Notice of Participation in SEMICON JAPAN 2024

Shorten cycle time! A versatile and easy-to-use optical interference measuring instrument designed for convenience.

The "NCG" is a thickness measurement device using optical interference technology. It calculates and measures the thickness of layers through the interference caused by the reflection of light waves at the joint surface of the workpiece. It is designed to manage the thickness of different materials such as glass, plastic, and silicon wafers. This product can be connected to various machines, allowing for high-precision and high-speed management of component thickness, and can be used in dry or wet environments within the specified limits of the specifications, either on the machine or inside the machine. 【Features】 ■ Guarantees processing accuracy within the desired tolerance ■ Reduces cycle time ■ Control for maintaining stable production under controlled conditions ■ Compensation for mechanical variations ■ History of measurement results *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement, recording and measuring instruments
• Optical Measuring Instruments

Realizing non-contact thickness measurement of various materials that transmit white light.

The P3CF is a measurement system that combines traditional contact probes with a non-contact probe using confocal technology (hybrid measurement). It can directly measure the distance of various materials and the thickness of transparent materials in white light. The thickness of thin and delicate materials (such as ceramics, semiconductor wafers, and epoxy resin mold compounds for packaging) requires precise measurement in the finishing process, but it is challenging to measure with contact methods. The P3CF, which employs confocal technology, measures the thickness non-contact by determining the distance from the reference plane to the work surface. *For more details, please refer to the PDF document or feel free to contact us.*

• Sensors
• Wafer
• Other measurement, recording and measuring instruments

Achieving high-speed and wide-ranging non-contact/non-destructive measurement on various surfaces.

SOLARIUS VIKING is a compact and lightweight optical 3D surface roughness and shape measurement device. By using sensors for measurement, it allows for a different approach compared to traditional microscopes. It is particularly suitable for customers facing challenges in measuring the surface roughness and thickness of materials that are thin, soft, and prone to scratches, such as wafers and lithium-ion battery separators. Utilizing advanced sensor technology, it quickly provides 3D surface topography maps and measurement results compliant with international standards. Additionally, its compact design saves space. With easy setup and high operability, it allows for quick configuration of the 3D optical inspection process, contributing to a reduction in operator workload. More measurements can be conducted in a shorter time. 【Suitable for customers with the following challenges】 - Looking to improve visual tasks or manual measurements - Wanting user-friendly equipment for anyone - Needing machine alignment (tilt or misalignment) - Seeking detailed understanding of measurements and data management - Searching for special applications that require customization *We also welcome inquiries regarding sample measurements. Please feel free to contact us.

• Lithium-ion battery
• Wafer
• Optical Measuring Instruments

High-precision 3D surface measurement to meet the demands of complex surface measurements.

AOP-PCI (Probe Card Inspection) is a multifunctional, non-contact, non-destructive inspection tool designed to comprehensively check probe cards. By combining an air bearing stage with state-of-the-art sensors and vision systems, it can obtain high-precision data on the tips, head shapes, and PCB surfaces of full-size square direct dock probe cards. Additionally, dedicated measurement algorithms enable seamless execution of both data acquisition and analysis routines. *For more details, please refer to the PDF materials or feel free to contact us.*

• Wafer
• Semiconductor inspection/test equipment
• Other measurement, recording and measuring instruments

Achieving reduced cycle time in chip manufacturing and high quality! Sensors for blade monitoring during wafer cutting.

"VBI" monitors the blade during wafer cutting, ensuring high reliability and reducing waste. By measuring blade wear and shape in real-time, it achieves scrap reduction without stopping production. The interface unit connects two sensors. It is possible to perform the same function with both or to execute two different functions. *For more details, please refer to the PDF document or feel free to contact us.*

• Sensors
• Wafer
• Other measurement, recording and measuring instruments

[Speaker] Ministry of Defense, Defense Planning Bureau, Defense Planning Division Director of Early Equipment Promotion Office, Mr. Toshiyuki Hinosawa [Key Lecture Content] As the security environment surrounding our country has become the most severe and complex since the post-war period, we are advancing efforts toward early equipment procurement in areas that are particularly urgent and important from a policy perspective, while also incorporating cutting-edge technology. In particular, unmanned assets were heavily utilized during Russia's invasion of Ukraine, drastically changing the nature of combat. In the future, I will discuss how the Ministry of Defense and the Self-Defense Forces will enhance these capabilities, including the multi-layered coastal defense system concept "SHIELD." [Lecture Items] 1. Concept and Overview of Early Equipment Procurement 2. Major Efforts Toward Early Equipment Procurement to Date 3. Strengthening Defense Capabilities of Unmanned Assets 4. Establishing a Multi-Layered Coastal Defense System "SHIELD" Using Unmanned Assets 5. Q&A / Business Card Exchange

We will be exhibiting at the "Converting Technology Comprehensive Exhibition 2026," which focuses on processing machines and equipment centered around converting technology. When you visit, please be sure to stop by our booth. We sincerely look forward to your visit. 【Our Booth Number】 2W-R33

[Instructor] Shunsuke Suzuki, President and CEO, Management Techniques Co., Ltd. [Key Lecture Content] The modern business environment is changing at an unpredictable pace, and to achieve success, new approaches that go beyond traditional thinking are essential. "Normal" thinking and "conventional" solutions cannot differentiate you in a highly competitive market. True breakthroughs arise from stepping outside the box. Therefore, the ability to "discover hidden problems and create innovative ideas that others cannot think of" becomes crucial. So, how can we develop such abilities and apply them in the business field? Successful business leaders, skilled engineers, and entrepreneurs who have achieved results do not rely solely on logic; they employ creative thinking. This can be broadly categorized into four areas: associative thinking, abstract thinking, multifaceted thinking, and conceptual thinking. In this seminar, we will learn four creative thinking approaches that will be immediately applicable in business settings. Through these, let’s master the way of thinking that will keep you one step ahead in the business world.

[Speaker] President and CEO of Leading Innovation Co., Ltd. Senior Consultant Yoshizawa Yosuke [Lecture Topics] 1. Common sense is creating a sense of stagnation in new product and new business development. 2. Reasons why "latent needs are infinite." 3. How to convert technology into functionality. 4. The importance and methods of converting functionality into value. 5. How to discover attractive themes from technology through a business structure map and generative AI. 6. Formulating competitive advantage strategies. 7. Q&A Session.

Notice of Participation in the 54th International Hotel and Restaurant Show We will be exhibiting at the "International Hotel and Restaurant Show," one of Japan's largest trade fairs supporting the service industry and food business. We warmly invite you to visit our booth when you attend the event. We look forward to seeing you there. [Our Booth Number] West Exhibition Hall W1-A32