[Exhibition Information] We will be exhibiting at 'SEMICON JAPAN 2025'.

High-precision inspection equipment compatible with transparent materials.

This is a surface defect inspection device equipped with a differential interference microscope, applicable to transparent materials. It is capable of outputting defect maps through comprehensive inspections and allows for microscopic observation of detected defects. ■ Features of the device - Defect extraction and discrimination functions using proprietary image processing technology - High-precision marking while observing defects - Enables observation and creation of defect albums based on defect coordinates for wafers inspected by other devices - Development of a crystal defect detection function is underway

• Semiconductor inspection/test equipment

Automating visual inspection of wafer defects.

■This is a device that responds to the following requests and concerns! - We want to automate visual inspection of defects on wafers (substrates). - We want to reduce and prevent variability in pass/fail judgments among inspectors. - We want to save inspection data and trace quality. - We want to automatically discriminate defects. ■Features of the device - It can automatically detect, extract, and discriminate visually identifiable defects. - We can propose an optical system optimized for the types of defects. - We can suggest both manual and automatic transport (cassette to cassette). - It also implements AI functions, allowing for improved defect discrimination accuracy through ongoing learning.

• Semiconductor inspection/test equipment

Equipped with a review microscope! Defects detected can be observed in real-time with the microscope.

By irradiating a high-power laser onto a wafer on a rotating stage, the entire surface is inspected at high speed, allowing for the detection of minute defects. By combining multiple channels such as scattering, reflection, and phase shift, defect detection suitable for various applications can be achieved, enabling discrimination by defect type such as unevenness. ■ Features of the device - High-speed inspection (approximately 181 seconds/12 inches) - Equipped with a review microscope - The microscope can be selected as either a laser microscope or a differential interference microscope - High-precision scribing using the microscope for analysis with SEM, etc. - Optional edge inspection functionality is available

• Semiconductor inspection/test equipment

Transparent wafers also undergo high-speed inspection! High-output lasers detect tiny scratches and particles!

The "Laser Explorer" is the latest wafer surface defect inspection device that also supports transparent wafers. A high-power laser detects minute defects such as scratches, pits, and particles! It can be utilized for shipping and receiving inspections of wafers, as well as for quality control in the epitaxial process! 【Other Features】 ■ High throughput (inspects 25 wafers in a cassette in about 40 minutes) ■ Discriminates the unevenness of defects ■ Automatic focusing for all samples ■ Customizable options ■ Supports automatic inspection of one cassette ■ High-precision marking for defects (optional) ■ Defect review using a laser microscope (optional)

• Visual Inspection Equipment
• Defect Inspection Equipment
• Circuit Board Inspection Equipment

Features ● Equipped with Intel Core Ultra 5 125H ● Dual Channel DDR5 5600MHz × 2 slots (up to 96GB) (sold separately) ● HDMI 2.0 × 4 ● M.2 3042/3052 B-Key × 1, 2230 E-Key × 1, 2280 M-Key × 1 (PCIe Gen4 [x4], NVMe) (sold separately) ● USB 2.0 × 5, USB 3.2 × 3, USB 3.2 Gen 1 (Type-C) × 1 ● LAN × 2 ● 12V DC input power ● OOB (Out-of-Band Management) module compatible: MOD-RMB (via i210-AT) * This model does not include memory, storage, or OS.

Features ● Compatible with Intel Core Ultra 200S series ● DDR5 SODIMM x 2 (up to 96GB) ● PCIe x4 x 1, M.2 3042/52 B-key x 1 ● USB2.0 x 4, USB3.2 Gen2 x 2 (rear I/O), USB3.2 Gen1 x 1, USB2.0 x 1 (pin header) ● SATA 6Gb/s x 2 ● HDMI 2.0 x 2, DP 1.4 x 1 ● DC input 19V ~ 24V * This model does not include memory, storage, or OS.

Features ● Equipped with Intel Processor N97 ● DDR5 SODIMM up to 16GB (sold separately) ● M.2 2280 M-Key x 1 (Auto Detect, PCIe [x1] & SATA Mode), M.2 2230 E-Key x 1, M.2 3042/52 B-Key x 1 ● USB3.2 x 1 (rear I/O), USB2.0 x 4 (pin header) ● PoE x 1, GbE LAN x 1 ● 12V DC input ● OOB onboard * This model does not include memory, storage, or OS.

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.