Fundamental to the latest technology necessary for the scientific elucidation of bonding, degradation, and delamination!
Published on February 5, 2021 A4 size, paperback, 268 pages There is an increasing need for both providers and users of adhesive and joining technologies to scientifically elucidate and explain adhesion, joining, degradation, and peeling. Therefore, this book discusses existing and advanced adhesive and joining technologies, including: 1) the latest technologies and research results that lead to a scientific understanding of phenomena, 2) the fundamentals necessary for correct understanding, and 3) terminology and numerical interpretation to avoid misunderstandings in explanations and product data, all explained and introduced by a team of authors with rich research and practical experience. We hope that readers will utilize this book to address the various challenges they face in adhesion and joining. <Authors> Toshiaki Ogiwara / Tokyo Institute of Technology Nobuhiro Horiuchi / National Institute of Advanced Industrial Science and Technology Kiyomi Mori / Takushoku University Masato Akimoto / Semedain Co., Ltd. Hiroyuki Oguma / National Institute for Materials Science Tetsuo Yamaguchi / The University of Tokyo Kiminori Araki / Yokohama Rubber Co., Ltd. Ken Miyata / Yamagata University Kazuhisa Sanpei / Tamari Industry Co., Ltd. Nobuya Hayakawa / Nagoya Institute of Technology Akira Ishigami, Takashi Kurose, Hiroshi Ito / Yamagata University Minoru Hino / Hiroshima Institute of Technology Akira Kawai / Nagaoka University of Technology Ikuo Shoji / Gunma University Yoichi Namiki / Sekisui Polymertech Co., Ltd.
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<Continuation: Authors> Naoki Ban / Toray Research Center, Inc. Keisuke Miyamoto / Anton Paar Japan, Inc. Kokei Takahashi / Hokkaido University Hiroyuki Kosukagawa, Hongjun Sun, Mitsuo Hashimoto, Tetsuya Uchi, Toshiyuki Takagi / Tohoku University Masashi Terasaki / National Institute of Advanced Industrial Science and Technology Tomoyuki Uchida / Toray Research Center, Inc. Nobuaki Date / Fujitsu Quality Lab, Inc. Naoaki Tsurumi / Rohm Co., Ltd., Kyushu University Yuta Tsuji, Kazunari Yoshizawa / Kyushu University Akira Shimadzu / Nitto Denko Corporation Tomio Iwasaki / Hitachi, Ltd. Ryota Nakanishi / Okayama Prefectural Industrial Technology Center Koji Sueoka / Okayama University Nobuaki Noda, Rei Takagi / Kyushu Institute of Technology Shuji Ogata / Nagoya Institute of Technology Mitsuki Mukuta / Daicel-Evonik Co., Ltd. Mineo Hashizume / Tokyo University of Science Katsuki Furukawa / Denshi Giken Co., Ltd. Tokiaki Asahara, Yu Yi Xu, Takahiro Aso, Hiroshi Uyam / Osaka University Taichi Nagai / Nippon Parkerizing Co., Ltd. Yusuke Kajiwara, Shuai Jie Zhao, Fuminobu Kimura / The University of Tokyo Masami Itabashi / Taisei Plus, Inc. Atsushi Hosoi / Waseda University Nobuyuki Terasaki / Mitsubishi Materials Corporation Tachihito Suga / Meisei University
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65,000 yen Plus consumption tax *The PDF version (with CD-R) is 75,000 yen plus consumption tax.
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Chapter 1: Governing Factors and Mechanisms of Adhesion, Bonding, and Contact - Influence of the state of polymer chains at the surface and adhesive interface on adhesion strength... and 14 other items Chapter 2: Measurement and Evaluation of Adhesion and Bonding - Analytical methods for evaluating adhesive interfaces... and 9 other items Chapter 3: Simulation of Adhesion and Bonding - Molecular-level evaluation of adhesive interactions through quantum chemical calculations... and 6 other items Chapter 4: Adhesion and Bonding Techniques for Dissimilar Materials and Optimization - Techniques and analytical methods for the composite of dissimilar materials utilizing interfacial reactions... and 10 other items
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S&T Publishing publishes technical books aimed at researchers and engineers.