Added a product service page for measuring the thermal conductivity of thermal pads!

Are you measuring the correct thermal conductivity of the thermal pad?

A thermal pad is a type of thermal interface material used for heat dissipation in CPUs and power devices. Due to its flexibility and relatively high thermal conductivity, it effectively reduces contact thermal resistance by filling the gaps between the heat sink and the device. Do you accurately understand the thermal conductivity of thermal pads? Thermal pads have elasticity, so their contact state changes with pressure. In other words, the effective thermal conductivity varies with pressure. Additionally, many materials exhibit temperature dependence in thermal conductivity, meaning that as the temperature increases, the thermal conductivity decreases. In this instance, we measured a commercially available thermal pad with a specification of 1.5W/mK. This is a soft type referred to as a soft thermal pad. The measurement device used is our steady-state thermal conductivity measurement device, the SS-H40.

• Thermo-fluid analysis

Bulk, thin film, micro areas, plate-shaped, sheet-shaped, almost all materials can be accommodated. Please consult us once.

Supports various thermal conductivity measurement methods such as steady-state method, periodic heating method, and thermoreflectance method. Compatible with plate-shaped, sheet-shaped, soft samples, fibrous materials, and various shapes. Please consult us even for samples that have been rejected by other companies.

• Contract measurement

Understanding the mechanism of heat transfer and effectively dissipating heat is important! Here we introduce various methods for measuring thermal properties.

Due to factors such as "miniaturization = fanless design" and "widespread use of power devices = increased heat generation," thermal issues have become important. Thermal conductivity measurement can be broadly classified into two categories: "steady-state method" and "transient method." The steady-state method provides direct thermal conductivity values and requires relatively large samples. The transient method can measure thermal diffusivity and thermal effusivity, and it is possible to measure with relatively small samples. We provide further detailed explanations, so please take a look at the PDF download below. 【Characteristics of the "Steady-State Method" and "Transient Method"】 ■ Steady-State Method - Direct thermal conductivity can be obtained - Requires relatively large samples ■ Transient Method - Can measure thermal diffusivity and thermal effusivity - Can measure with relatively small samples - Requires specific heat capacity and density *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments

Introducing devices for measuring the thermal diffusivity of sheet-like and plate-like materials, as well as thermal evaluation devices for fiber orientation distribution!

Introducing Bethel's thermal property measurement devices. The "Thermo Wave Analyzer TA33/35" is a measurement device for the thermal diffusivity of sheet and plate materials, capable of measuring the thermal diffusivity of functional materials. The "Thermal Microscope TM" has been commercialized through joint development with the National Institute of Advanced Industrial Science and Technology's Measurement Standards Division, allowing for measurements in micro-regions and thin films. Additionally, we offer the "Thermal Imaging Scope TSI," which visualizes thermal conduction paths using infrared cameras and lasers, as well as the "Fiber Orientation Evaluation System TEFOD." 【Features of the Thermo Wave Analyzer TA33/35】 ■ High freedom of sample shape ■ Dynamic range from organic films to diamonds ■ Anisotropy evaluation through measurements in horizontal and vertical directions ■ Evaluation of defects and irregularities through distribution measurements *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments

Quickly resolve your questions about heat! A heat professional will visit you at your desired date and location.

The target audience includes professionals in thermal properties as well as students! We will clearly explain case studies, tips, and measurement methods related to thermal property measurements.

• Laser microscope

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Features: ● Equipped with Intel 13th generation Core i3-1320PE/i5-1340PE/i7-1370PE ● Equipped with Intel Iris Xe graphics ● DDR5 SODIMM x 2 slots, expandable up to 96GB (sold separately) ● Supports dual HDMI video output ● Equipped with 2.5G LAN x 5 (4 ports support IEEE802.3 at PSE) Maximum power supply capacity when using DC12V–18V power: 20W (total for 4 ports) Maximum power supply capacity when using DC19V–36V power: 60W (total for 4 ports) ● Wide range 9–36V DC power input (terminal block type) ● Operating temperature range -25–60°C ● Onboard TPM 2.0 * This model does not include memory, storage, or OS.

Features ● Intel Core i3-1320PE/i5-1340PE/i7-1370PE ● DDE5 SODIMM x 2 (up to 96GB) (sold separately) ● 2.5 GbE x 5 (including 4 PoE ports) ● PCIe [x1] Slot x 1 & PCI Slot x 1 for expansion ● DC power input compatible with 9V to 36V ● Wide temperature operation range -20℃ to 60℃

Features: ● Compatible with Intel Core Ultra processors (Series 2) ● A1 SKU: Intel H810 chipset A2 SKU: Intel Q870 chipset ● Intel Xe LPG graphics engine ● DDR5 SODIMM ×2, up to 96GB (sold separately) ● HDMI 2.0 ×2 ● 2.5GbE LAN ×2, 1GbE LAN ×1 ● 10V–35V DC input (4-pin terminal block) ● Wide temperature range: -25°C to 60°C ● Equipped with TPM 2.0 ● Supports iAMT (A2 SKU only) * This model does not include memory, storage, or OS.

At the "11th Monozukuri World Nagoya" held at Port Messe Nagoya from April 8 (Wednesday) to April 10 (Friday), we will be showcasing various inspection products at the booth of FOVA Tech, a sales company of the Duplo Group. In the manufacturing industry, addressing labor shortages, along with achieving both productivity improvement and quality stabilization, has become an important management challenge. Our company has set the realization of a "manufacturing site that does not rely too much on people" as our development philosophy, and we have been advancing the development of automation equipment that possesses flexibility and high expandability, making it easy to adapt to existing lines. In this exhibition, we will showcase automation solutions that can optimize multiple processes integrally, and you will be able to confirm specific operational images after implementation.