Information on the service for measuring the thermal conductivity of carbon fiber reinforced plastic (CFRP).

Leave the measurement of the thermal conductivity of carbon fiber reinforced plastic (CFRP) to us.

Carbon fiber reinforced plastics (CFRP), used in electric vehicles, aircraft, satellites, and rockets, require precise knowledge of thermal conductivity. For instance, when used in electric vehicles, understanding thermal conductivity is essential for heating performance and battery thermal management. Changes in electricity consumption due to heating performance and thermal management significantly affect driving range. Similarly, when used in satellites and rockets in the harsh environment of space, it is necessary to understand thermal conductivity to ensure heat resistance performance. With Bethel, you can accurately measure the thermal conductivity of this carbon fiber reinforced plastic (CFRP).

• Thermo-fluid analysis

Are you measuring the correct thermal conductivity of the thermal pad?

A thermal pad is a type of thermal interface material used for heat dissipation in CPUs and power devices. Due to its flexibility and relatively high thermal conductivity, it effectively reduces contact thermal resistance by filling the gaps between the heat sink and the device. Do you accurately understand the thermal conductivity of thermal pads? Thermal pads have elasticity, so their contact state changes with pressure. In other words, the effective thermal conductivity varies with pressure. Additionally, many materials exhibit temperature dependence in thermal conductivity, meaning that as the temperature increases, the thermal conductivity decreases. In this instance, we measured a commercially available thermal pad with a specification of 1.5W/mK. This is a soft type referred to as a soft thermal pad. The measurement device used is our steady-state thermal conductivity measurement device, the SS-H40.

• Thermo-fluid analysis

Non-contact measurement of thermal diffusivity using a laser. Measurement of materials with high thermal conductivity is possible.

The ThermoWave Analyzer TA3 measures thermal diffusivity using a non-contact method with a laser. It is capable of measuring materials with high thermal conductivity. Measurements can be taken without worrying about the shape. For more details, please contact us.

• Logic Analyzer

Non-contact measurement of thermal diffusivity using a laser. Measurement of resin-based materials is also possible.

The ThermoWave Analyzer TA measures thermal diffusivity using a non-contact method with a laser. Since the thermal conductivity of composite materials made of fillers and resins varies significantly with the mixing ratio, measuring thermal diffusivity is essential. Measurement of resin-based materials is also possible. Please contact us for more details.

• Logic Analyzer

Bulk, thin film, micro areas, plate-shaped, sheet-shaped, almost all materials can be accommodated. Please consult us once.

Supports various thermal conductivity measurement methods such as steady-state method, periodic heating method, and thermoreflectance method. Compatible with plate-shaped, sheet-shaped, soft samples, fibrous materials, and various shapes. Please consult us even for samples that have been rejected by other companies.

• Contract measurement

Thermal conductivity distribution measurement and the anisotropy of thermal diffusivity in each part can be evaluated.

In recent years, the miniaturization and high output of electronic devices have rapidly advanced, and as a result, thermal management (heat dissipation) has become a very important issue. Traditionally, heat dissipation has been maintained by using metals, but in recent years, it has begun to be replaced by "high thermal conductivity resins." High thermal conductivity resins are "lightweight" and have "moldability" compared to traditional metals, are "corrosion-resistant," and above all, have the advantage of being "low-cost." However, there is also the disadvantage of low thermal conductivity, and many material manufacturers are actively developing solutions to address this issue. It is expected that "high thermal conductivity resins" will become mainstream in the future. On the thermal properties blog, we introduce examples of thermal conductivity measurements of "high thermal conductivity resins." http://blog.thermal-measurement.info/archives/cat_50051425.html

• Other physicochemical equipment

Introducing devices for measuring the thermal diffusivity of sheet-like and plate-like materials, as well as thermal evaluation devices for fiber orientation distribution!

Introducing Bethel's thermal property measurement devices. The "Thermo Wave Analyzer TA33/35" is a measurement device for the thermal diffusivity of sheet and plate materials, capable of measuring the thermal diffusivity of functional materials. The "Thermal Microscope TM" has been commercialized through joint development with the National Institute of Advanced Industrial Science and Technology's Measurement Standards Division, allowing for measurements in micro-regions and thin films. Additionally, we offer the "Thermal Imaging Scope TSI," which visualizes thermal conduction paths using infrared cameras and lasers, as well as the "Fiber Orientation Evaluation System TEFOD." 【Features of the Thermo Wave Analyzer TA33/35】 ■ High freedom of sample shape ■ Dynamic range from organic films to diamonds ■ Anisotropy evaluation through measurements in horizontal and vertical directions ■ Evaluation of defects and irregularities through distribution measurements *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments

Features: ● Equipped with Intel 13th generation Core i3-1320PE/i5-1340PE/i7-1370PE ● Equipped with Intel Iris Xe graphics ● DDR5 SODIMM x 2 slots, expandable up to 96GB (sold separately) ● Supports dual HDMI video output ● Equipped with 2.5G LAN x 5 (4 ports support IEEE802.3 at PSE) Maximum power supply capacity when using DC12V–18V power: 20W (total for 4 ports) Maximum power supply capacity when using DC19V–36V power: 60W (total for 4 ports) ● Wide range 9–36V DC power input (terminal block type) ● Operating temperature range -25–60°C ● Onboard TPM 2.0 * This model does not include memory, storage, or OS.

Features ● Intel Core i3-1320PE/i5-1340PE/i7-1370PE ● DDE5 SODIMM x 2 (up to 96GB) (sold separately) ● 2.5 GbE x 5 (including 4 PoE ports) ● PCIe [x1] Slot x 1 & PCI Slot x 1 for expansion ● DC power input compatible with 9V to 36V ● Wide temperature operation range -20℃ to 60℃

Features: ● Compatible with Intel Core Ultra processors (Series 2) ● A1 SKU: Intel H810 chipset A2 SKU: Intel Q870 chipset ● Intel Xe LPG graphics engine ● DDR5 SODIMM ×2, up to 96GB (sold separately) ● HDMI 2.0 ×2 ● 2.5GbE LAN ×2, 1GbE LAN ×1 ● 10V–35V DC input (4-pin terminal block) ● Wide temperature range: -25°C to 60°C ● Equipped with TPM 2.0 ● Supports iAMT (A2 SKU only) * This model does not include memory, storage, or OS.

At the "11th Monozukuri World Nagoya" held at Port Messe Nagoya from April 8 (Wednesday) to April 10 (Friday), we will be showcasing various inspection products at the booth of FOVA Tech, a sales company of the Duplo Group. In the manufacturing industry, addressing labor shortages, along with achieving both productivity improvement and quality stabilization, has become an important management challenge. Our company has set the realization of a "manufacturing site that does not rely too much on people" as our development philosophy, and we have been advancing the development of automation equipment that possesses flexibility and high expandability, making it easy to adapt to existing lines. In this exhibition, we will showcase automation solutions that can optimize multiple processes integrally, and you will be able to confirm specific operational images after implementation.

● The production time for casting prototypes can be shortened! Since model production is not required, the time needed to create prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! With one molding process, different products with similar shapes or varying dimensions can be molded at the same time. This allows for the verification of multiple types in a short period.