Nepcon Japan 2026

For high-precision thickness measurement of opaque materials, Enovasense's laser photo-thermal sensor can measure thickness from a minimum of 10nm, regardless of the material.

The sensors from the French company Enovasense are high-performance sensors that use laser photothermal technology to measure the thickness of opaque materials non-contactly. ■Features - Non-contact measurement of the thickness of opaque materials is possible, eliminating the need for destructive testing. - A wide measurement range from a minimum of 10nm to a maximum of 1mm. - High precision measurements of 0.5% to 3% or less are achievable, recommended for those lacking accuracy. - Capable of measuring various combinations of materials regardless of the base material. ■Applications Used in a wide range of fields including the automotive industry, aerospace industry, consumer goods, industrial products, medical industry, and semiconductors, for various applications such as coating thickness, metal plating thickness, and paint film thickness. *Currently, Enovasense is a group company of the German optical sensor manufacturer Precitec. *For more details, please refer to the materials. Feel free to contact us with any inquiries.

• Coating thickness gauge

In addition to the conventional chromatic aberration confocal method and spectral interference method, a thickness measurement sensor utilizing laser heating has also emerged. It can measure the thickness of both transparent and opaque materials non-contactly.

Presitech is a German manufacturer of non-contact sensors. It develops and manufactures optical sensors using chromatic aberration confocal method and spectral interference method. At the end of 2022, it acquired the French company Enovasense, adding sensors that utilize laser heating to measure the thickness of opaque materials to its lineup. The company specializes in high-speed and high-precision thickness measurement, which is used for inspecting wafers, coatings, films, paint films, anti-corrosion coatings, and more. It offers a wide measurement range, tolerance angles, and can accommodate various materials, including line sensors and area scanners suitable for full surface measurement. There are numerous achievements in integrating these sensors into semiconductor manufacturing equipment, and they are also used in LCD manufacturing equipment and inline inspection of films. Additionally, they are utilized as embedded sensors for tabletop machines such as standalone units. Enovasense's sensors have also demonstrated success in measuring coating thickness for aerospace-related components. *For product details, please refer to the materials available for download in PDF format. Feel free to contact us with any inquiries.*

• Sensors

Non-contact line sensor CLS. High precision, high speed, and wide range 3D shape measurement. High tolerance for angles suitable for edges and slopes. Numerous achievements in wafer edge measurement.

The "CHROCODILE CLS2" and "CHROCODILE CLS2 PRO" can achieve non-contact high-speed three-dimensional shape measurement at a maximum of 48 million points per second (standard is 16.8 million points per second). The resolution is also extremely high, with a maximum of Y1um and Z0.025um, allowing for very precise measurements. Compared to previous generations, there has been a significant reduction in measurement time, and improvements have been made for high NA and increased light volume suitable for wafer edges, wire bonding, and micro bump measurements. There are numerous applications including shape, surface roughness, step height (thickness), flatness, and TTV. It is suitable not only as a tabletop device but also for use as a sensor for in-situ, monitoring, and inline equipment integration. 【Features】 - Three-dimensional shape measurement over a wide area Maximum line width of 20mm - Wide tolerance angle Can accommodate ±53° on reflective surfaces, suitable for edges and steep slopes - Contributes to reduced development costs and shortened development lead times, with a compact unit and a software development kit for equipment integration (such as DLLs) also available - Rich track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field *For more details, please refer to the documentation.

• 3D measuring device

[Speaker] Ministry of Land, Infrastructure, Transport and Tourism, Road Bureau, Planning Division, Road Economic Research Office Planning Specialist Yuki Endo [Key Lecture Content] The Ministry of Land, Infrastructure, Transport and Tourism is advancing discussions on the realization of automated logistics roads as a new form of logistics in response to recommendations from the "Interim Summary on the State of High-Standard Road Networks," addressing logistics crises and carbon neutrality. This lecture will introduce the final summary on the state of automated logistics roads published in July of the 7th year of Reiwa, as well as the demonstration experiments planned for the 7th year of Reiwa. [Lecture Items] 1. Final summary on automated logistics roads 2. Demonstration experiments for the 7th year of Reiwa 3. Q&A / Business card exchange

[Speaker] NTT Docomo Business Inc. 5G & IoT Services Department Director in charge of Global Connected Cars, Yuji Tamai [Key Lecture Content] The value of SDV lies in continuously cycling 'updates × data × cloud', and connectivity is a prerequisite for this. In this presentation, we will organize the barriers of quality, cost, and regulation faced in global expansion, and explain the design principles and operational models from roaming enhancement, eSIM/RSP (SGP.32), integrated management (CMP), NTN, to Network API. Additionally, we will delve into security aspects related to connectivity, introducing phenomena observed in actual service operations and their countermeasures, as well as exploring other operational updates (staged delivery, avoiding simultaneous activation, monitoring/observability). [Lecture Items] 1. Positioning of connectivity in SDV 2. Barriers to global connectivity 3. Designing to "strengthen" roaming 4. eSIM/RSP and SGP.32 5. Integrated connectivity management (CMP) and operations 6. Further connectivity - NTN and Network API 7. Security and update operations 8. Q&A

"Even though I'm communicating, nothing changes." "When I give a warning, the atmosphere gets worse." — Are you trying to solve these problems just by changing how you interact? What you need is not to move people, but to create a workplace that is easy to navigate. I will explain based on numerous examples of on-site improvements that I have supported. Held on May 27 (Wednesday). Please check the LP for more details. ▼ For more information and registration (free), see below.

At the Dry Fog Humidification System Free Demo Experience, you will have the opportunity to actually experience our Dry Fog, as well as our single-fluid and dual-fluid humidifiers. We will explain the differences from conventional humidifiers and the effects of implementation. In addition to introducing the latest case studies, we will also provide time for you to consult directly with our specialized staff. Please select a convenient venue and date from the application page and apply. * The "morning session" and "afternoon session" contain the same content. Please participate at a time that suits you. * This event is intended for users only. Participation from trading companies, other companies in the same industry, or for sales purposes to our company is not permitted. Venues: ■ Yamagata Venue: 3/12 (Wed) at Yamagata International Exchange Plaza 3/13 (Thu) at Sakata Chamber of Commerce and Industry ■ Sendai Venue: 3/14 (Fri) at Kiri no Ikeuchi Sendai Branch ■ Tokyo Venue & Osaka Venue: 3/18 (Tue), 3/19 (Wed), 3/21 (Fri) at Kiri no Ikeuchi Tokyo Sales Office & Kiri no Ikeuchi Osaka Headquarters ■ Nagoya Venue & Fukuoka Venue: 4/9 (Wed), 4/10 (Thu), 4/11 (Fri) at Kiri no Ikeuchi Nagoya Sales Office & Kiri no Ikeuchi Fukuoka Sales Office

In recent years, as many companies are considering modernization, exploring methods for system renewal has become an important issue. This seminar will focus on "Rewrite," one of the solutions to such challenges, and will explain questions and issues encountered during project promotion in a Q&A format. <Program> - Opening - How to advance system renewal through "Rewrite" and key points for problem-solving - Introduction of unique tools to support migration <Recommended for> - Those who are struggling with specific methods for system renewal - Those who are concerned about the continuity of maintenance for existing systems and a shortage of personnel - Companies that own IBM i (AS/400) *We may refuse applications from competing companies or those not eligible to participate.