Factors Governing Joining and Optimization Techniques

Fundamental to the latest technology necessary for the scientific elucidation of bonding, degradation, and delamination!

Published on February 5, 2021 A4 size, paperback, 268 pages There is an increasing need for both providers and users of adhesive and joining technologies to scientifically elucidate and explain adhesion, joining, degradation, and peeling. Therefore, this book discusses existing and advanced adhesive and joining technologies, including: 1) the latest technologies and research results that lead to a scientific understanding of phenomena, 2) the fundamentals necessary for correct understanding, and 3) terminology and numerical interpretation to avoid misunderstandings in explanations and product data, all explained and introduced by a team of authors with rich research and practical experience. We hope that readers will utilize this book to address the various challenges they face in adhesion and joining. <Authors> Toshiaki Ogiwara / Tokyo Institute of Technology Nobuhiro Horiuchi / National Institute of Advanced Industrial Science and Technology Kiyomi Mori / Takushoku University Masato Akimoto / Semedain Co., Ltd. Hiroyuki Oguma / National Institute for Materials Science Tetsuo Yamaguchi / The University of Tokyo Kiminori Araki / Yokohama Rubber Co., Ltd. Ken Miyata / Yamagata University Kazuhisa Sanpei / Tamari Industry Co., Ltd. Nobuya Hayakawa / Nagoya Institute of Technology Akira Ishigami, Takashi Kurose, Hiroshi Ito / Yamagata University Minoru Hino / Hiroshima Institute of Technology Akira Kawai / Nagaoka University of Technology Ikuo Shoji / Gunma University Yoichi Namiki / Sekisui Polymertech Co., Ltd.

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