Notice of Participation in SEMICON JAPAN 2024

Shorten cycle time! A versatile and easy-to-use optical interference measuring instrument designed for convenience.

The "NCG" is a thickness measurement device using optical interference technology. It calculates and measures the thickness of layers through the interference caused by the reflection of light waves at the joint surface of the workpiece. It is designed to manage the thickness of different materials such as glass, plastic, and silicon wafers. This product can be connected to various machines, allowing for high-precision and high-speed management of component thickness, and can be used in dry or wet environments within the specified limits of the specifications, either on the machine or inside the machine. 【Features】 ■ Guarantees processing accuracy within the desired tolerance ■ Reduces cycle time ■ Control for maintaining stable production under controlled conditions ■ Compensation for mechanical variations ■ History of measurement results *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments
• Optical Measuring Instruments

Realizing non-contact thickness measurement of various materials that transmit white light.

The P3CF is a measurement system that combines traditional contact probes with a non-contact probe using confocal technology (hybrid measurement). It can directly measure the distance of various materials and the thickness of transparent materials in white light. The thickness of thin and delicate materials (such as ceramics, semiconductor wafers, and epoxy resin mold compounds for packaging) requires precise measurement in the finishing process, but it is challenging to measure with contact methods. The P3CF, which employs confocal technology, measures the thickness non-contact by determining the distance from the reference plane to the work surface. *For more details, please refer to the PDF document or feel free to contact us.*

• Sensors
• Wafer
• Other measurement, recording and measuring instruments

Achieving high-speed and wide-ranging non-contact/non-destructive measurement on various surfaces.

SOLARIUS VIKING is a compact and lightweight optical 3D surface roughness and shape measurement device. By using sensors for measurement, it allows for a different approach compared to traditional microscopes. It is particularly suitable for customers facing challenges in measuring the surface roughness and thickness of materials that are thin, soft, and prone to scratches, such as wafers and lithium-ion battery separators. Utilizing advanced sensor technology, it quickly provides 3D surface topography maps and measurement results compliant with international standards. Additionally, its compact design saves space. With easy setup and high operability, it allows for quick configuration of the 3D optical inspection process, contributing to a reduction in operator workload. More measurements can be conducted in a shorter time. 【Suitable for customers with the following challenges】 - Looking to improve visual tasks or manual measurements - Wanting user-friendly equipment for anyone - Needing machine alignment (tilt or misalignment) - Seeking detailed understanding of measurements and data management - Searching for special applications that require customization *We also welcome inquiries regarding sample measurements. Please feel free to contact us.

• Lithium-ion battery
• Wafer
• Optical Measuring Instruments

High-precision 3D surface measurement to meet the demands of complex surface measurements.

AOP-PCI (Probe Card Inspection) is a multifunctional, non-contact, non-destructive inspection tool designed to comprehensively check probe cards. By combining an air bearing stage with state-of-the-art sensors and vision systems, it can obtain high-precision data on the tips, head shapes, and PCB surfaces of full-size square direct dock probe cards. Additionally, dedicated measurement algorithms enable seamless execution of both data acquisition and analysis routines. *For more details, please refer to the PDF materials or feel free to contact us.*

• Wafer
• Semiconductor inspection/test equipment
• Other measurement, recording and measuring instruments

Achieving reduced cycle time in chip manufacturing and high quality! Sensors for blade monitoring during wafer cutting.

"VBI" monitors the blade during wafer cutting, ensuring high reliability and reducing waste. By measuring blade wear and shape in real-time, it achieves scrap reduction without stopping production. The interface unit connects two sensors. It is possible to perform the same function with both or to execute two different functions. *For more details, please refer to the PDF document or feel free to contact us.*

• Sensors
• Wafer
• Other measurement, recording and measuring instruments

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

Announcement of Participation in "CEATEC 2025" [Exhibition Announcement] JAPAN PACK 2025 October 14 (Tuesday) to October 17 (Friday) 10:00 AM to 5:00 PM [Exhibited Products] Eco-friendly, high-performance, low-cost cardboard cooling boxes

[Speaker] Koji Endo, Senior Managing Director and Chief Executive Analyst, SBI Securities Co., Ltd. Economic Research Department [Lecture Topics] 1. Topics related to the automotive industry in 2025 2. Many motor shows worldwide in the second half of the year, with a succession of new car launches 3. Emphasis on the risks of not holding Toyota stock 4. Upward revisions in interim financial results (Toyota, Honda, SUBARU, Suzuki, Toyota group parts, etc.) 5. The U.S. economy and new car demand may surprisingly remain strong 6. Reenactment of partnership discussions (Honda, Nissan, Mazda, Foxconn, cross-industry, parts) 7. Implementation of Trump's tariffs, additional tariff rate on automobiles from 27.5% to 15% 8. Q&A / Business card exchange *The program may be subject to change based on the latest trends.

[Speaker] Analyst Shugo Arai, Next Generation Infrastructure and Services Office, Strategic Project Team, Mizuho Bank, Ltd. [Key Lecture Content] Nuclear fusion is a next-generation energy technology that has the potential to contribute to both energy and environmental issues. Japan has led research and development under international cooperation and has accumulated high technological capabilities. In recent years, private startups have been advancing in the development competition, raising expectations for early practical application. This lecture will explain the history of nuclear fusion research and development, the latest trends in startups and policies, and the direction of efforts towards industrialization in Japan. [Lecture Items] 1. History of research and development through international cooperation towards the realization of nuclear fusion power generation 2. Trends in diverse research and development by startups aiming for practical application 3. Policy trends overseas and Japan's "Fusion Energy Innovation Strategy" 4. Challenges to practical application and points to watch in the future 5. Challenges and responses towards the industrialization of nuclear fusion energy in Japan 6. Q&A / Business card exchange

Announcement for Nagoya Messe 2025. 【Exhibits】 　Injection Molding 　　Bioplastics 　Rigid Polyurethane Molding 　　Eco-friendly, high-performance, low-cost cardboard cooler boxes 　Micro Pumps