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  6. Measurement of thermal conductivity of thermal pads

Measurement of thermal conductivity of thermal pads

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Request measurement using the steady-state thermal conductivity measurement method SS-H40.

last updated:Nov 03, 2024

ベテル 本社・工場、東京オフィス、ハドソン研究所、ベトナム工場
ベテル 本社・工場、東京オフィス、ハドソン研究所、ベトナム工場
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Are you measuring the correct thermal conductivity of the thermal pad?

A thermal pad is a type of thermal interface material used for heat dissipation in CPUs and power devices. Due to its flexibility and relatively high thermal conductivity, it effectively reduces contact thermal resistance by filling the gaps between the heat sink and the device. Do you accurately understand the thermal conductivity of thermal pads? Thermal pads have elasticity, so their contact state changes with pressure. In other words, the effective thermal conductivity varies with pressure. Additionally, many materials exhibit temperature dependence in thermal conductivity, meaning that as the temperature increases, the thermal conductivity decreases. In this instance, we measured a commercially available thermal pad with a specification of 1.5W/mK. This is a soft type referred to as a soft thermal pad. The measurement device used is our steady-state thermal conductivity measurement device, the SS-H40.

    Thermo-fluid analysis
サーマルパッド.png

Measurement of thermal conductivity of thermal pads

サーマルパッド.png
サーマルパッド.png
  • Related Link - https://hrd-thermal.jp/apparatus/ss-h40.html

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basic information

Specifications of the measured thermal pad Size: 40mm x 40mm x 5 mm Thermal conductivity: 1.5 W/m·K Heat resistance temperature: 50–200 (°C) First, we measured the sample by changing the pressure. Measurement conditions Sample temperature: 30°C Pressure: 200N, 400N, 600N, 800N Figure 2: Load and thermal conductivity As the load increased, the thermal conductivity rose and became almost constant at 600N. When the load is insufficient, the material and the thermal pad do not make sufficient contact, resulting in a large contact thermal resistance and lower thermal conductivity. However, when the load is sufficient, they make contact, reducing the contact thermal resistance and increasing the thermal conductivity. Next, we measured the sample by changing the temperature. Measurement conditions Sample temperature: 30°C, 40°C, 50°C Pressure: 600N Figure 3: Sample temperature and thermal conductivity As the sample temperature increased, the thermal conductivity decreased. The thermal conductivity decreased by 3.3% at sample temperatures of 30°C and 40°C, but only by 0.5% between 40°C and 50°C. Since all materials experience changes in thermal conductivity to varying degrees with temperature changes, it is important to understand this effect.

Price information

For a detailed price list of the requested measurements, please see the URL below. https://hrd-thermal.jp/measurement/value/

Price range

P3

Delivery Time

P4

※We will report within approximately two weeks from the time we receive the sample.

Applications/Examples of results

Acquisition of thermal design simulation data for power devices, CPUs, AI chips, lithium-ion batteries, etc. Measurement of thermal conductivity for various TIMs (thermal interface materials) such as thermal pads.

Detailed information

  • サーマルパッド.png

    Figure 1 Thermal Pad

  • 図2圧力依存.png

    Figure 2: Load and thermal conductivity: The effective thermal conductivity changes as the softness of the sample affects the adhesion when the load is altered.

  • 図3温度依存.png

    Figure 3: Sample Temperature and Thermal Conductivity: The thermal conductivity of various materials changes with temperature. Let's measure the thermal conductivity at the temperature used in practice.

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Thermal Property Microscope Thermal Microscope / TM3 (Thermal Penetration Rate, Thermal Conductivity Measurement)

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[Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'

  • Seminar・Event

The "Fundamentals of Thermal Conductivity and Measurement Methods/Case Studies" seminar hosted by Nikkan Kogyo Shimbun will be held soon! In manufacturing and development, thermal issues in electronic devices and materials cannot be avoided. To solve these problems, it is essential to accurately understand the "thermal conductivity" of components and materials and to carry out appropriate thermal design. This seminar will cover the various types of thermal conductive materials used in electronic devices, detailing their measurement methods and specific case studies. By understanding the characteristics and advantages of various thermal conductivity measurement methods, participants will develop the skills to select the optimal method according to the situation. Additionally, actual measurement case studies of thermal conductivity will be introduced, providing knowledge directly applicable to product development and quality control. This seminar is recommended for those who want to acquire advanced thermal property measurement techniques to improve the performance of electronic products and prevent issues. <Knowledge to be Acquired> ◇ Basic knowledge of thermal conductivity ◇ Principles of thermal conductivity measurement instruments ◇ Differences in thermal conductivity measurement methods (which instruments to use for which types of samples) Please click the [Details & Registration] button below to apply.

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I will give a presentation at the "IDAJ Symposium 2024" (November 7-8, Yokohama). [Hudson Institute]

  • Company news

Our employee will give a presentation as a member of the JEITA Thermal Design Technology Working Group at the "IDAJ Symposium 2024"! The theme is "Is the thermal conductivity used in thermal design simulations measured correctly?" Many designers refer to the thermal conductivity in handbooks, but is that really sufficient? Different measurement methods can yield different values. So, what is the extent of that difference, and how does it impact thermal design simulations? This presentation will answer these questions. For more details, please check the related links below.

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I will give a presentation at the 3rd World Symposium on Materials Science and Engineering 2024 (November 5-7, Hilton Nagoya). [Hudson Institute]

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Our company will present research results on "Development of a Thermal Diffusivity Analysis Method for Anisotropic and Inhomogeneous Samples Using Spot Periodic Heating and Infrared Radiation Thermometry" at the 3rd World Symposium on Materials Science and Engineering (SMSE2024). This research proposes a new analytical method to achieve accurate thermal diffusivity (thermal conductivity) measurements for anisotropic and inhomogeneous materials, which have been challenging to address with conventional methods. This technique deepens the understanding of the thermal properties of materials and is expected to have broad applications in industrial uses and materials research. For details about the presentation, please check the following site and pay attention to our presentation as well: https://smse2024.lmsii.org/ The "World Symposium on Materials Science and Engineering (SMSE) 2024" is an international conference that shares cutting-edge technologies and research results in the fields of materials science and engineering. Academic researchers and engineers from companies gather to exchange information on material property evaluation, new material development, and advancements in manufacturing technologies. Experts from around the world participate, making it an important venue for strengthening collaboration between industry and academia.

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We will be introducing our thermal property measurement equipment at the "High-Performance Film Exhibition - High-Performance Materials Week" (October 29-31, Makuhari Messe)‼️

  • Company news

The "High-Performance Film Exhibition - High-Performance Materials Week" will be held for three days starting tomorrow, October 29th. Bethel will have a panel display at the Matsuo Industry booth‼️ Booth No. is [28-39] Exhibited item: [Thermo Wave Analyzer TA] The Thermo Wave Analyzer TA is a device for measuring thermal conductivity. We look forward to your visit!

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Company information

ベテル

ベテル 本社・工場、東京オフィス、ハドソン研究所、ベトナム工場

Manufacturing and processing contract

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Leveraging the assembly technology cultivated over many years, we have expanded our business areas to include the development of precision component assembly, thermal property measurement devices, contract measurement services, and the development of medical and dental plastic products equipped with clean rooms. We deepen and integrate our "original products" from a unique manufacturing perspective, consolidating our know-how and technology. With "speedy decision-making and execution," which is a strength unique to Bethel, we provide high-quality products under the "Made by BETHEL" label. Our wish at Bethel is for our customers who use Bethel products to be satisfied with our products, manufacturing, and services, and to feel that they made the right choice in trusting our company. Furthermore, we hope that the satisfaction of our customers will lead to the happiness of each employee who works here.

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