I have had a paper published in the Journal of the Institute of Electronics Packaging.

Our paper has been published in the "Journal of the Japan Institute of Electronics Packaging" (hereinafter referred to as "JIEP"), Vol. 28 No. 6 (September 2025).
Published Paper
"Development of an Ultra-High-Speed Flying Probe Tester for PCB Assembly Inspection"
Author: Kouki Yanagida
Paper Summary
This paper reports on a new technology for the ultra-high-speed flying probe tester developed to address the challenges of high cost and difficulty in accessing fine components associated with traditional fixture-based in-circuit testing, proposing a new standard for next-generation high-density assembly board inspection.

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