【TTL】Short delivery time! High quality! Express delivery of flexible printed circuit boards (FPC)! For arrangements of "flexible printed wiring boards" with a short delivery time, be sure to check Taiyo Technorex!

With Taiyo Techno Rex's FPC short delivery service, high quality and smooth transition to mass production can be achieved.

Unified management from prototype to mass production! ■ Reliable track record ■ One-stop service ■ Flexible responsiveness ■ Short delivery times, high quality, latest technology

• Printed Circuit Board

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

"High-Frequency Compatible FPC" and "High-Frequency Compatible Flexible Printed Circuit Board" are products designed to support low transmission loss and impedance matching. Specifications include coplanar lines, microstrip lines, and strip lines. They can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

• Other electronic parts

[Basic Knowledge] The standard manufacturing process of Taiyo Industry, which has focused on small quantities of a wide variety of products, has been documented!

This document introduces the manufacturing process of FPC (Flexible Printed Circuit) conducted by Taiyo Techno-Rex Co., Ltd. How are flexible printed circuit boards made? This material is intended for those who want to learn about FPC. It explains the manufacturing process after the design of standard specification FPC. [Contents (excerpt)] ■ Exposure ■ Through-hole drilling ■ Copper plating ■ Dry film lamination ■ Exposure * The PDF version is available for download. * A PowerPoint version is also available upon request.

• Printed Circuit Board
• Other electronic parts
• Other cable related products

Introduction to high-difficulty FPCs, specific issues, and TAIYO's one-stop service, covering the basics of flexible substrates (glossary)!

Thank you for taking a look. With over 40 years of experience in flexible printed circuit board manufacturing, we offer a one-stop service from prototyping to mass production. There are things that can only be done by TAIYO. 【Contents of the document】 1. Solve all your FPC problems at once! 2. What is FPC? 3. One-stop service 4. Achieving short delivery times 5. Support from prototyping to mass production 6. Information on various types of FPC (ultra-fine wires, multilayer, high frequency, and more) 7. FPC glossary 8. Greetings and company overview (Total of 36 pages) We hope this information will be helpful in your consideration of flexible printed circuit boards. Taiyo Industry will sincerely respond to your inquiries regarding FPC.

• Printed Circuit Board
• Other electronic parts
• Other cable related products

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method involves forming wiring on ultra-thin copper foil through plating (semi-additive method). The method we are introducing this time is one of the semi-additive processes called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to form ultra-fine and high-density patterns that are difficult to achieve with the subtractive method. Additionally, by combining it with the "via filling technology" that fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes as well, further increasing wiring density. **Features of the MSAP Method** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-sections contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighPrecisionSubstrate #Flex #FlexiblePrintedCircuitBoard

• Printed Circuit Board
• Circuit board design and manufacturing

<Title> Development of Gene Expression Control Technology through RNA Hacking In the latest presentation paper, we have utilized Abby. Associate Professor Yosuke Katsuta from Kumamoto University Graduate School of Advanced Science and Technology, Analytical Chemistry Laboratory (also co-founder of StapleBio), will be giving a presentation in an online seminar. He is working on the development of RNA hacking technology aimed at controlling gene expression by utilizing short nucleic acids named Staple to change the higher-order structure of target mRNA. He will present the latest data focusing on the results of cell experiments and animal experiments in the development of this technology. Related paper on the presentation content: Staple oligomers induce a stable RNA G-quadruplex structure for protein translation inhibition in therapeutics | Nature Biomedical Engineering

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

● The production time for casting prototypes can be shortened! Since model production is not required, the time needed to create prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! With one molding process, different products with similar shapes or varying dimensions can be molded at the same time. This allows for the verification of multiple types in a short period.

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.