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  4. High-performance slim tower business computer "LPC-1800 Series" now available.
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  • Apr 17, 2025
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Apr 17, 2025

High-performance slim tower business computer "LPC-1800 Series" now available.

コンテック コンテック
Contec has developed the "LPC-1800 series (hereinafter referred to as the new product)," a high-performance slim tower business computer equipped with the 13th generation Intel(R) Core(TM) processor, known for its excellent expandability. Orders will begin on April 16, 2025. The new product features a compact design (width 330mm, depth 399mm, height 96mm) that can be installed in limited spaces, while being a business computer that adopts the high-performance Intel Q670 chipset. Despite maintaining the same external dimensions as the current LPC-1700 series, CPU performance has improved by approximately 2.8 times. (*1) To allow customers to choose the optimal specifications based on their applications and budgets, we have adopted a BTO (Build To Order) method that allows for free configuration by selecting components such as CPU, memory capacity, and storage from a menu, accepting orders from just one unit. Windows 11 IoT Enterprise LTSC 2024 is also planned for future support. *1 Based on a comparison of PassMark values between the previous product LPC-1700 "Core(TM) i5-8500T" and the new product LPC-1800 "Core(TM) i5-13500TE."
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Business Computer LPC Series LPC-1800-J
Slim tower type PC / Intel 13th Gen. (Raptor Lake + Q670)
Business Computer LPC Series LPC-1800-G
Slim tower type computer LPC-1800 / Intel 12&13th Gen. (Alder Lake-S, Raptor Lake-S)
Business Computer LPC/GPC Series

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LPC-1800(ビジネスコンピュータ)1.jpg

High-performance slim tower business computer LPC-1800

A business PC equipped with a high-performance CPU that enables high-resolution image display and smooth video playback, featuring a compact design while offering a wealth of expansion interfaces.

This product is a business computer with a compact design (width 330mm, depth 399mm, height 96mm) that can be installed in limited spaces, while adopting the high-performance Intel Q670 chipset. While maintaining the same external dimensions as the current LPC-1700 series, the CPU performance has improved by approximately 2.8 times. (*1) It is equipped with four expansion slots and a wealth of expansion interfaces. Additionally, with the built-in Intel(R) UHD Graphics 710/730/770, it is capable of displaying high-definition images and smooth video playback. To allow you to choose the optimal specifications based on your needs and budget, we have adopted a BTO (Build-To-Order) system that allows you to freely configure components such as CPU, memory capacity, and storage from a menu, and we accept orders starting from one unit. It is also compatible with Windows 11 IoT Enterprise LTSC 2024. *1 Based on a comparison of PassMark values between the conventional product LPC-1700 "Core(TM) i5-8500T" and the new product LPC-1800 "Core(TM) i5-13500TE."

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lpc1700standl_rgb_96dpi_500x500_rs.jpg

High-performance slim tower PC LPC-1700 series with excellent expandability.

Industrial computer equipped with a high-performance Intel® Q370 chipset, ensuring high expandability.

The LPC-1700 series is an industrial computer with a compact design (height 96mm, width 330mm, depth 399mm) that can be installed in limited spaces, while ensuring high expandability through the use of a high-performance Intel® Q370 chipset. It is equipped with various expansion interfaces, including four expansion slots (1 PCI Express (x16) slot, 2 PCI Express (x4) slots, and 1 PCI slot), three Gigabit LAN ports, one serial port (compatible with RS-232C/RS-422A/485), and six USB 3.2 Gen1 ports. The built-in GPU HD630 supports 4K (3840×2160 pixels) resolution, enabling high-definition image display and smooth video playback. It also features a rich array of display interfaces, including DVI-I, HDMI, and DisplayPort. 【Main Features】 ● Compatible with Intel® Core™ processor series Coffee Lake ● High-performance graphics integrated into the CPU ● Abundant interfaces for flexible peripheral expansion ● GPU board can be installed. Four expansion slots

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Related catalog(2)

High-performance PC LPC-1800 series that can be installed in limited spaces.

High-performance PC LPC-1800 series that can be installed in limited spaces.

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High-performance slim tower industrial PC LPC-1700 series with excellent scalability.

High-performance slim tower industrial PC LPC-1700 series with excellent scalability.

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[Cast Iron Crack] We will repair cracks in metal products without applying heat.

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The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Apr 11, 2026

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[Cast Iron Crack] We will repair cracks in metal products without applying heat.

  • NEW
  • COMPANY

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is kept to a minimum. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Apr 11, 2026

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"Welding repair crack repair" We will repair metal cracks without applying heat.

  • NEW
  • COMPANY

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If you require a detailed technical explanation, please contact us.

Apr 10, 2026

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Aluminum prototype: Lost wax casting sand mold layered 3D printer prototype.

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● The production time for casting prototypes can be shortened! Since model production is not required, the time needed to create prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! With one molding process, different products with similar shapes or varying dimensions can be molded at the same time. This allows for the verification of multiple types in a short period.

Apr 10, 2026

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SPACECOOL has been selected as the only finalist from Japan for "The Liveability Challenge 2026," which evaluates innovative solutions to sustainability challenges in tropical cities, among over 1,500 submissions from more than 100 countries, making it to the final eight candidates.

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SPACECOOL Inc. is pleased to announce that it has been selected as one of the eight finalists in The Liveability Challenge 2026, hosted by the Temasek Foundation and operated by Eco-Business. The Liveability Challenge (TLC) is a global initiative that evaluates innovative solutions to urgent sustainability challenges in urban tropical regions. This year, under the themes of "Decarbonisation" and "Cool Earth," there were over 1,500 submissions from more than 100 countries, the highest number to date. Our company was the only Japanese firm selected as a finalist and received recognition in the Cool Earth category, which focuses on addressing extreme weather events related to climate change. We will present at the Grand Final, which will be held on May 20, 2026, at the Marina Bay Sands Expo and Convention Centre in Singapore, where we will participate in the final pitch.

Apr 10, 2026

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