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  1. Home
  2. Electronic Components and Semiconductors
  3. JOHNAN DMS
  4. We will exhibit at the 3rd Monozukuri ODM/EMS Exhibition (Osaka) (high-density mounting, discrete mounting, etc.).
SEMINAR_EVENT
  • Oct 02, 2024
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Oct 02, 2024

We will exhibit at the 3rd Monozukuri ODM/EMS Exhibition (Osaka) (high-density mounting, discrete mounting, etc.).

JOHNAN DMS JOHNAN DMS
We will be exhibiting at the 3rd Monozukuri ODM/EMS Exhibition (Osaka). At our booth, we will introduce our circuit board assembly services. Additionally, we will showcase products utilizing paper circuit board assembly and functional film assembly technologies. We offer a wide range of solutions from cutting-edge high-density assembly to discrete assembly. If you are facing challenges with circuit board assembly, please visit our booth. ▪ Website We provide detailed information about our specific services. https://www.johnan.com/dms/mounting/ ▪ Contact Information Website: https://www.johnan.com/dms/contact/ Phone: 0774-43-1431
Date and time Wednesday, Oct 02, 2024 ~ Friday, Oct 04, 2024
10:00 AM ~ 05:00 PM
Capital Intex Osaka (Exhibition Booth: Hall 5, Booth Number 33-32)
Entry fee Free
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Introduction to miniaturization services for products through high-density packaging.

Supports ultra-small chip mounting on various substrate materials, as well as high-speed and multi-variety component mounting.

JOHNAN DMS Corporation contributes to the miniaturization and modularization of products through high-density mounting, such as 0201 implementation and minimum 0.1mm gap mounting. We support consistent manufacturing from substrate mounting to product assembly, inspection, and finished products, accommodating ultra-small chips. Target substrates: aluminum substrates, flexible substrates, high multilayer substrates, paper substrates, paper phenol, PET film, etc. For more detailed service information (supported substrates, types of solder, mounting capabilities), please visit our website. https://www.johnan.com/dms/mounting/pcb/ 【Contact Information】 TEL: 0774-43-1431 Website: https://www.johnan.com/dms/contact/

  • Other electronic parts

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Utilization of discrete implementation axial and radial implementation machines.

Support for component mounting using an axial radial component inserter.

JOHNAN DMS supports various fields of assembly that cannot be handled by surface mounting using axial radial component insertion machines. We provide a one-stop solution tailored to our customers' needs, offering component procurement, PCB assembly, product assembly, and quality inspection. We also accommodate mixed assembly that combines SMT assembly and insertion assembly technologies. We have manufacturing bases both domestically and internationally, and we also offer contract manufacturing overseas. For more details, please refer to the related links.

  • Circuit board design and manufacturing

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A paper substrate is capable of deformation such as "folding and bending."

Would you like to expand the possibilities of product ideas for decoration using paper-based materials?

A paper circuit board is one that has a silver pattern printed directly on the paper itself, with components mounted on top of it. Paper circuit boards are thin and flexible, allowing for deformation such as "folding and bending," making them suitable for various applications, including products that can be attached to interiors or given as gifts. Post-assembly forming processes are also easy, and circuits can be cut by hand. Website "Paper Circuit Board Mounting" https://www.johnan.com/dms/mounting/paper/ 【Examples】 Products featuring LED components attached to origami and fans. <Presented in a video!> This video clearly demonstrates the flexibility of paper circuit boards. (Approximately 1 minute and 30 seconds) ~I tried folding a paper crane with a paper circuit board~ https://www.youtube.com/watch?v=-5_kg2Uqmrs&t=6s ■Contact Information TEL: 0774-43-1431 Website: https://www.johnan.com/dms/contact/

  • Chip type LED

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Product design outsourcing

Experienced engineers realize optimal product development! We bring your vision to life.

We would like to introduce our "Product Design Contracting" services. We provide technical support for a wide range of product design, from analog design of electronic components and devices to digital design. We cater to diverse design needs, turning our customers' ideas into reality, and offer consistent support from prototyping to mass production. Additionally, through EOL design support, we address issues related to discontinued parts and insufficient design data, contributing to cost reduction and efficiency in product development and parts supply. For more details, please refer to the related links.

  • Prototype Services
  • Calibration and repair
  • Other contract services

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Electronic Components and Semiconductors
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■Notice of Participation in "Data Center EXPO"■ 【October 23, 2024 (Wednesday) to October 25, 2024 (Friday)】

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  • SEMINAR_EVENT

Nitto Kohki will be exhibiting at the "Data Center EXPO" held at Makuhari Messe Hall 1 from Wednesday, October 23 to Friday, October 25. [Booth Number: A6-23] At this exhibition, we will showcase the "Compact Zero Spill Coupler," which is specifically designed for data centers, including supercomputers. We will also present the "Blind Mate Type," a fitting exclusively for server cooling piping, as a reference exhibit.

Mar 26, 2026

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[Notice of Exhibition Participation by Fukuda Co., Ltd.] 2025 YOKOHAMA Automotive Technology Exhibition

[Notice of Exhibition Participation by Fukuda Co., Ltd.] 2025 YOKOHAMA Automotive Technology Exhibition

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We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely invite you to visit us during this busy time. 【 Exhibition Name 】 Automotive Technology Exhibition 2025 YOKOHAMA https://aee.expo-info.jsae.or.jp/ja/yokohama/ (An "online exhibition" will also be held during and around the event period) 【 Dates 】 May 21 (Wednesday) - 23 (Friday), 2024 10:00 AM - 6:00 PM *On the final day, 9:00 AM - 4:00 PM (Online exhibition: May 14 (Wednesday) - June 4 (Wednesday)) 【 Venue 】 Pacifico Yokohama (1-1-1 Minatomirai, Nishi-ku, Yokohama, Kanagawa Prefecture) Our booth number: "Concourse 505"

Mar 24, 2026

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[Notice of Exhibition Participation by Fukuda Co., Ltd.] 27th Interphex Week Tokyo

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  • SEMINAR_EVENT

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will showcase a variety of products, including new ones. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to attend this event. 【 Exhibition Name 】 27th INTERPHEX Week Tokyo https://www.interphex.jp/tokyo/ja-jp.html 【 Dates 】 July 9 (Wednesday) - 11 (Friday), 2025 10:00 AM - 5:00 PM 【 Venue 】 Tokyo Big Sight (3-11-1 Ariake, Koto-ku, Tokyo 135-0063)

Mar 24, 2026

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[Seminar] Key Points of the Simultaneous Market and Outlook for the Power Business

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  • SEMINAR_EVENT

[Lecturer] Taku Ito, Partner, Mori Hamada & Matsumoto Foreign Law Joint Enterprise Yoshifumi Nagakubo, Senior Associate [Key Lecture Content] As we move towards a carbon-neutral society, the large-scale introduction of renewable energy sources is progressing, making the enhancement of market design that balances stable electricity supply and economic efficiency an urgent issue. In this context, the "simultaneous market," which integrates the trading of electricity (kWh) and adjustment capacity (ΔkW), is being discussed as a core component of future electricity systems, and serious considerations for its implementation are underway. In this lecture, a lawyer who has led discussions at the forefront of national system design will explain in an easy-to-understand manner the background and necessity of the simultaneous market, as well as the overall picture of its complex mechanisms, based on practical experience. Furthermore, the lecture will clearly outline the latest developments in current discussions, realistic challenges for implementation, and prospects for future electricity business in Japan, incorporating perspectives and insights as a system designer and practitioner.

Mar 24, 2026

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[Seminar] How to Use Heat Dissipation Devices and Basics of Thermal Design

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  • SEMINAR_EVENT

[Instructor] Hirokazu Shibata, President and CEO of ZAZU Design Co., Ltd. [Key Lecture Content] As the importance of heat dissipation design increases in daily operations, it is necessary to study a range of books on thermal engineering to learn the overall picture of heat dissipation design. However, books on thermal engineering typically start with the basics of heat transfer and cover topics such as temperature boundary layers and dimensionless numbers related to heat transfer, making it quite difficult for beginners to grasp the overall picture in a short period. This seminar is aimed at engineers who will begin thermal design in the future, focusing on various heat dissipation devices as specific subjects. The goal is to understand the basics of thermal design while learning about the characteristics and usage of these heat dissipation devices. After attending this seminar, participants are expected to acquire knowledge equivalent to that gained from studying a range of thermal engineering books. [Lecture Topics] 1. Current Status and Challenges of Thermal Design 2. How "Thermal Resistance" Determines Heat Dissipation Pathways 3. Fundamental Laws Governing Heat Transfer 4. Air Cooling through Heat Transfer 5. Heat Diffusion through Thermal Conduction 6. Heat Transfer via Two-Phase Flow of Gas and Liquid 7. Q&A Session

Mar 24, 2026

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