Trends in GaN Wafer and Power Device Technology and Application Development [Web Seminar]

Detailed explanation of the latest evaluation technologies for next-generation power semiconductor devices and materials, as well as cutting-edge simulation technologies.

This book, "Challenges and Evaluation Technologies of Next-Generation Power Electronics," is edited around silicon power semiconductors, which are currently the main players, and next-generation power semiconductor devices based on wide bandgap materials, which will be at the center of next-generation power electronics. It provides detailed introductions not only to semiconductor crystals, device design, process equipment, and high-temperature mounting technologies, but also to the latest evaluation technologies regarding material properties and device characteristics, as well as cutting-edge simulation technologies. It thoroughly covers a wide range of topics, including applications in automotive and communication devices, which are expected to grow significantly in the future, as well as developments in industrial equipment, including home appliances and railways. I hope this book will be greatly helpful in expanding the adoption of next-generation power semiconductor devices towards the realization of a decarbonized society.

• Technical and Reference Books

Revisiting the question! Key technological points necessary for the widespread adoption of next-generation power devices.

This book, "Key Points for the Popularization of SiC/GaN Power Electronics," is edited around the question of what points are essential for widely disseminating SiC/GaN power devices, which will become the main players in power electronics in the near future. It provides detailed information not only on device and process technologies and implementation and application circuit technologies but also on challenges and countermeasures in automotive and solar power applications, passive components, as well as standards and international standardization. Furthermore, it offers a thorough explanation of future market trends for power devices, covering a wide range of topics. I hope this book will be greatly beneficial in accelerating the penetration of SiC/GaN power devices towards the full realization of an environmentally friendly and highly efficient power utilization society. (Noriyuki Iwamuro, "Introduction")

• Technical and Reference Books

GaN power devices, which are attracting attention as key technologies for an energy-saving society. A detailed explanation of the related technologies from crystal growth to packaging for their development!

○Publication Date: April 25, 2012 ○Format: B5 size, hardcover, 264 pages ○Price: 60,000 yen (excluding tax) → STbook member price: 56,952 yen (excluding tax) ○Authors: Takashi Egawa, Nagoya Institute of Technology / Akihiro Kakehashi, Tokyo University of Agriculture and Technology / Yoshinao Kumagai, Tokyo University of Agriculture and Technology / Nao Murakami, Tokyo University of Agriculture and Technology / Nobuo Fukuda, Tohoku University / Fukuda Crystal Technology Research Institute, Inc. / Kazuo Yoshida, Asahi Kasei Corporation / Yusuke Mori, Osaka University / Kan Imade, Osaka University / Mihoko Maruyama, Osaka University / Masashi Yoshimura, Osaka University / Mokichi Iwatani, Meijo University / Koji Kawai, PODEC Corporation / Jun Komiyama, Covalent Materials Corporation / Junichi Yanagisawa, Shiga University / Yasushi Hashizume, Hokkaido University / Yoshitaka Nakano, Chubu University / Toshirou Doi, Kyushu University / Hideo Aida, Namiki Precision Jewel Co., Ltd. / Hirotaka Zou, ULVAC, Inc. / Ryuichiro Uemura, ULVAC, Inc. / Junji Watanabe, Kumamoto University / Takayuki Goto, Mitsubishi Heavy Industries, Ltd. / Kensuke Ide, Mitsubishi Heavy Industries, Ltd. / and 7 others.

• Technical and Reference Books

We will be exhibiting at "Mechatrotech (or Monozukuri World)" held at Port Messe Nagoya (Nagoya International Exhibition Hall). During the event, we will showcase various products. We invite all related parties to come and visit us. 【Suppliers】 - Pferd - DC Swiss - Ensitec - Erichsen (Sheet metal) - EPK (if space allows) - Pipetite (if space allows)

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

Our company will be exhibiting at the "14th Fukushima Renewable Energy Industry Fair (REIF Fukushima 2025)" held at Big Palette Fukushima from Thursday, October 16, 2025, to Friday, October 17, 2025. Focusing on energy visualization solutions that can be started "immediately," we will introduce power monitoring solutions for each equipment and load through examples of the overall system configuration. 【Main Exhibited Products】 - Gateway BOX We will showcase the "Gateway BOX," a product that packages the necessary equipment for easy adoption of the visualization system. - PAL-Plus type E2 (Scheduled for release soon) We will introduce a "smart" clamp CT that can easily measure power for three-phase three-wire and single-phase three-wire systems (scheduled for release soon). - CEW-M4 / PAL-Plus As a monitoring system that can display power consumption and remaining power capacity, we will present the manager software "CEW-M4," which supports up to 20,000 points, and the Modbus-compatible AC current sensor "PAL-Plus." We sincerely look forward to your visit.

Toyo Machinery Co., Ltd. will be exhibiting at the high-performance film exhibition held at Makuhari Messe. The High-Performance Film Exhibition - FILMTECH JAPAN - is a specialized exhibition where molding processing technologies, materials, and functional films themselves are showcased all in one place. Experts from various fields, including the technology departments of film manufacturers, electronics, automotive, batteries, construction and building materials, and food and beverages, will attend in search of functional films. At Toyo Machinery, we will display actual machines for waviness correction and wrinkle removal while running film, allowing you to see their effects and functions. We will also introduce the quality management system (weight, thickness, moisture, etc.) from the German company Marlo. ↓↓↓Toyo Machinery's exhibitor information↓↓↓ https://www.material-expo.jp/tokyo/ja-jp/search/2025/directory/details.org-a11cd7f5-2a7b-4ea7-85ce-cde885acd2dd.html#/ *If you wish to attend, you can pre-register via the "Details & Application" link below. We sincerely look forward to your visit.

We will be exhibiting at the Okayama Technology Exhibition (OTEX) 2025, which will be held at Convex Okayama from November 12 (Wednesday) to November 13 (Thursday), 2025. We will showcase our eco-board pallets (paper pallets) as well as comprehensive packaging solutions suitable for one-way shipments such as exports. Our products will assist in addressing challenges related to environmental considerations in the context of the SDGs and the promotion of white logistics. ■ Our booth: 46 (Company products) We sincerely look forward to your visit, and we hope you can come together.