Information on the service for measuring the thermal conductivity of carbon fiber reinforced plastic (CFRP).

Leave the measurement of the thermal conductivity of carbon fiber reinforced plastic (CFRP) to us.

Carbon fiber reinforced plastics (CFRP), used in electric vehicles, aircraft, satellites, and rockets, require precise knowledge of thermal conductivity. For instance, when used in electric vehicles, understanding thermal conductivity is essential for heating performance and battery thermal management. Changes in electricity consumption due to heating performance and thermal management significantly affect driving range. Similarly, when used in satellites and rockets in the harsh environment of space, it is necessary to understand thermal conductivity to ensure heat resistance performance. With Bethel, you can accurately measure the thermal conductivity of this carbon fiber reinforced plastic (CFRP).

• Thermo-fluid analysis

Are you measuring the correct thermal conductivity of the thermal pad?

A thermal pad is a type of thermal interface material used for heat dissipation in CPUs and power devices. Due to its flexibility and relatively high thermal conductivity, it effectively reduces contact thermal resistance by filling the gaps between the heat sink and the device. Do you accurately understand the thermal conductivity of thermal pads? Thermal pads have elasticity, so their contact state changes with pressure. In other words, the effective thermal conductivity varies with pressure. Additionally, many materials exhibit temperature dependence in thermal conductivity, meaning that as the temperature increases, the thermal conductivity decreases. In this instance, we measured a commercially available thermal pad with a specification of 1.5W/mK. This is a soft type referred to as a soft thermal pad. The measurement device used is our steady-state thermal conductivity measurement device, the SS-H40.

• Thermo-fluid analysis

Non-contact measurement of thermal diffusivity using a laser. Measurement of materials with high thermal conductivity is possible.

The ThermoWave Analyzer TA3 measures thermal diffusivity using a non-contact method with a laser. It is capable of measuring materials with high thermal conductivity. Measurements can be taken without worrying about the shape. For more details, please contact us.

• Logic Analyzer

Non-contact measurement of thermal diffusivity using a laser. Measurement of resin-based materials is also possible.

The ThermoWave Analyzer TA measures thermal diffusivity using a non-contact method with a laser. Since the thermal conductivity of composite materials made of fillers and resins varies significantly with the mixing ratio, measuring thermal diffusivity is essential. Measurement of resin-based materials is also possible. Please contact us for more details.

• Logic Analyzer

Bulk, thin film, micro areas, plate-shaped, sheet-shaped, almost all materials can be accommodated. Please consult us once.

Supports various thermal conductivity measurement methods such as steady-state method, periodic heating method, and thermoreflectance method. Compatible with plate-shaped, sheet-shaped, soft samples, fibrous materials, and various shapes. Please consult us even for samples that have been rejected by other companies.

• Contract measurement

Thermal conductivity distribution measurement and the anisotropy of thermal diffusivity in each part can be evaluated.

In recent years, the miniaturization and high output of electronic devices have rapidly advanced, and as a result, thermal management (heat dissipation) has become a very important issue. Traditionally, heat dissipation has been maintained by using metals, but in recent years, it has begun to be replaced by "high thermal conductivity resins." High thermal conductivity resins are "lightweight" and have "moldability" compared to traditional metals, are "corrosion-resistant," and above all, have the advantage of being "low-cost." However, there is also the disadvantage of low thermal conductivity, and many material manufacturers are actively developing solutions to address this issue. It is expected that "high thermal conductivity resins" will become mainstream in the future. On the thermal properties blog, we introduce examples of thermal conductivity measurements of "high thermal conductivity resins." http://blog.thermal-measurement.info/archives/cat_50051425.html

• Other physicochemical equipment

Introducing devices for measuring the thermal diffusivity of sheet-like and plate-like materials, as well as thermal evaluation devices for fiber orientation distribution!

Introducing Bethel's thermal property measurement devices. The "Thermo Wave Analyzer TA33/35" is a measurement device for the thermal diffusivity of sheet and plate materials, capable of measuring the thermal diffusivity of functional materials. The "Thermal Microscope TM" has been commercialized through joint development with the National Institute of Advanced Industrial Science and Technology's Measurement Standards Division, allowing for measurements in micro-regions and thin films. Additionally, we offer the "Thermal Imaging Scope TSI," which visualizes thermal conduction paths using infrared cameras and lasers, as well as the "Fiber Orientation Evaluation System TEFOD." 【Features of the Thermo Wave Analyzer TA33/35】 ■ High freedom of sample shape ■ Dynamic range from organic films to diamonds ■ Anisotropy evaluation through measurements in horizontal and vertical directions ■ Evaluation of defects and irregularities through distribution measurements *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Spline Network Co., Ltd. (Headquarters: Shibuya, Tokyo; President: Yoichi Yukino) will hold a free campaign for its WiSAS environmental scan service, one of its vulnerability assessment services, to commemorate the 6th anniversary of the release of the Wi-Fi Security Assurance Series (hereinafter referred to as WiSAS).

The end of the year and the beginning of the new year is an excellent time to reflect on the past year and plan for the next. How did your company approach DX in 2025? Did you consider implementing a production management system? Did you take a step forward in utilizing AI? This article provides a practical guide to objectively evaluate your DX efforts in 2025 and to formulate specific strategies for 2026. Why not take the time during the year-end and New Year to carefully review your company's DX strategy? For more details, please see the related links.

Microsoft has announced that it will end support for Basic Authentication in Client Submission (SMTP Authentication) for Exchange Online between March and April 2026. Once this support is discontinued, sending emails using Basic Authentication (SMTP AUTH) will no longer be possible. Therefore, we would like to provide information regarding the affected features and planned responses in the TECHS series as follows. Reference: Microsoft Information Exchange Online to retire Basic auth for Client Submission (SMTP AUTH) Retirement of Basic Authentication for Exchange Online Please see the related links for more information.

On December 15, 2025 (Monday), we published the magazine "Tekunowa" Vol. 5. ■ About the publication "Tekunowa" "Tekunowa" is a magazine published twice a year with the concept of "connecting the 'circle' of manufacturing companies that are users of TechnoA." It is distributed to user companies of the production management system "TECHS" series, as well as to various companies that have connections with us through opportunities such as exhibitions and visits to our company. We have previously introduced the innovative initiatives of user companies and received positive feedback. For more details, please see the related link.