Exhibition at Automotive World 2025: [Heat Dissipation and Electromagnetic Shielding Resin Molding Products]

Heat dissipation performance closer to metal materials than general-purpose resins! Proposing material and product design tailored to the quality requirements of various products.

At Sekisui Techno Molding, we handle "thermal conductive molded products." These molded products excel in the balance of impact resistance, lightweight, and thermal conductivity, offering heat dissipation performance closer to that of metal materials than general-purpose resins. Grades with low volume resistivity can be applied for EMC measures. We propose material and product designs tailored to the quality requirements of various products. Please feel free to contact us when you need assistance. 【Features】 ■ Achieves high heat dissipation and high impact resistance through unique material formulation technology ■ High lightweight effect achieved by resinizing metals ■ Product designs that leverage freedom of shape ■ Molded products with an excellent balance of impact resistance, lightweight, and thermal conductivity ■ Grades with low volume resistivity can be applied for EMC measures * For more details, please refer to the PDF materials or feel free to contact us.

• Other Auto Parts

If it is a heat-dissipating and electromagnetic wave shielding resin molded product, EMC measures essential for e-Axle and on-board chargers (OBC) can also be achieved.

The electrification of automobiles requires EMC design that is more conscious of "emissions (electromagnetic interference/EMI)" and "immunity (electromagnetic susceptibility/EMS)" because they operate at high voltage and large current compared to ICE vehicles. Additionally, the challenge of "how to reduce vehicle weight and extend driving range" has become a key issue, leading to a significant increase in the demand for lightweight solutions across the industry. Sekisui Techno Molding's approach involves lightweighting through the conversion from metal to resin, which also contributes to cost reduction. In cases of the same shape, this results in approximately 45% weight reduction compared to metal. While many resin products suffer from significantly reduced heat dissipation and inferior electromagnetic wave (noise) control compared to metal, Sekisui Techno Molding's resin products ensure these functionalities. - A type that balances heat dissipation and electromagnetic wave shielding - ■ Heat dissipation and electromagnetic wave shielding resin molded products - Reduction of product temperature rise through heat diffusion - Electromagnetic wave shielding performance through conductivity - Lightweighting, increased design freedom, and mass production by replacing metal products With Sekisui Techno Molding's comprehensive system, we consistently support our customers from product planning to prototype development/testing, and then to mass production and sales, ensuring they achieve their ideal products.

• plastic

Currently, metal housings/cases are mainstream for vehicle-mounted ECUs. By changing this to resin, weight reduction and cost savings can be achieved.

In-vehicle ECUs typically use metal cases made of aluminum or copper. While metal shielding ensures robustness and excellent EMC measures, it poses significant challenges in terms of weight and cost. With the electrification of vehicles, the imperative of "how to lighten the body and extend the driving range" is unavoidable, and the demand for lightweight solutions is high. Sekisui Techno Molding's approach enables weight reduction by converting from metal to resin (approximately 45% reduction for the same shape). It also allows for design freedom through resin molding and cost reduction via mass production. While many resin products are inferior to metals in terms of heat dissipation and electromagnetic wave (noise) control, Sekisui Techno Molding's resin products ensure these functions. ■ Thermally conductive resin molded products (focused on heat dissipation) - Reduction of product temperature rise through heat diffusion - Weight reduction, improved design freedom, and mass production by replacing metal products ■ Heat dissipation and electromagnetic wave shielding resin molded products (balancing heat dissipation and electromagnetic wave shielding) - Reduction of product temperature rise through heat diffusion - Electromagnetic wave shielding performance through conductivity - Weight reduction, improved design freedom, and mass production by replacing metal products With Sekisui Techno Molding's comprehensive system, we consistently support our customers from planning and prototype development/verification to mass production and sales to realize their ideals.

• plastic

Proposal for resin molded products that ensure heat dissipation and electromagnetic wave shielding performance for vehicle-mounted cameras, millimeter-wave radar, and LiDAR housings.

Recently, the technologies of "Advanced Driver Assistance Systems (ADAS)" and "Autonomous Driving (AD)" have been steadily evolving. To ensure the stable operation of key technologies and important safety components such as "onboard cameras," "LiDAR," and "millimeter-wave radar," EMC (Electromagnetic Compatibility) measures have become a significant challenge. Sekisui Techno Molding's approach enables many resin products, which are inferior to metals in terms of heat dissipation and electromagnetic wave (noise) control, to achieve weight reduction and design flexibility through resin molding while ensuring these functionalities, leading to cost reductions through mass production. ■ Heat-conductive resin molded products (focused on heat dissipation) - Reduction of product temperature rise through heat diffusion - Weight reduction, improved design flexibility, and mass production by replacing metal products ■ Heat dissipation and electromagnetic wave shielding resin molded products (balancing heat dissipation and electromagnetic wave shielding) - Reduction of product temperature rise through heat diffusion - Electromagnetic wave shielding performance through conductivity enhancement - Weight reduction, improved design flexibility, and mass production by replacing metal products With Sekisui Techno Molding's comprehensive system, we consistently support our customers from planning and prototype development/verification to mass production and sales to realize their ideals.

• plastic

Developed a resin that balances heat dissipation and electromagnetic wave shielding! Achieved approximately 45% weight reduction by converting from metal to resin.

【People and Cars Technology Exhibition YOKOHAMA】 Date: May 21 to 23 Location: Pacifico Yokohama Exhibition Hall 351 (inside the Sekisui Chemical booth) Real resin samples will be on display, so please come and visit. With the electrification of automobiles, the challenge is to "lighten the body and extend the driving range," and the demand for lightweight materials is significantly increasing across the industry. Sekisui Techno Molding's approach contributes to weight reduction and cost savings by converting metal to resin. In cases of the same shape, this results in approximately 45% weight reduction compared to metal. While many resin products show a significant decrease in heat dissipation and are inferior in controlling electromagnetic waves (noise) compared to metal, Sekisui Techno Molding's resin products ensure these functions. - Heat Dissipation Focused Type - ■ Heat Conductive Resin Molded Products - Reduction of product temperature rise due to heat diffusion - Weight reduction, improved design flexibility, and mass production by replacing metal products - Heat Dissipation and Electromagnetic Wave Shielding Compatible Type - ■ Heat Dissipation and Electromagnetic Wave Shielding Resin Molded Products - Reduction of product temperature rise due to heat diffusion - Electromagnetic wave shielding performance through conductivity - Weight reduction, improved design flexibility, and mass production by replacing metal products

• plastic

The video of the heat dissipation and electromagnetic wave shielding resin molded products has been completed.

This is a PR video for Sekisui's developed products: thermal conductive resin molded products and heat dissipation/electromagnetic wave shielding resin molded products.

• plastic

This valve is designed in accordance with Japanese standards for applications in chemicals, petrochemicals, reactive monomers, fire-resistant and flammable substances, paper pulp, and more. Main Features Adopts a stem protrusion prevention structure. The seat features a lip structure that enhances the durability of the seat. Additionally, even in the event of seat burn-through, it quickly prevents seat leakage through metal touch. The E seat is excellent in pressure resistance and heat resistance, and its white color eliminates concerns about color contamination. To prevent gland leakage, a re-tightenable gland flange type is adopted. Complies with JIS flange specifications. Electrostatic discharge prevention design according to ISO 17292. Achieves reliable airtightness with a bidirectional flow valve design according to API 598. Fire-safe structure based on ISO 10497:2022 / API 607 8th edition (certified). Atmospheric pollution prevention structure certified to ISO 15848-1 Class BH C03 (certified). Body materials of SCS13A and SCS14A are available. Precision casting. Adopts ISO 5211 top mount, allowing actuator installation without touching the pressure-resistant component, the gland bolt.

IsoLite Industrial 1600SF Blanket with 3mm thickness has arrived. ■ This product is not subject to the Specific Chemical Substances Hazard Prevention Regulations (Tokka Regulations) by the Ministry of Health, Labour and Welfare. For more details, please contact us.

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Thank you for always using Paper Logic. We would like to inform you about our support system during the year-end and New Year holidays. ■ Holiday Period: December 27, 2025 (Saturday) to January 4, 2026 (Sunday) During the above period, customer support via inquiry forms and emails will be suspended. Inquiries will be accepted, but responses will be provided sequentially starting from January 5, 2026 (Monday). Please note that various functions, including electronic contracts, can still be used as usual during the holiday period. ■ Contact Information for This Matter Please contact us via the [Inquiry Form]. https://paperlogic.co.jp/contact/ We sincerely apologize for any inconvenience this may cause and appreciate your understanding. We look forward to your continued use of Paper Logic.

The new Quantim QMC Coriolis flow meter (3rd generation) is ideal for applications involving the measurement and control of minute flows of gases and liquids. The Quantim® QMC Coriolis mass flow controllers and meters provide extremely accurate, stable, and reproducible measurements and control for minute flows of gases and liquids. This new 3rd generation Quantim QMC Coriolis mass flow controller and meter contributes to shortening the scale-up period from lab to pilot plant to production by enhancing process quality, production yield, and throughput. The new Quantim QMC Coriolis mass flow series is compatible in terms of mounting dimensions and functionality with the old models of Quantim from Brooks Instrument. Applications: ■ Catalyst research ■ Mass balance calculations in chemical pilot plants ■ Precursors supply to vaporization units ■ Precision coating ■ High-accuracy filling stations ■ Feedback/control loops for metering pumps ■ Vacuum processes ■ Semiconductor wafer processes