Contributing to Sekisui's development products [heat dissipation, EMC, and weight reduction measures]!
- Heat-conducting resin molded products - Heat dissipation and electromagnetic wave shielding resin molded products
Developed a resin that balances heat dissipation and electromagnetic wave shielding! Achieved approximately 45% weight reduction by converting from metal to resin.
【People and Cars Technology Exhibition YOKOHAMA】 Date: May 21 to 23 Location: Pacifico Yokohama Exhibition Hall 351 (inside the Sekisui Chemical booth) Real resin samples will be on display, so please come and visit. With the electrification of automobiles, the challenge is to "lighten the body and extend the driving range," and the demand for lightweight materials is significantly increasing across the industry. Sekisui Techno Molding's approach contributes to weight reduction and cost savings by converting metal to resin. In cases of the same shape, this results in approximately 45% weight reduction compared to metal. While many resin products show a significant decrease in heat dissipation and are inferior in controlling electromagnetic waves (noise) compared to metal, Sekisui Techno Molding's resin products ensure these functions. - Heat Dissipation Focused Type - ■ Heat Conductive Resin Molded Products - Reduction of product temperature rise due to heat diffusion - Weight reduction, improved design flexibility, and mass production by replacing metal products - Heat Dissipation and Electromagnetic Wave Shielding Compatible Type - ■ Heat Dissipation and Electromagnetic Wave Shielding Resin Molded Products - Reduction of product temperature rise due to heat diffusion - Electromagnetic wave shielding performance through conductivity - Weight reduction, improved design flexibility, and mass production by replacing metal products
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■Thermal Conductive Resin Molding Products - Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 26 W/(m·K) - Achieving high rigidity (compared to general-purpose PP resin) ⇒ Bending strength: 52 MPa ■Heat Dissipation and Electromagnetic Wave Shielding Resin Molding Products - Achieving high thermal diffusivity in the horizontal (plane) direction ⇒ Thermal conductivity: 14 W/(m·K) - Achieving electromagnetic wave shielding (electric field) ⇒ Surface resistance: 10^-1 Ω
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Applications/Examples of results
■Vehicle-mounted camera housing ■Millimeter-wave radar housing ■Meter cluster ■Heat dissipation fins ■Inverter cover, DC-DC converter cover ■OBC case ■e-Axle ■ADAS components ■AD components ■Shield plate ■Others, ECU case
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Since its establishment, Sekisui Techno Molding has primarily focused on injection molding, supplying products to various industries, including the automotive sector. With the principles of "customer-oriented," "quality-focused," and "environmentally conscious," we aim for manufacturing that is aware of the trends of the times. We are also committed to further evolving our core molding technology and focusing on the development of high-performance resin products, civil engineering materials, and environmentally friendly products. We aspire to be a company that contributes to society.
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