Semicon Taiwan 2012 Exhibition Information

Al and Al alloy films are anisotropically etched well without corrosion.

The features of this product are as follows: - It enables the formation of a smooth etching surface. - Etching can be performed regardless of the metal opening ratio on the device surface. - There is minimal degradation of the etching solution. - It is recommended to use Pure Etch ZE series (Al damage-free insulating film etching solution) as a pretreatment solution. Keywords: wet etching, silicon anisotropic etching

• Chemicals

Etch the Al or Al alloy film at the desired taper angle.

The features of this product are as follows: - It forms the desired taper shape (taper angle). - It etches Al and Al alloy films effectively. - The etching speed and the in-plane uniformity of the etching shape are good. Keywords: wet etching, aluminum

• Chemicals

The surface of the AlGaInP film can be effectively roughened through etching, which improves the light extraction efficiency.

The features of this product are as follows: - It is possible to form desired unevenness and improve light extraction efficiency. - Processing can be done at low temperatures and in a short time. - The in-plane uniformity of the uneven shape is good. Keywords: frost treatment, unevenness, LED, light-emitting diode, aluminum indium gallium phosphide.

• Other semiconductor manufacturing equipment

The surface of the GaP film and the surfaces, slopes, and sides of the GaP substrate can be effectively roughened through etching, improving the light extraction efficiency.

The features of this product are as follows: - It is possible to form desired unevenness and improve light extraction efficiency. - Processing can be done at low temperatures and in a short time. - The in-plane uniformity of the uneven surface shape is good. Keywords: frost treatment, unevenness, LED, light-emitting diode, gallium phosphide, gallium nitride.

• Chemicals

The surfaces of AlGaAs films, GaAs films, and GaAs substrates can be effectively roughened through etching, improving light extraction efficiency.

The features of this product are as follows: - It is possible to form desired unevenness and improve light extraction efficiency. - Processing can be done at low temperatures and in a short time. - The in-plane uniformity of the uneven surface shape is good. Keywords: frost treatment, unevenness, LED, light-emitting diode, aluminum gallium arsenide, gallium arsenide.

• Chemicals

Al and Al alloy films are etched well without corroding the insulating film. We have products for etching processing and for removing Si natural oxide films.

The features of this product are as follows: - It does not corrode Al or Al alloys. - It forms a good tapered profile. - It can be used for the formation of vias and pads through wet etching. - It can also be used as a pretreatment solution for Pure Etch 160 (Al damage-free Si etching solution). Keywords: wet etching, SiO2, SiN, TEOS, silicon oxide film, silicon nitride film.

• Other semiconductor manufacturing equipment

The surface of the GaN (N-face) film can be effectively roughened through etching, improving the light extraction efficiency.

The features of this product are as follows: - It is possible to form desired unevenness and improve light extraction efficiency. - Processing can be done at room temperature to high temperatures. - The in-plane uniformity of the uneven surface shape is good. Keywords: frost treatment, unevenness, LED, light-emitting diode, gallium nitride.

• Chemicals

Features: ● Equipped with ARM MediaTek Genio 700 / 510 ● Onboard LPDDR4 8GB ● HDMI 2.0 x 1, DP 1.4 x 1 ● eDP 2 lanes x 1, MIPI-DSI 4 lanes x 1 ● GbE x 1 ● USB 3.0 + 2.0 x 1, USB 2.0 x 5 ● UART x 4, GPIO x 12, MIPI CSI x 2, TPM 2.0 ● Fan-equipped heatsink, heatsink available separately ● Carrier board available separately

Features: ● Equipped with Intel Core Ultra 5 125H/7 155H ● LPDDR5 16GB onboard memory ● NVMe 128GB onboard storage ● eDP x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen2 x 2 ● PCIe 4.0[x1] x 4 ● 2.5GbE x 1 ● COMe Type10 standard, size 84mm x 55mm ● Optional items ECB-920A-0001: Development carrier board NANOCOM-MTU-FAN: CPU fan NANOCOM-MTU-HSP: Heat spreader (Note: Heat dissipation is required in the enclosure)

Features: ● Equipped with Intel Core Ultra 9 185H / 7 155H / 5 125H processors ● DDR5 5600MHz Dual Channel SODIMM x2 (up to 96GB) (sold separately) ● VGA switch DDI x1, LVDS colay eDP x1, DDI x2 ● USB 2.0 x8, USB 3.2 Gen 2 x4 ● PCIe [x1] x4, PCIe [x4] x1, PEG [x8] + [x4] + [x4] ● 2.5GbE x1 ● DC 9~16V input ● COM Express Type 6, 3.75 inches x 3.75 inches (95mm x 95mm)

By digitizing contract operations, you can reduce many costs, including stamp duty and mailing fees. ◆ Four Benefits of Electronic Contracts - Cost reduction for printing, stamp duty, mailing fees, and original document storage - Improved business efficiency through system-based sending and stamping - Prevention of tampering with timestamps - Enhanced document searchability 【Many Benefits for the Other Party as Well!】 - Both parties can confirm that the document has not been tampered with - No worry about losing the original paper documents - Increased operational efficiency due to the absence of mailing and binding hassles - Quick contract conclusion through email or system verification ◆ Disadvantages of Electronic Contracts - Costs for implementing and operating the service - Need to ensure that business partners understand electronic transactions ----------------------------------------------------- 　　Consult with paperlogic for electronic contract services! -----------------------------------------------------

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.