Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.

Equipped with process monitoring features! A green sheet cutter that accommodates everything from fine devices to 6mm thick materials.

The "GC1000MS" is a green sheet cutter capable of handling everything from fine cuts to vertical cuts of thick materials. By reducing cutting load, it achieves vertical cuts. The optional ultrasonic assist function reduces the cutting load on the blade, enabling vertical cuts of thick materials. Additionally, it is equipped with a process monitoring function that allows for detailed understanding of process operations through various sensor information built into the device, making it effective for process startup and mass production management. 【Features】 ■ Capable of handling fine cuts to vertical cuts of thick materials ■ Achieves vertical cuts by suppressing elastic deformation ■ Precise positioning for component patterns using image recognition function ■ Equipped with process monitoring function *For more details, please refer to the PDF document or feel free to contact us.

• Plastic processing machines (cutting and rolling)

Compact and easy to deploy in production and development sites! Equipped with comprehensive process monitoring features.

The standalone ultrasonic metal joining device 'UB050/300/500SA' is a compact standalone ultrasonic metal joining device that is easy to place in production and development sites. With a built-in linear encoder and rigid clamp in the joining head, it accurately controls the position of the joint using a high-rigidity ultrasonic horn unit. Additionally, it achieves a wide dynamic range through a low-friction pressurization mechanism, providing high responsiveness to deformation during joining, and improves joinability by increasing the load with linear pressurization as the joining progresses. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision position control ■ High-functionality load control ■ Comprehensive process monitoring capabilities *For more details, please refer to the PDF materials or feel free to contact us.

• Welding Machine

In addition to joining the same type of metal, welding enables the joining of different types of metals that is difficult to achieve!

The "UB2000/3000/5000SA" is an ultrasonic welding machine suitable for secondary batteries and power-related devices. Equipped with comprehensive process monitoring functions, it allows for detailed understanding of process operations through various sensor information built into the device, making it effective for process startup and mass production management. Additionally, the built-in linear encoder and rigid clamp in the welding head accurately control the position of the weld joint with a high-rigidity ultrasonic horn unit. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision position control ■ High-performance load control ■ Comprehensive process monitoring functions *For more details, please refer to the PDF materials or feel free to contact us.

• Welding Machine

Compatible with a wide range of applications! A multifunctional ultrasonic welding system integrated in a compact design.

The "UP-Lite1500" is a metal joining device suitable for transitioning from power device development to mass production. This machine is designed as a standalone unit with the premise of being integrated into a mass production system. Development recipes can be directly transitioned to mass production. By adopting a unique rigid clamp method for holding the horn, it achieves high rigidity while maintaining a highly flexible cantilever structure. 【Features】 ■ Suitable for standalone and device integration ■ High rigidity with a highly flexible cantilever structure ■ Integrated joining system with monitoring capabilities ■ Compatible with a wide range of applications *For more details, please refer to the PDF materials or feel free to contact us.

• Other processing machines

Ultrasonic cutter for cutting metal and resin materials with high-quality cross-sections.

The "UC1000LS" is an ultrasonic cutter that assists in the precision cutting of industrial products using ultrasonic technology. By applying high-frequency vibrations to the blade, it suppresses material deformation during cutting, allowing for high-quality cross-sections. Additionally, by controlling the position with a high-precision actuator, it achieves half-cutting of thin materials. 【Features】 ■ Assists in the precision cutting of industrial products with ultrasound ■ Cuts metal and plastic materials with high-quality cross-sections ■ Achieves high-precision half-cutting even for thin materials ■ Allows for shape cutting with shaped blades ■ Cuts out small parts while feeding the material stage *For more details, please refer to the PDF document or feel free to contact us.

• Other processing machines

Ideal for power devices! The ultrasonic head is highly rigid and compact!

The ultrasonic metal joining device 'UB2000/3000/5000LS' is an ultrasonic metal joining device suitable for power devices. The ultrasonic horn is directly clamped by a rigid clamp. This results in the ultrasonic head being highly rigid and compact. Additionally, it achieves a wide dynamic range through a low-friction pressurization mechanism, providing high responsiveness to deformation during joining. The joining capability is enhanced by linear pressurization that increases the load as the joining progresses. 【Features】 ■ High rigidity horn clamp mechanism ■ High precision position control ■ High functionality load control ■ Comprehensive process monitoring capabilities *For more details, please refer to the PDF materials or feel free to contact us.

• Welding Machine

This is a mass production ultrasonic metal joining device suitable for inverter production!

The "TB1000MS" is a mass production ultrasonic metal joining device suitable for inverter production. ■ It is suitable for electrode connections in high-temperature inverters and other applications. 【Features】 - Flexible production ⇒ Covers joining conditions suitable for various terminals with a single device - Strong against terminal float ⇒ Starts joining by pressing down on the float with an air servo - Color image processing ⇒ Stable alignment of terminals and horns through color image recognition *For more details, please download the PDF or feel free to contact us.

• Other processing machines

Achieving fully immersed UD tape manufacturing with a groundbreaking device size.

The "UD1000MS" is an ultrasonic opening and impregnation device that has achieved complete impregnation UD tape manufacturing in a groundbreaking device size. ■ CFRTP UD Tape Opening and Impregnation By using ultrasound for the opening and impregnation of carbon fibers, which was traditionally done with air opening and heater heating, we achieve homogeneous opening and impregnation. 【Features】 - Effective application of ultrasound for opening and impregnation Carbon fibers are opened uniformly without damage, and high-viscosity thermoplastic resins are impregnated while suppressing voids. - Smooth surface and uniform cross-section In ultrasonic impregnation, the surface of the impregnated area is smooth, and the cross-section of the impregnated area shows uniform dispersion of carbon fibers. - Impregnation resin supply in film form Compared to traditional impregnation resin supply forms (powder, liquid phase), it can be supplied in film form, which has many advantages. - Compact device Ultrasonic technology has dramatically miniaturized the opening and impregnation device. It is small enough to be installed in press sites. *For more details, please download the PDF or feel free to contact us.

• Other processing machines

Stable ultrasonic bonding technology using rigid clamps applicable to a wide range of applications.

Our company manufactures and sells "ultrasonic welding equipment" and also provides contract processing services. With our rigid clamp technology that holds the horn with high rigidity, we achieve stable ultrasonic welding across a wide range of applications, from low to high loads. Ultrasonic welding can be applied in various fields such as next-generation secondary batteries, semiconductor packaging, heat sink formation, and flexible substrate bonding. We offer a lineup of equipment ranging from standalone models to those for mass production. 【Application Examples】 - Next-generation secondary batteries (Li foil bonding, Li-copper foil bonding) - Semiconductor packaging - Heat sink formation (pin fin/ribbon fin) - Flexible substrate bonding - IGBT modules (terminal bonding) - Wire harness and electrical wire bonding - DMB (Dot Matrix Bonding) bonding *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract

Ultrasonic cutting technology that achieves a clean cut surface without warping, bending, or dragging of composite materials.

Our company manufactures and sells "ultrasonic cutters" and also provides contract processing services. By applying ultrasonic waves to the cutting tool, we significantly reduce cutting load. This prevents dragging of composite materials and multilayer structures, achieving clean cross-sections without material deformation, burrs, or warping. We can achieve high-quality cutting even for materials that are difficult to cut precisely, such as resins, rubber, metal foils, and pre-fired ceramic materials. We accommodate not only straight blades but also shaped blades, offering a lineup from standalone models to those for mass production. 【Application Examples】 - Li batteries (cutting multilayer and single-layer foils) - Cutting of active material-coated electrodes - Thick copper cutting - TIM slice cutting - Green sheet cutting - Laminated film cutting - Soft material cutting - All-solid-state battery cutting *For more details on our products and services, please refer to the catalog.

• Processing Contract

From research and development of next-generation secondary batteries to mass production. Providing ultrasonic joining devices/ultrasonic cutters!

In the manufacturing of "next-generation secondary batteries," including all-solid-state batteries, various forms of joining and material cutting are required to meet high quality standards. Additionally, when performing joining or cutting processes, measures must be taken in the manufacturing equipment to prevent the generation of hydrogen sulfide due to reactions with moisture in the air. Our company offers "ultrasonic bonding devices and ultrasonic cutters" designed for next-generation secondary battery specifications, aimed at the joining/cutting of electrode foils, joining between battery terminals, and cutting of green sheets. Each device utilizes our unique technology based on ultrasonic waves, enabling high-quality direct bonding at room temperature and cutting without dragging the material. We also provide a dry environment where the evaluation conditions and equipment specifications can be verified with actual machines, allowing for consideration of implementation. 【Features of the Equipment】 <Joining> ■ Ultrasonic bonding device capable of wide-ranging foil bonding and compatible with dry environments <Cutting> ■ Ultrasonic cutter capable of straight/shape cutting and suitable for dry environments ■ Can cut negative electrode foils, positive electrode foils, Li foils, etc. <Fusing> ■ Can continuously and freely fuse separator materials through programming For more details about the products, please refer to the materials. Feel free to contact us with any inquiries.

• Plastic processing machines (cutting and rolling)

There are advantages of ultrasonic bonding such as low resistance, short time, and room temperature joining!

We would like to introduce our "Flexible Substrate Ultrasonic Joining Applications." The advantages of ultrasonic joining include low resistance due to direct bonding, the ability to join in less than one second, and no thermal expansion of the substrate. Additionally, the joining variations can be done with bumped leads and flying leads. 【Features】 ■ Low resistance joining ■ Short joining time ■ Room temperature joining *For more details, please download the PDF or feel free to contact us.

• Other processing machines

Ultrasonic flip chip bonder capable of high-precision implementation with ultrasonic processes.

The FA700 ultrasonic high-precision flip chip bonder enables the development of advanced semiconductor packaging technologies, such as three-dimensional semiconductors, through the ultrasonic bonding process. It allows for high-precision alignment with an IR transmission optical system and is equipped with high-precision positioning functions, including infrared optical systems. 【Features】 ○ High-precision positioning function ○ High-quality bonding ○ Detailed bonding condition settings For more information, please contact us or download the catalog.

• Other mounting machines

Widely usable from R&D to mass production automatic machine integration! Cutting metal foil with high-quality cross-sections.

The "UC1000SA" is a standalone ultrasonic cutter that can cut multilayer materials, such as all-solid batteries with a multilayer structure, without dragging. Thanks to the various sensor information built into the device, the process operation can be understood in detail, making it effective for process startup and mass production management. Additionally, by applying high-frequency vibrations from ultrasonic waves to the blade, it cuts while suppressing material deformation, resulting in high-quality cross-sections without burrs or warping. 【Features】 ■ Cuts metal foils with high-quality cross-sections ■ Cuts multilayer materials without dragging ■ Easy integration into automated systems ■ Comprehensive process monitoring capabilities *For more details, please download the PDF or feel free to contact us.

• Other processing machines

Supports various processes with head exchange! Achieves a wide dynamic range through a low-friction pressurization mechanism.

The "FB2000SS" is a flip chip bonder suitable for high-precision semiconductor mounting. The ultrasonic horn is directly clamped by a rigid clamp. High rigidity clamping ensures high flatness even under high loads. Additionally, it features an alignment calibration function that corrects for temporal changes, along with dual-field recognition, achieving stable high-precision mounting. 【Features】 ■ High-rigidity horn clamp mechanism ■ High-precision alignment ■ High-function position load control ■ Compatible with various processes through head exchange *For more details, please download the PDF or feel free to contact us.

• Other processing machines

Development of advanced semiconductor packaging technology such as three-dimensional semiconductors using ultrasonic bonding processes.

The "FA2000" is an ultrasonic high-precision flip chip bonder capable of high-precision alignment with an IR transmission optical system. It is equipped with high-precision positioning functions, such as infrared optical systems, and bonding control functions that meet the detailed condition settings required during research and development. Additionally, through high-quality bonding, it linearly controls the load in accordance with the increase in bonding area. 【Features】 ■ High-precision positioning function ■ High-quality bonding ■ Detailed bonding condition settings *For more details, please download the PDF or feel free to contact us.

• Other processing machines

Power module and secondary battery circuit formation! Digital control of position, load, and ultrasound.

The "RB0300SS" is an ultrasonic ribbon bonder that forms heat dissipation fins in a programmable manner through ribbon bonding. It supports the bonding and cutting of ribbons for inter-terminal bonding, such as in power modules and DBC electrode bonding. By performing Cu ribbon bonding after joining with an Al binder, it enables circuit formation on fragile materials such as chip surfaces (ABB process). 【Features】 ■ Inter-terminal bonding for power module DBC electrodes ■ Formation of fins for power modules ■ Bonding to fragile materials ■ Inter-terminal bonding for secondary battery terminals *For more details, please download the PDF or feel free to contact us.

• Bonding Equipment

Ultrasonic seam welding machine that transforms manufacturing with rotary ultrasonic welding.

The ultrasonic seam welding machine 'SB200/400CE' is ideal for the lamination of power device materials and the butt connection of materials. By rotating the joint point, it enables large area welding and allows for continuous welding of roll-shaped materials and other continuous materials. 【Features】 - Achieves large area welding - Enables continuous welding - Equipped with joint quality management functions For more details, please contact us or download the catalog.

• Other processing machines

In the data settings, the pin connection position can be freely changed! It is possible to create heat sinks with a high degree of freedom.

The "PB2000MS" is an ultrasonic bonding machine for forming heat sinks compatible with Cu pins, Al pins, and hollow pins. With a dedicated horn for pin bonding, it allows for simultaneous bonding of up to 4 pins. It forms heat sinks at a rate of 4800 UPH. It efficiently bonds metal pins onto the substrate while picking up metal pins from a tray that holds the pins. 【Features】 ■ Simultaneous bonding of multiple pins ■ Programmable pin formation ■ Tray pin supply ■ Parts feeder pin supply (optional) *For more details, please download the PDF or feel free to contact us.

• Other assembly machines

Directly forming heat dissipation fins (pin fins/ribbon fins) on the back of the substrate achieves a high thermal conductivity (approximately 34 times that of TIM and about 7 times that of solder).

The Adwells ultrasonic pin bonding device PB2000MS and ribbon bonder RB0300SS can directly form heat dissipation pins and substrate mounting pins on ceramic substrates and organic substrates. With ultrasonic bonding, it is possible to form heat sinks without using TIM or solder, achieving a thermal conductivity approximately 34 times that of TIM and about 7 times that of solder. (Figure 1) The formation of heat sinks through ultrasonic bonding comes in two types: pin bonding and ribbon bonding. In pin bonding, simultaneous bonding of up to 4 pins can be achieved at once, allowing for programmable heat sink formation. (Photo 1) In ribbon bonding, Cu ribbons or Al ribbons are continuously bonded to form heat sinks. The device is equipped with a multi-feeder, allowing for automatic switching of ribbon materials and thicknesses. (Photo 2) ~ For more details, please download the PDF document and check it out ~ *) We also accept evaluation tests using demo machines, so if you are interested, please contact us using the form below.

• Welding Machine

From R&D for power devices to mass production. Providing ultrasonic bonding equipment!

Ultrasonic bonding devices used in various fields, such as power module terminal bonding and dissimilar metal bonding. At Adwells, we offer a lineup of "ultrasonic bonding devices" for a wide range of applications from R&D to mass production. Each device is compatible with terminal bonding, heat sink formation, DMB bonding, and more. We also conduct evaluation tests with demo units, so if you are interested, please contact us using the form below. 【Features of the device】 Terminal Bonding - Covers optimal bonding conditions for various terminals with a single device - Starts bonding by pressing down on the float with grounding load Heat Sink Formation - Directly forms fins (pins/ribbons) on the back surface of the substrate - High thermal conductivity (37 times that of TIM) due to direct bonding DMB Bonding - Can bond materials that can only handle low load and low output - No surface damage to materials during bonding: patternless horn - High thermal conductivity: about 7 times that of solder - Large area bonding *For more details, please refer to the PDF document or feel free to contact us.

• Ultrasonic Oscillator

We will be exhibiting at the "Kyushu Printing Information Industry Exhibition 2026" held at the Fukuoka International Center. During the event, we will showcase various products. We invite all related parties to come together and visit us. 【Suppliers】 ・Laser-X

This year, Toyota Kikan will exhibit at the Toyota Business Fair. We will introduce products that are useful for heatstroke prevention and more. Our top recommendation is SPACECOOL. Please feel free to visit our booth! SPACECOOL is an "eco-friendly cooling solution" essential for the future of our planet's environment! Be sure to check it out. Also, take a look at the basic knowledge for heat prevention in factories moving forward.

In the operation of drawings, do you face challenges such as "taking too long to find," "uncertainty about whether it's the latest version," or "high likelihood of confirmation errors"? By utilizing CADSUPER's barcode function (optional), you can reliably connect drawings and information, allowing for a smooth advancement of DX in drawing utilization. In this seminar, we will introduce how using barcodes can change: - Drawing management and search - Confirmation and cross-checking tasks - Information collaboration with the field This content is recommended not only for existing users but also for those considering improving the efficiency of drawing operations and reducing errors.

Daitō Shikō Co., Ltd. will be exhibiting at the "International Fire and Disaster Prevention Exhibition" held at Shirakawa Park in Nagoya City, Aichi Prefecture, from Thursday, May 28, 2026. At the exhibition venue, we plan to showcase goods that are perfect for fire prevention events and recruitment activities for members. If you are looking for SP tools, promotional items, or novelties, please be sure to visit our booth.

[Speaker] Miho Ko Shimada, Partner Attorney, Mori Hamada & Matsumoto Law Firm, Foreign Law Joint Enterprise [Key Lecture Content] The movement towards the implementation of CCS, which is positioned as an essential technology for decarbonizing hard-to-abate industries, is gaining momentum in Japan. Among the "advanced CCS projects" selected for business commencement in the early 2030s, some pipeline projects have progressed to the exploratory drilling stage. For shipping transport projects, discussions are underway to create mechanisms for clustering CO2 sources and improving shipping transport efficiency. In this seminar, following the full enforcement of the CCS Business Act on May 22, we will organize the current state of the business environment related to CCS and examine the latest discussions at the Agency for Natural Resources and Energy and the Ministry of the Environment (based on information available at the time of the event) from a legal perspective as we consider the shape of CCS projects leading to Final Investment Decision (FID). [Lecture Items] 1. Current state of the business environment related to CCS 2. Overview of the CCS Business Act 3. Overview of the cost difference support system for CCS projects (pipelines) 4. Structural considerations through the CCS value chain 5. Q&A / Business card exchange