We will exhibit at Productronica China 2025 held in Shanghai, China.

2025 Electronics Packaging Society Technical Award Winner!" "55th Mechanical Industry Design Award IDEA Winner!

Takaya Corporation has announced a new model of its flying probe tester, the "APT-2400F/APT-2600FD series," which reliably detects various defects in printed circuit boards through ultra-high-speed inspection. Equipped with cutting-edge inspection technology that can check the placement and connections of fine components with high precision, it ensures that even minor defects and risks are not overlooked, strongly supporting the improvement of product quality. Additionally, thanks to the company's unique control mechanisms and sensing technology, reliable inspections can be achieved even in fluctuating environments, contributing to quality management by reducing recall risks. Furthermore, it features a user-friendly interface that anyone can intuitively operate, helping to alleviate burdens in workplaces where labor shortages are becoming serious, while still ensuring high inspection accuracy and contributing to increased productivity. *For more details, please download the PDF document or feel free to contact us.*

• Other measurement, recording and measuring instruments

A new innovation in substrate manufacturing. Achieving improvements in production efficiency and inspection accuracy!

The APT-2600FD is a next-generation dual-side flying probe tester that can perform combination testing with up to 6 probes using both upper and lower flying probes simultaneously. It improves test coverage while reducing the risk of product damage due to board flipping operations, significantly shortening inspection time. Equipped with a high-performance measurement system and a variety of features, it contributes to quality improvement from prototyping to mass production. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.*

• Other measurement, recording and measuring instruments

The probe head is arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

The simultaneous use of upper and lower flying probes enables a combination inspection of up to 6 probes, allowing for the inspection of components that can make contact at both points on the top and bottom of the substrate. This model boasts world-class standards in speed and positioning accuracy while expanding the compatible substrate size to W635×D610mm. Furthermore, by adding an optional split inspection function, it is capable of inspecting long substrates up to W985×D610mm. It can accommodate component heights of up to 60mm and substrate weights of up to 10kg, making it suitable for inspecting substrates used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★Evaluation tests can be conducted by bringing your substrates to the demo room at our Okayama headquarters★ The entire process from creating inspection programs, inspecting using actual substrates, to summarizing evaluation results can be tested in a single flow. If you are interested, please apply through the 'Contact Us' section below.

• Circuit Board Inspection Equipment

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

Our company will be exhibiting at the "13th Chubu Lifeguard TECH 2025 - Disaster Prevention, Mitigation, and Crisis Management Exhibition" held at Port Messe Nagoya. This exhibition aims to build a resilient society that can confront the next major disaster, showcasing products, technologies, and services that contribute to "disaster prevention, mitigation, and crisis management." It also seeks to enhance the disaster response capabilities and crisis management abilities of businesses and society, promote related industries, and contribute to the formation of a safer society, in cooperation with the Nankai Trough Earthquake Countermeasure Chubu Region Strategy Conference. At our booth, we plan to display actual NMG generators and controllers. We sincerely look forward to your visit.

[Speaker] Hajime Hiraki, CEO of Chemistry Cube Co., Ltd., Innovation Consultant [Key Lecture Content] Until now, in many companies, managers who operate and manage organizations and specialists in specific technical fields have been established as the career paths for engineers and researchers. However, as uncertainty increases, there is a growing demand for value creation capabilities that anticipate societal challenges and customer needs and generate innovation. In this context, the importance of a new career path, "Technical Leader," distinct from traditional managers and specialists, is on the rise. In this lecture, we will focus on the "Technical Leader," who plays a central role in value creation centered on technology, and explain their role, the required abilities, and the approach to their development, using case studies. [Lecture Items] 1. The Era of Technical Leaders 2. What is a Technical Leader? 3. Practicing Technical Leadership - Management Techniques for Technical Leaders 4. Development of Technical Leaders 5. Q&A / Business Card Exchange

[Lecture Topics] 1. Smart City Policies by the Cabinet Office Yusuke Nakamura, Planning Officer, Cabinet Office, Science and Technology Innovation Promotion Secretariat 1. Policy Positioning of Smart Cities 2. Smart City Policies of the Cabinet Office 3. Revision of SCRA 4. Q&A / Business Card Exchange 2. Digital Policies of the Ministry of Internal Affairs and Communications Promoting Community DX Tatsuhiko Saruta, Deputy Director (Smart City and Subsidy Projects), Digital Economy Promotion Office, Information and Communications Bureau, Ministry of Internal Affairs and Communications 1. Current Status and Challenges of Local Communities 2. Expected Roles of Digital Technology and Strategies for Problem Solving 3. Status of Initiatives in FY R7 by the Ministry of Internal Affairs and Communications 4. Future Initiatives 5. Q&A / Business Card Exchange 3. Initiatives for Promoting Smart Cities by the Ministry of Land, Infrastructure, Transport and Tourism Masahiro Kobayashi, Planning Specialist, Digital Information Utilization Promotion Office, International and Digital Policy Division, Urban Bureau, Ministry of Land, Infrastructure, Transport and Tourism 1. Initiatives to Promote the Spread of Smart Cities 2. Urban Development DX and Project PLATEAU 3. Q&A / Business Card Exchange

[Speaker] Toru Kumagai, Journalist from Germany [Lecture Topics] 1. The German government holds a summit meeting to support the automotive industry 2. Will the EU change the ban on new internal combustion engine vehicle sales by 2035? 3. The main players at the Munich Auto Show IAA Mobility are China and BEVs 4. The strategy of Chinese OEMs steadily expanding their foothold in Europe 5. Reasons for the recovery of new BEV registrations in Europe by 2025 6. Is the hollowing out of the German automotive industry progressing due to Trump tariffs? 7. Q&A