Fundamentals of Adhesion, Welding, and Joining of Dissimilar Materials, and Evaluation of Strength and Durability [Tokyo Venue]

Fundamental to the latest technology necessary for the scientific elucidation of bonding, degradation, and delamination!

Published on February 5, 2021 A4 size, paperback, 268 pages There is an increasing need for both providers and users of adhesive and joining technologies to scientifically elucidate and explain adhesion, joining, degradation, and peeling. Therefore, this book discusses existing and advanced adhesive and joining technologies, including: 1) the latest technologies and research results that lead to a scientific understanding of phenomena, 2) the fundamentals necessary for correct understanding, and 3) terminology and numerical interpretation to avoid misunderstandings in explanations and product data, all explained and introduced by a team of authors with rich research and practical experience. We hope that readers will utilize this book to address the various challenges they face in adhesion and joining. <Authors> Toshiaki Ogiwara / Tokyo Institute of Technology Nobuhiro Horiuchi / National Institute of Advanced Industrial Science and Technology Kiyomi Mori / Takushoku University Masato Akimoto / Semedain Co., Ltd. Hiroyuki Oguma / National Institute for Materials Science Tetsuo Yamaguchi / The University of Tokyo Kiminori Araki / Yokohama Rubber Co., Ltd. Ken Miyata / Yamagata University Kazuhisa Sanpei / Tamari Industry Co., Ltd. Nobuya Hayakawa / Nagoya Institute of Technology Akira Ishigami, Takashi Kurose, Hiroshi Ito / Yamagata University Minoru Hino / Hiroshima Institute of Technology Akira Kawai / Nagaoka University of Technology Ikuo Shoji / Gunma University Yoichi Namiki / Sekisui Polymertech Co., Ltd.

• Technical and Reference Books

A book to control the interface and utilize phenomena and functions.

This is a book that summarizes the control of heterogeneous material interfaces for performance improvement, the phenomena and functions that manifest at the interfaces, and the technologies for their utilization, from basic principles to cutting-edge research trends. By having leading experts in each field and those who are at the forefront of interface research on new materials contribute to this work, the desired performance and functions, challenges, and research directions are clearly outlined. We hope that readers will gain new insights and discoveries that transcend their areas of expertise, research fields, and application targets.

• Technical and Reference Books

We will be exhibiting at "Mechatrotech (or Monozukuri World)" held at Port Messe Nagoya (Nagoya International Exhibition Hall). During the event, we will showcase various products. We invite all related parties to come and visit us. 【Suppliers】 - Pferd - DC Swiss - Ensitec - Erichsen (Sheet metal) - EPK (if space allows) - Pipetite (if space allows)

We would like to extend our heartfelt congratulations on the continued prosperity of your esteemed company. Our company will be exhibiting at the following trade show, where we will introduce a number of products, including our new product, the Pillow Packaging Full Air Tightness Inspection Machine MSQ-2003. We sincerely apologize for the inconvenience during your busy schedule, but we would like to invite you to visit us at this opportunity. 【 Exhibition Name 】 JAPAN PACK 2025 Japan Packaging Industry Exhibition https://www.japanpack.jp/ 【 Dates 】 October 7 (Tuesday) to October 10 (Friday), 2025 *4 days 10:00 AM to 5:00 PM 【 Venue / Booth Number 】 Tokyo Big Sight / East Hall 8, Booth 8-505

Our company will be exhibiting at the "14th Fukushima Renewable Energy Industry Fair (REIF Fukushima 2025)" held at Big Palette Fukushima from Thursday, October 16, 2025, to Friday, October 17, 2025. Focusing on energy visualization solutions that can be started "immediately," we will introduce power monitoring solutions for each equipment and load through examples of the overall system configuration. 【Main Exhibited Products】 - Gateway BOX We will showcase the "Gateway BOX," a product that packages the necessary equipment for easy adoption of the visualization system. - PAL-Plus type E2 (Scheduled for release soon) We will introduce a "smart" clamp CT that can easily measure power for three-phase three-wire and single-phase three-wire systems (scheduled for release soon). - CEW-M4 / PAL-Plus As a monitoring system that can display power consumption and remaining power capacity, we will present the manager software "CEW-M4," which supports up to 20,000 points, and the Modbus-compatible AC current sensor "PAL-Plus." We sincerely look forward to your visit.

Toyo Machinery Co., Ltd. will be exhibiting at the high-performance film exhibition held at Makuhari Messe. The High-Performance Film Exhibition - FILMTECH JAPAN - is a specialized exhibition where molding processing technologies, materials, and functional films themselves are showcased all in one place. Experts from various fields, including the technology departments of film manufacturers, electronics, automotive, batteries, construction and building materials, and food and beverages, will attend in search of functional films. At Toyo Machinery, we will display actual machines for waviness correction and wrinkle removal while running film, allowing you to see their effects and functions. We will also introduce the quality management system (weight, thickness, moisture, etc.) from the German company Marlo. ↓↓↓Toyo Machinery's exhibitor information↓↓↓ https://www.material-expo.jp/tokyo/ja-jp/search/2025/directory/details.org-a11cd7f5-2a7b-4ea7-85ce-cde885acd2dd.html#/ *If you wish to attend, you can pre-register via the "Details & Application" link below. We sincerely look forward to your visit.

We will be exhibiting at the Okayama Technology Exhibition (OTEX) 2025, which will be held at Convex Okayama from November 12 (Wednesday) to November 13 (Thursday), 2025. We will showcase our eco-board pallets (paper pallets) as well as comprehensive packaging solutions suitable for one-way shipments such as exports. Our products will assist in addressing challenges related to environmental considerations in the context of the SDGs and the promotion of white logistics. ■ Our booth: 46 (Company products) We sincerely look forward to your visit, and we hope you can come together.