Introduction of the technology that supports our products.

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• Special Processing Machinery
• Other processing machines
• Processing Contract

Instantly heats only the "necessary areas" even in ultra-small sizes. New possibilities for sensors, analysis, medical, environmental, and microdevice development.

Our micro heater is a tiny, fast-response heating element formed using semiconductor microfabrication (MEMS technology). It has detection functions for gases, temperature, and humidity depending on the heater temperature. It also features high durability due to its unique filter structure. It can instantly reach temperatures above 400°C, and its high precision in temperature control makes it noteworthy in fields that require high speed, energy efficiency, and localized heating, which conventional heaters cannot accommodate. Beyond applications in gas sensors, it can be developed as a "thermal source technology" suitable for incorporation into next-generation products in areas such as: - Medical and bio - Safety and industry - Chemical analysis and thermal analysis - Microfluidic devices - Materials and processes - IoT, wearables, and mobile devices.

• Sensors

The contact combustion-type gas sensor is a sensor that detects gas concentration by utilizing the heat generated during the combustion (oxidation reaction) of flammable gases.

Contact combustion-type sensors are widely used for the detection of combustible gases such as methane and propane. They are also commonly used as gas leak detectors in industrial and household settings, playing a crucial role in safety measures.

• Sensors

Our company has developed a system that enables simple and highly accurate measurement of the calorific value of biogas, and we are conducting demonstration experiments for it.

By focusing on the methane gas contained in biogas and measuring its concentration, we can indirectly determine the calorific value. For measuring methane gas concentration, we use an infrared gas sensor that utilizes the infrared absorption wavelength of gas molecules. This allows for rapid and highly accurate measurement of gas concentration even in high concentration areas. It is equipped with a compact and inexpensive pressure reduction and flow rate stabilization system, enabling the extraction of process gas and real-time data acquisition. An example of methane concentration measurement data can be downloaded from the catalog. *For more details, please feel free to contact us. *Please note that we cannot reply to g-mail addresses on our company system.

• Sensors

Utilizing the principle of "uchimizu," we create cold water from heat. We will explain that technology (mechanism) in an easy-to-understand manner.

In normal physical phenomena, it is considered difficult to directly create cold water from heat. Heat is a form of energy in an object, and since energy is conserved, it is necessary to convert the heat into another form of energy in order to cool it down. Because heat naturally flows from high temperature to low temperature, it is possible to cool an object by removing heat. For example, it becomes possible to create cold water by extracting heat from a heat source through water and transferring it to another object to lower its temperature.

• Heat exchanger
• Other air conditioning equipment

Reusing "unused" heat! We will explain the specific process of generating "cold water" from "heat."

First, a low-temperature, low-pressure gas-liquid mixed refrigerant (water and water vapor) enters the evaporator. Inside the evaporator, the pressure is almost at a vacuum state, so the boiling point of water at 100°C is reduced to about 7-10°C. By absorbing heat from relatively warm water in the chilled water piping, the refrigerant (water) boils and turns into water vapor. The water vapor is drawn into the absorber, similar to the suction side of the compressor in a vapor compression refrigeration cycle. The water vapor is absorbed by the absorbent liquid "lithium bromide" and is pumped into the regenerator. In the regenerator, the mixture of refrigerant and absorbent liquid is heated and separated back into the original water vapor and absorbent liquid. The absorbent liquid returns to the absorber, while the water vapor is sent to the condenser. There are methods for adding heat in the regenerator, such as combustion using fuels like gas or oil, or using steam or hot water. The refrigerant, which has returned to water after losing heat in the condenser, is depressurized in the expansion device and flows back to the evaporator, repeating the cycle.

• Heat exchanger

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)