39th InterNepCon Japan / Electronics Manufacturing and Assembly Exhibition [HIWIN]

Nanometer precision positioning stage. For semiconductor inspection equipment and semiconductor manufacturing equipment!

A nano-precision positioning linear motor stage that meets the stringent technical requirements of semiconductor inspection and manufacturing equipment. Positioning stability is ±2nm, with high-speed stability of ±0.1% at 100mm/s. Its low-profile and stable structure make it suitable for high-end precision inspection equipment. This high-precision stage fully demonstrates the technology cultivated through the development and manufacturing of motion control and system technology, contributing to the future of manufacturing.

• Semiconductor inspection/test equipment

We can provide everything from components to subsystems for semiconductor manufacturing equipment.

Our company is engaged in a wide range of development and manufacturing, from mechanical component parts to mechatronic products. We offer stainless steel linear guideways "MG Series" and ball screws "Super S Series," suitable for the semiconductor and FPD industries, as well as wafer transport robots, EFEM, wafer aligners, and ultra-precision stages at the nano level. We provide everything from components to subsystems in a one-stop solution, significantly reducing costs and man-hours related to procurement. 【We will be exhibiting at SEMICON Japan】 We plan to showcase mechanical component parts such as stainless steel linear guideways and ball screws for semiconductor equipment, as well as wafer robots and wafer load/unload systems. Please feel free to stop by. Date: December 13 (Wed) to 15 (Fri), 2023 Venue: Tokyo Big Sight (Booth No.: East Hall No. 2309)

• Other machine elements

High precision & high rigidity! Wafer transport robot compatible with 2-12 inch wafers [E Series]

Adopting our own DD motor, characterized by high precision and high rigidity. Compatible with 2-12 inch wafers. The design has minimal aging degradation without gears, and the reduced number of parts also decreases maintenance labor. The robot, which balances high performance and affordability, is not limited to wafer transport; it also offers custom solutions for PCB and glass substrate transport applications, and we can propose transport axes for the robot itself tailored to specifications.

• Transport and handling robots

Achieving high speed, high precision, high rigidity, high efficiency, and space-saving! The 【HIWIN Wafer Aligner】 compatible with 2-12 inches.

The HPA series of the HIWIN Pre-Aligner is a 3-axis controlled product that utilizes HIWIN's single-axis robot module, achieving high speed, high precision, high rigidity, high efficiency, and space-saving design. With an integrated controller design (all-in-one), there is no need for external controller placement or wiring space, making it the smallest in volume in its class. It is equipped with an intelligent translucent laser sensor that can detect the contours of objects such as transparent, translucent, and opaque materials. It can accommodate wafers and glass with a minimum diameter of 2 inches and a maximum of 12 inches.

• Transport and handling robots

A shared loading port compatible with the loading and unloading of 8-inch and 12-inch products.

The HLP series of the HIWIN Load Port is a shared load port that supports the loading and unloading of 8-inch and 12-inch products, directly compatible with 8-inch and 12-inch FOUP/FOSB. An optional adapter can be selected for 8-inch open cassettes and 12-inch metal carriers.

• Transport and handling robots

For various automation tasks. Hiwin's DD motor.

HIWIN DD motors adopt a direct drive system that does not require a reduction mechanism. The motor is rigidly coupled to the load through cross roller bearings, achieving excellent acceleration and motion stability through servo driver control. Cables and related accessories can be connected through a hollow shaft, making it suitable for a wide range of applications such as automation tasks. ■ No backlash ■ Hollow shaft ■ No rotational friction from gears ■ Compact ■ Maintenance-free ■ High rigidity cross roller bearings ■ Built-in brake available (optional) ■ Hall sensor available (optional) Product lineup: 【DMS Series】Inner rotor type DD motor 【DMY Series】Outer rotor type DD motor 【DMN Series】Thin outer rotor type DD motor 【DMT Series】Ultra-thin large hollow diameter DD motor 【DMH Series】Inner rotor type DD motor ○ For more details, please refer to the catalog or contact us.

• Other motors

Made of stainless steel, it is ideal for use in high humidity environments and environments requiring corrosion resistance. *Technical documentation available.

Ideal for use in high humidity environments and environments requiring corrosion resistance. Compatible with standard carbon steel linear guideways. The model numbers applicable to stainless steel are as follows: HG Series: HGH15, HGH20, HGH25 EG Series: EG15 QH Series: QH15, QH20, QH25 QE Series: QE15 MG Series For more details, please refer to the catalog or contact us.

• Other machine elements

In recent years, the implementation of maintenance DX to achieve "non-stop factories" has become an urgent necessity in manufacturing sites. Amid the trend of factory IoT and data utilization, the use of remote I/O, which can remotely aggregate and collect sensor information and control signals from equipment and sensors dispersed inside and outside the factory, is gaining importance as a foundation for predictive maintenance and condition monitoring. On the other hand, the installation environment for remote I/O is not necessarily limited to control panels or well-conditioned factory interiors. There is an increasing need to collect data in harsh environments, such as outdoor equipment and conditions involving high temperatures, low temperatures, vibrations, and strong electrical noise. Conventional remote I/O systems have struggled to operate stably under such conditions, requiring measures like installation location constraints and additional protective enclosures. Environmentally robust remote I/O with wide temperature support and noise resistance can address these challenges, enabling the expansion of the scope of factory IoT and predictive maintenance to outdoor and remote equipment. In this seminar, we will introduce the lineup of Contec's environmentally robust remote I/O, the "CONPROSYS(R) Robust I/O Series," which includes a total of 23 products.

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

Takaya Corporation will exhibit at the 27th Automatic Identification Comprehensive Exhibition, showcasing the latest RFID solution, "Visible RFID." Exhibition Details: ■ RFID Work Performance Collection System No need for a control PC or dedicated software Autonomous reader compatible with HF and UHF bands Cloud transmission with just an internet connection "Visualization" of work performance on a dashboard Integration with BI tools for "visualization of location" is also possible. ■ Newly developed "Visible RFID" autonomous reader Equipped with an LCD touch panel for on-site performance verification Efficient data management with batch transmission Experience the operability through live demonstrations We will also showcase various other products. Please visit the Takaya booth to experience the latest RFID solutions! We look forward to your visit.

[Lecture Topics] 1. Latest Trends in Information and Communication Policy of the Ministry of Internal Affairs and Communications Kei Yano, Deputy Director, Information and Communications Policy Division, Information and Communications Bureau, Ministry of Internal Affairs and Communications 2. Semiconductor and Digital Policies of the Ministry of Economy, Trade and Industry Tomonari Fujishiro, Chief of the General Affairs Section, Commerce and Information Policy Bureau, Ministry of Economy, Trade and Industry / Chief of the Minister's Secretariat 3. DX Vision of the Ministry of Land, Infrastructure, Transport and Tourism Taisuke Okubo, IT Strategy Planning and Coordination Officer, Information Policy Division, Comprehensive Policy Bureau, Ministry of Land, Infrastructure, Transport and Tourism

[Speaker] Mr. Hideo Sugiura, President and CEO of RSI Co., Ltd. [Key Lecture Content] This seminar will provide a clear explanation of data centers, which are becoming increasingly important as a foundation supporting society and economic activities, from the basics. It will organize the roles of data centers and their fundamental business models, illustrating the background of market expansion and the rising demand. Additionally, it will overview the conditions required for location and buildings, as well as the characteristics of the business, highlighting perspectives that differ from conventional real estate. Furthermore, it will address the latest trends such as the proliferation of AI and the introduction of renewable energy, exploring new entry opportunities and future possibilities across various fields. [Lecture Items] 1. What is a Data Center? - The true nature of the "information infrastructure" that supports society 2. Global and Japanese Market Environment - Trends in rapidly expanding demand and investment 3. Business Models of the Industry - From hyperscalers to colocation 4. Location Conditions and Equipment Requirements - From the perspectives of power, communication, cooling, and security 5. Challenges in the Age of AI - Power, cooling, cost, and carbon-free responses 6. Future Outlook - The future of next-generation digital infrastructure and decentralized data centers 7. Q&A / Business Card Exchange