Flying Probe Tester APT-2400F / 2600FD

Takaya Corporation will exhibit at "Productronica 2025," one of the world's largest electronics manufacturing trade shows, to be held in Munich, Germany, in November 2025. At this exhibition, we will showcase the latest model of our flying probe tester at the booth of Itochu Corporation and SYSTECH Europe GmbH. This is a great opportunity for everyone, especially in Europe and around the world, to experience Takaya's high-precision and high-speed inspection technology. We invite you to stop by our booth when you visit.

We are pleased to announce that Takaya Corporation's initiatives will be featured as a user case at the technology event "LINX DAYS 2025," hosted by Links Corporation. "LINX DAYS" is a technology event focused on cutting-edge technologies that support the advancement and automation of the manufacturing industry, including machine vision, industrial cameras, 3D sensors, robotics, and AI. It features presentations and case studies from leading companies both domestically and internationally, providing a valuable opportunity for many engineers, developers, and executives involved in manufacturing to engage with the latest industry trends and practical solutions. This time, we will be discussing the theme "Enhancing the Value of High-Speed Flying Probe Testers through HALCON Implementation," highlighting how our flying probe testers have evolved through the use of the image processing library "HALCON" and how we have achieved further precision and speed in the inspection process. We hope this information will be beneficial for those working on quality improvement and inspection automation in manufacturing environments.

In the October 2025 issue of the monthly magazine "Inspection Technology" (Nihon Kogyo Shuppan), an article about our latest technology has been published. Published article: "Latest Trends in Flying Probe Testers Equipped with New Technology" Author: Koki Yanagida, Industrial Equipment Division, Takaya Corporation This paper discusses the technological innovations of the latest flying probe testers designed to accommodate the high-speed and high-density printed circuit boards, as well as examples of the introduction of JTAG collaboration and ZERO impact technology.

Our paper has been published in the "Journal of the Japan Institute of Electronics Packaging" (hereinafter referred to as "JIEP"), Vol. 28 No. 6 (September 2025). Published Paper "Development of an Ultra-High-Speed Flying Probe Tester for PCB Assembly Inspection" Author: Kouki Yanagida Paper Summary This paper reports on a new technology for the ultra-high-speed flying probe tester developed to address the challenges of high cost and difficulty in accessing fine components associated with traditional fixture-based in-circuit testing, proposing a new standard for next-generation high-density assembly board inspection.