High-speed and wide-range 3D shape measurement with sub-micron accuracy. Features a wide tolerance angle that can accommodate edges and slopes. Suitable for wafer inspection applications as well.
The "CHRocodile CLS" enables high-speed 3D shape measurement at 1 million points per second. It also offers very high precision with a maximum resolution of XY 1µm and Z 0.02µm. We provide up to six types of measurement heads based on range, resolution, and accuracy, and it can be applied inline as well. 【Features】 ■ Non-contact 3D shape measurement over a wide area Maximum line width of 8.3mm ■ Wide acceptance angle Can accommodate reflective surfaces at ±45°, edges, and steep slopes ■ Contributes to reduced development costs and shortened development lead times, with a compact unit and a software development kit (DLL, etc.) for equipment integration available ■ Extensive track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field *For more details, please refer to the materials. Feel free to contact us with any inquiries.
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【Application】 Non-contact 3D shape measurement is possible. It is also possible to replace contact methods with non-contact methods. ■ Home Appliances (Smartphones) - LCD Glass - OLED Mask Inspection - Fine scratches and other surface defects - Wire Bonding - AR Glasses ■ Semiconductor Manufacturing Process - Defect Inspection - BGA Inspection - IC Package and Circuit Inspection ■ Automotive - Valve Inspection - Car Interior - Glass Inspection - Inspection of Airbag Welding Beads
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Wafer shape measurement before and after wafer processing (such as polishing), during processing, edge appearance inspection, measurement of misalignment in bonded wafers, TTV, flatness, wire bonding shape, micro bump shape, weld shape, PCB shape, non-contact distance sensors mounted on CMM, etc. 【Keywords: Applications, Measurement Items, Benefits, etc.】 Optical sensors, non-contact sensors, confocal, height, surface roughness, shape, appearance, edge, slope, measurement, inspection, high speed, 3D shape, line sensors, line scan, full surface measurement, high precision, high speed, In-Situ, during processing, before and after processing, semiconductors, semiconductor wafers, Si wafers, GaAs, InP, SiC, LiNbO3 (LN), LiTaO3 (LT), GaN, SiP, Al2O3 (sapphire), dicing grooves, transparent, transparent bodies, black, glossy, mirror finish, simple.
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Company information
Presitech is a specialist in laser material processing and optical measurement technology. We are not just a supplier of systems and components, but a professional partner in ensuring a smooth processing process for our customers. We offer consultations from the foundational stage and accurately consult with customers on their requests and objectives. We understand that the key to success in unique processing processes lies in the four components of exhibition, monitoring, processing, and control. Only by doing so can we provide appropriate solutions for our customers' applications. Our high-quality products, such as laser processing heads, quality monitoring systems, and optical measurement systems for spacing/thickness measurement, allow customers to directly benefit from our decades of experience. Our optical sensors are characterized by the highest precision and dynamic adaptability. Furthermore, they detect accurate values even in high-speed measurements.
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