Notice of Participation in the Okayama Technology Exhibition (OTEX) 2024 from November 13 (Wednesday) to November 14 (Thursday), 2024.

Anyone can easily and simply introduce DAIKI ROBOTICS original "Teaching-less" palletizer.

Packaging of palletizing robots used in the final processes of factories and logistics warehouses. Utilizing OnRobot's 'D:PLOY' as the core technology, the palletizing program for robots becomes easier, significantly reducing the time required for implementation and changes in application! Additionally, by keeping the price affordable, robot palletizers have become more accessible. <<Control Device: OnRobot "D:PLOY">> This is a teaching-less application controller that significantly reduces the time, engineering personnel, and costs associated with setting up traditional robot systems. With just three simple steps, it allows for system construction without the need for robot teaching.

• Transport and handling robots

- Robot solutions focused on coexistence with humans -

MiR (Mobile Industrial Robots) differs from unmanned guided vehicles (AGVs) that use guides like magnetic tape, as it features state-of-the-art laser scanners and 3D cameras that provide high safety, allowing for autonomous navigation while avoiding people and obstacles. 【Features】 ■ Extensive lineup Depending on the transport weight, you can choose from three models: MiR250/MiR600/MiR1350. The hook-type MiR250, suitable for towing applications, can tow up to 500 kg. 【We have demo units available!】 At Daiki Sangyo Osaka Lab Takami DC (Yao City, Osaka Prefecture), we have actual units of 《MiR250》《MiR250Hook》《MiR1350》! At Daiki Sangyo Tokyo Lab (Kawaguchi City, Saitama Prefecture), we have demo units of 《MiR250》《MiR250Hook》! Please come and see MiR in action!

• Transport and handling robots

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

HP Inc. will hold the "HP Future of Work AI Conference 2025" at Tokyo International Forum, Hall B. At this event, under the message "Freedom to be particular about how we work," we will introduce the possibilities of on-device AI and its practical applications, along with case studies and technological trends. Whether you are considering implementing AI or have already started using it, you are sure to find hints for your next steps. We sincerely look forward to your attendance.

Nitto Kohki will exhibit at the "30th Mechanical Components Technology Exhibition [Tokyo]" held at Makuhari Messe Hall 5 from July 9 (Wednesday) to July 11 (Friday). [Booth Number: Hall 5 31-32] At this exhibition, we will showcase a variety of products, including the electric suction hand "e-VEE" with a built-in pump that does not require compressed air, a cordless belt sander, the electric driver "Delvo" that can be mounted on robots, and the "Flow Monitor" that allows for easy visualization of the flow of cooling water in molds and other applications.

Providing Solutions to Support Your Business Challenges We warmly invite you to visit our booth at K 2025 to learn more about our approach and explore our latest innovations. 【K 2025】 – The World's No.1 Trade Fair for Plastics and Rubber Exhibition Dates : October 8 (Wed) – October 15 (Wed), 2025 Venue : Messe Düsseldorf, Düsseldorf, Germany Opening Hours : 10:00 AM – 6:00 PM (local time) MATSUI Booth : Hall 11 – Booth I53

[Lecturer] Kazuhisa Yuki, Professor, Department of Mechanical Engineering, Faculty of Engineering, Yamaguchi University of Science and Technology [Key Lecture Content] Currently, the world is facing a serious energy crisis and environmental issues. Particularly, due to the rapidly growing highly information-oriented society, the power demand of global AI data centers is expected to double from the 2024 level, surpassing Japan's total electricity consumption. In the future, to achieve a rich highly information-oriented society while maintaining carbon neutrality, securing a cheap and stable power supply is essential, and energy conservation in data centers will become the most important challenge. Against this backdrop, two-phase liquid immersion cooling technology, which can significantly reduce power input associated with cooling while achieving high cooling performance, is attracting attention. In this lecture, we will discuss efficient cooling technologies for data centers, evaluated based on cooling performance (air cooling/liquid cooling/liquid immersion technology), and outline the potential and technical challenges of liquid immersion cooling technology in particular.