【May 21, 2025 - May 23, 2025】Automotive Technology Exhibition 2025 YOKOHAMA: Displaying the high-current flexible circuit board "BigElec" at the booth of Daitron Co., Ltd.

Slim shape compatible with high current. Can be curved, suitable for integration into narrow spaces. An alternative to busbars and harnesses.

Our "High Current Flexible Wiring Board" is a product designed for high current wiring, intended as a substitute for busbars and harnesses. By forming a copper foil layer with a conductor thickness of 75 to 90 μm, it is possible to carry higher currents than standard flexible printed wiring boards. The substrate uses polyimide film, and soft resist ink is used as the insulating material, allowing for flexibility, which makes it suitable for installation in tight spaces. 【Features】 ■ Capable of carrying high currents ■ Can be installed and bent in narrow spaces ■ Compatible with through-hole components and surface-mounted components ■ Can integrate connections between substrates, contributing to a reduction in assembly labor *For more details, please refer to the PDF document. Feel free to contact us with any inquiries.

• Printed Circuit Board

The Big Elec flexible circuit board compatible with high current has three features.

Big Elec is a flexible circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-section. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high-current electronic components. Big Elec's low inductance reduces voltage spikes, contributing to the reliability of high-current electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible circuit boards. 【Feature 3】 High Design Freedom It ensures the same design freedom and usability as printed circuit boards. Pattern wiring and external shapes can be customized to meet specific requirements. It also supports the mounting of electronic components and connectors using paste solder.

• Other electronic parts

BigElec Fold - Customize flexible high-current wiring at a reasonable price.

BigElec Fold is a flexible and cost-effective high-current wiring solution that serves as an alternative to busbars and wire harnesses. ■ Features - Thin and flat printed circuit board structure - Customizable according to the desired shape and applied current of the customer - Two-layer construction allows for cost reduction and bending processing BigElec Fold emphasizes cost performance by limiting itself to a two-layer structure instead of a multi-layer one. This reduces material costs and makes bending processing easier, allowing for folding as well. BigElec Fold can connect to multiple terminals in its flat state, and by folding the wiring, it can also be accommodated in tight spaces. It can be freely designed and folded according to the application and wiring space. It realizes innovative ideas in the design field and provides excellent cost performance. BigElec Fold paves the way for the next stage of high-current wiring and meets customer expectations.

• Printed Circuit Board

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

Big Elec is a flexible printed circuit board designed for high current wiring, achieving a flat shape and thin profile as an alternative to busbars and wire harnesses. It boasts three remarkable features. 【Feature 1】 Low Inductance Thanks to its unique structure, it achieves lower inductance compared to conventional wires with the same conductor cross-sectional area. When switching high currents at high frequencies, high inductance can cause significant voltage spikes, potentially damaging high current-compatible electronic components. The low inductance of Big Elec reduces voltage spikes, contributing to the reliability of high current-compatible electronic components. 【Feature 2】 Flat Shape and Flexibility Its unique structure allows for a thin conductor, flat shape, and flexibility. It is flatter than traditional wire harnesses and can handle higher currents than conventional flexible printed circuit boards. 【Feature 3】 High Design Freedom It ensures design freedom and usability similar to printed circuit boards. Pattern wiring and external shapes can be customized according to requirements. It also supports the mounting of electronic components and connectors using paste solder.

• Harness

Suitable for incorporation into curved and narrow spaces. It can form high current circuits with a thin shape and low inductance.

BigElec is a flexible printed circuit board designed for high current wiring, intended as an alternative to busbars and wire harnesses, featuring a slim and flat design. Similar to printed circuit boards, it can accommodate pattern formation and assembly according to your requirements. We have newly introduced the "BigElec Standard Specification Products," which are easy to implement for connections between screw terminals. The BigElec Standard Specification Products have no initial costs, allowing for reduced upfront expenses. 【BigElec Standard Specification Product Specifications】 ■ Layers: 2 layers, 4 layers, 6 layers, 8 layers ■ Wiring width: 8mm to 11mm (integers only) ■ Total length: 30mm to 210mm (integers only) ■ Terminal screw diameters: M3 (hole diameter φ3.8mm), M4 (hole diameter φ4.4mm), M5 (hole diameter φ5.4mm), M6 (hole diameter φ6.5mm), M8 (hole diameter φ8.5mm) *For more details, please download the PDF or contact us.

• Wiring materials

Flexible substrate that bends freely and supports high current! Easily connects in tight spaces! Big Elec SMT Connect.

Attention all users of electric wires, wire harnesses, busbars, and bus bars! "Big Elec SMT Connect" (High Current FPC Surface Mount Connector Split Specification) is a compact flexible circuit board that allows for high current wiring even in extremely small spaces, thanks to its flat shape. It can be offered as a solution that significantly enhances design flexibility. The highly flexible circuit board allows for component mounting and can be used in bent configurations, making installation in tight spaces easy. Furthermore, its thinness contributes to space-saving. We propose an excellent high current wiring solution. Please give Big Elec SMT Connect a try!

• power supply
• Other power sources

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

When conducting structural analysis of organic compounds, IR, NMR, and MS can be considered the three sacred treasures. If the analysis is performed correctly, it is possible to elucidate the structure of even quite complex compounds. However, actual spectra are often not of a single compound, as seen in textbooks, which can lead to significant challenges in interpreting results for beginners in analysis. Additionally, while database searches are a useful tool in structural analysis, the ability to read spectra is necessary to select the correct structure from among the candidates, not just pattern matching. In this course, we will lecture on the basic ways to interpret IR, NMR, and MS spectra, including simple explanations of principles, points to be aware of during analysis, and how to proceed with actual analysis, incorporating some exercises as well.

◆Mechatrotech Japan 2025 —◆ Troax Safety Systems Co., Ltd. will be exhibiting at "Mechatrotech Japan 2025." ■ When it comes to steel safety fences, think "TROAX" - We will showcase steel safety fences used around robots, equipment, and conveyor lines. ■ The safety guard "FlexGuard" absorbs impact with flexible materials and boasts excellent durability - This safety guard ensures the safety of workers in environments where people and "machines/vehicles" interact, such as manufacturing sites, truck areas, and packing areas. At our booth, our staff will be available to answer various questions and address challenges related to products and safety measures on-site. We sincerely look forward to your visit.

Luminex Japan Co., Ltd. will exhibit at the 33rd Annual Meeting of the Japanese Society for Organ Transplantation, held at Nagasaki University from October 3 (Friday) to October 5 (Sunday). Please feel free to consult us at our booth regarding any questions about Luminex systems. We would also love to hear your feedback and requests!

[Speaker] Yuri Ishii, Deputy Director, Environmental Economics Division, Minister's Secretariat, Ministry of the Environment [Key Lecture Content] This guide has been created with the intention of assisting companies in responding to the increasing demands for disclosure in various environmental fields, such as climate change and natural capital, and was published in June of the 7th year of Reiwa. The "integrated approach" introduced in this guide suggests that companies should not respond individually to the disclosure requirements in each environmental field, but rather engage with an awareness of their interconnections. Through this initiative, we aim to improve business processes under management involvement, effectively and efficiently address various environmental issues, and facilitate disclosure. The key points of the guide will be explained. [Lecture Items] 1. Expansion of environmental issues to be addressed 2. Significance of integrated initiatives and disclosure 3. Trends in sustainability-related information disclosure 4. Methods and benefits of integrated initiatives and disclosure; case studies of companies 5. Utilization of environmental due diligence for information disclosure 6. Q&A / Business card exchange