equipped with all functions for tracking, monitoring, and inspection. ■ All functions are consolidated into a single control device, making control from the PLC easy. ■ All settings, editing, and management can be performed through a GUI displayed on a single monitor, making operation easy. ■ Since ScanMaster controls all functions during processing, communication time for control from the PLC is reduced, significantly shortening processing time. ■ Not only XYZ correction but also control of welding trajectories and laser power based on the workpiece's gap, steps, and shape, aiming for zero welding defects. <Representative functions equipped in ScanMaster> - 2D scanner enabling dynamic processing - Motor-driven collimator for high-precision adjustment of laser focus - OCT for accurately measuring the height of the workpiece - LPM sensor for measuring laser power passing through the processing head - LWM for assessing processing quality during laser welding using plasma, temperature, and reflected light - Sensor camera for accurately detecting welding points through images - Light to brightly illuminate the workpiece and cross jet to prevent spatter adhesion

• Welding Machine

It is possible to obtain the quality assessment results of the product simultaneously with the completion of laser welding. It is equipped with a user-friendly GUI that facilitates easy operations such as data linking, review, and analysis.

■ Monitoring plasma light, radiation temperature, and laser reflection light during laser welding to determine product quality. ■ The software used for judgment and analysis has improved its judgment capability, performance, and functionality through over 20 years of sales experience and customer feedback. ■ Easy to add not only to new equipment but also to existing equipment. ■ Proven track record as an inspection device for various laser welding applications in the automotive industry, EVs, home appliances, and more. We have demo units available and look forward to your inquiries. Whether you are familiar with the previous LWM or are trying it for the first time, we encourage you to experience the latest LWM.

• Welding Machine

A metal shaping head that reduces labor to the limit, allowing for the reduction of unnecessary costs and time! The processing speed is significantly faster, achieving stable shaping and processing!

The coaxial wire supply method laser cladding welding "CoaxPrinter" is a laser cutting head capable of handling a wide range of applications in additive manufacturing, from filigree structures to complex shapes and designs. It can be used for 3D printing, prototype manufacturing, and protection against wear, achieving uniform cladding quality that is independent of direction. 【Features】 ■ Coaxial laser processing head that focuses a ring-shaped laser around the wire ■ No need for alignment between the wire and laser... reduces labor for skilled technicians ■ The head is slim, with no restrictions on welding direction... non-directional processing ■ Reduces waste of wire that was previously discarded during alignment... lowers material costs ■ Eliminates leftover wire at the end of welding, so there is no need to cut the wire with nippers after each processing... reduces workforce ■ The wide tolerance in the Z direction makes it less likely for processing defects due to focal shift... reduces defective products ■ The approaching laser focuses on the wire, warming it before processing... dramatically increases processing speed *For more details, please download the PDF or contact us directly.

• Welding Machine
• Welding robot

Area sensor for internal defect inspection after welding as a substitute for X-rays, with over 15,000 units of monitoring systems during welding in operation.

1. Area sensor for internal defect inspection in welding - Field sensor Capable of simultaneous measurement of 110,000 points with image output. Replaces electron microscopes that require X-ray, CT scans, and work cuts. 2. Non-contact thickness measurement sensor for opaque materials - Enovasense Capable of measuring the thickness of resins, coatings, and metal coatings. Measurement range is 10nm to 1mm, with a measurement speed of 1 second or more, and measurement variation is approximately 0.5% to 3%. 3. Line camera for burr inspection after battery foil cutting - CVC A line camera with a maximum of 100kHz, capable of inline burr detection. 4. Insulation layer thickness measurement sensor - FSS Measures the thickness profile of battery insulation layers inline with a resolution of a few nm. 5. Dual point sensor for electrode thickness measurement - DPS Enables high-precision thickness measurement with a distance sensor of a few nm resolution. ■ Others 6. Line sensor for 3D shape measurement of battery can welds - CLS 7. - LWM

• Defect Inspection Equipment

[Speaker] Ministry of Land, Infrastructure, Transport and Tourism, Road Bureau, Planning Division, Road Economic Research Office Planning Specialist Yuki Endo [Key Lecture Content] The Ministry of Land, Infrastructure, Transport and Tourism is advancing discussions on the realization of automated logistics roads as a new form of logistics in response to recommendations from the "Interim Summary on the State of High-Standard Road Networks," addressing logistics crises and carbon neutrality. This lecture will introduce the final summary on the state of automated logistics roads published in July of the 7th year of Reiwa, as well as the demonstration experiments planned for the 7th year of Reiwa. [Lecture Items] 1. Final summary on automated logistics roads 2. Demonstration experiments for the 7th year of Reiwa 3. Q&A / Business card exchange

[Speaker] NTT Docomo Business Inc. 5G & IoT Services Department Director in charge of Global Connected Cars, Yuji Tamai [Key Lecture Content] The value of SDV lies in continuously cycling 'updates × data × cloud', and connectivity is a prerequisite for this. In this presentation, we will organize the barriers of quality, cost, and regulation faced in global expansion, and explain the design principles and operational models from roaming enhancement, eSIM/RSP (SGP.32), integrated management (CMP), NTN, to Network API. Additionally, we will delve into security aspects related to connectivity, introducing phenomena observed in actual service operations and their countermeasures, as well as exploring other operational updates (staged delivery, avoiding simultaneous activation, monitoring/observability). [Lecture Items] 1. Positioning of connectivity in SDV 2. Barriers to global connectivity 3. Designing to "strengthen" roaming 4. eSIM/RSP and SGP.32 5. Integrated connectivity management (CMP) and operations 6. Further connectivity - NTN and Network API 7. Security and update operations 8. Q&A

"Even though I'm communicating, nothing changes." "When I give a warning, the atmosphere gets worse." — Are you trying to solve these problems just by changing how you interact? What you need is not to move people, but to create a workplace that is easy to navigate. I will explain based on numerous examples of on-site improvements that I have supported. Held on May 27 (Wednesday). Please check the LP for more details. ▼ For more information and registration (free), see below.

At the Dry Fog Humidification System Free Demo Experience, you will have the opportunity to actually experience our Dry Fog, as well as our single-fluid and dual-fluid humidifiers. We will explain the differences from conventional humidifiers and the effects of implementation. In addition to introducing the latest case studies, we will also provide time for you to consult directly with our specialized staff. Please select a convenient venue and date from the application page and apply. * The "morning session" and "afternoon session" contain the same content. Please participate at a time that suits you. * This event is intended for users only. Participation from trading companies, other companies in the same industry, or for sales purposes to our company is not permitted. Venues: ■ Yamagata Venue: 3/12 (Wed) at Yamagata International Exchange Plaza 3/13 (Thu) at Sakata Chamber of Commerce and Industry ■ Sendai Venue: 3/14 (Fri) at Kiri no Ikeuchi Sendai Branch ■ Tokyo Venue & Osaka Venue: 3/18 (Tue), 3/19 (Wed), 3/21 (Fri) at Kiri no Ikeuchi Tokyo Sales Office & Kiri no Ikeuchi Osaka Headquarters ■ Nagoya Venue & Fukuoka Venue: 4/9 (Wed), 4/10 (Thu), 4/11 (Fri) at Kiri no Ikeuchi Nagoya Sales Office & Kiri no Ikeuchi Fukuoka Sales Office

In recent years, as many companies are considering modernization, exploring methods for system renewal has become an important issue. This seminar will focus on "Rewrite," one of the solutions to such challenges, and will explain questions and issues encountered during project promotion in a Q&A format. <Program> - Opening - How to advance system renewal through "Rewrite" and key points for problem-solving - Introduction of unique tools to support migration <Recommended for> - Those who are struggling with specific methods for system renewal - Those who are concerned about the continuity of maintenance for existing systems and a shortage of personnel - Companies that own IBM i (AS/400) *We may refuse applications from competing companies or those not eligible to participate.