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  1. Home
  2. Testing, Analysis and Measurement
  3. クボタ計装
  4. [Exhibition Information] We will be exhibiting at 'SEMICON JAPAN 2025'.
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  • Oct 08, 2025
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Oct 08, 2025

[Exhibition Information] We will be exhibiting at 'SEMICON JAPAN 2025'.

クボタ計装 クボタ計装
We will be exhibiting Kubota's semiconductor inspection equipment at SEMICON JAPAN, an international exhibition of manufacturing technologies, equipment, and materials in the semiconductor industry. All of our staff sincerely look forward to your visit. 【Exhibition Information】 Date: December 17 (Wed) - 19 (Fri), 2025, 10:00 - 17:00 Venue: Tokyo Big Sight Booth Location: W1963 *Advance registration is required for attendance. Please check the SEMICON JAPAN website for registration details.
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K-IM-G100 画像式ウェハ表面欠陥検査装置.png

Microscopic wafer surface defect inspection device

High-precision inspection equipment compatible with transparent materials.

This is a surface defect inspection device equipped with a differential interference microscope, applicable to transparent materials. It is capable of outputting defect maps through comprehensive inspections and allows for microscopic observation of detected defects. ■ Features of the device - Defect extraction and discrimination functions using proprietary image processing technology - High-precision marking while observing defects - Enables observation and creation of defect albums based on defect coordinates for wafers inspected by other devices - Development of a crystal defect detection function is underway

  • Semiconductor inspection/test equipment

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K-VI-G100 ウェハ外観検査装置.png

Wafer appearance inspection equipment (automatic visual inspection equipment)

Automating visual inspection of wafer defects.

■This is a device that responds to the following requests and concerns! - We want to automate visual inspection of defects on wafers (substrates). - We want to reduce and prevent variability in pass/fail judgments among inspectors. - We want to save inspection data and trace quality. - We want to automatically discriminate defects. ■Features of the device - It can automatically detect, extract, and discriminate visually identifiable defects. - We can propose an optical system optimized for the types of defects. - We can suggest both manual and automatic transport (cassette to cassette). - It also implements AI functions, allowing for improved defect discrimination accuracy through ongoing learning.

  • Semiconductor inspection/test equipment

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K-LE-G200 レビュー機能付きウェハ表面欠陥検査装置.png

Wafer surface defect inspection device with review function

Equipped with a review microscope! Defects detected can be observed in real-time with the microscope.

By irradiating a high-power laser onto a wafer on a rotating stage, the entire surface is inspected at high speed, allowing for the detection of minute defects. By combining multiple channels such as scattering, reflection, and phase shift, defect detection suitable for various applications can be achieved, enabling discrimination by defect type such as unevenness. ■ Features of the device - High-speed inspection (approximately 181 seconds/12 inches) - Equipped with a review microscope - The microscope can be selected as either a laser microscope or a differential interference microscope - High-precision scribing using the microscope for analysis with SEM, etc. - Optional edge inspection functionality is available

  • Semiconductor inspection/test equipment

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K-LE-G100 レーザー式ウェハ表面欠陥検査装置.png

Laser-type wafer surface defect inspection device - Laser Explorer

Transparent wafers also undergo high-speed inspection! High-output lasers detect tiny scratches and particles!

The "Laser Explorer" is the latest wafer surface defect inspection device that also supports transparent wafers. A high-power laser detects minute defects such as scratches, pits, and particles! It can be utilized for shipping and receiving inspections of wafers, as well as for quality control in the epitaxial process! 【Other Features】 ■ High throughput (inspects 25 wafers in a cassette in about 40 minutes) ■ Discriminates the unevenness of defects ■ Automatic focusing for all samples ■ Customizable options ■ Supports automatic inspection of one cassette ■ High-precision marking for defects (optional) ■ Defect review using a laser microscope (optional)

  • Visual Inspection Equipment
  • Defect Inspection Equipment
  • Circuit Board Inspection Equipment

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Related catalog(4)

Wafer Appearance Inspection Equipment Catalog _ K-VI -G100

Wafer Appearance Inspection Equipment Catalog _ K-VI -G100

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Wafer Surface Defect Inspection Device (Laser Type) _K-LE-G100

Wafer Surface Defect Inspection Device (Laser Type) _K-LE-G100

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Wafer surface defect inspection device with review function (laser type) _K-LE-G200

Wafer surface defect inspection device with review function (laser type) _K-LE-G200

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Wafer Surface Defect Inspection Device (Image-based) _K-IM-G100

Wafer Surface Defect Inspection Device (Image-based) _K-IM-G100

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Testing, Analysis and Measurement
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Human Body Day 2025 Event Report - Nack Image Technology

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On November 6th (Thursday) to 7th (Friday), 2025, we held the "Human Body Day 2025" at the NAC Image Technology Akasaka Multi-Purpose Space. We have uploaded videos of the highlights from each company and the presentations that took place on the day to our website. We encourage you to take a look. ---[Report on Human Body Day 2025 is here]------------------- https://info.nacinc.jp/jintaiday2025-report ------------------------------------------------------------------------- On the day of the event, participants were able to experience a wide range of products in a hands-on session format, including motion capture, force plates, eye tracking, and human body analysis software. We received numerous comments from attendees expressing high satisfaction, saying, "It was great to gain various information all at once," which makes us very happy. NAC Image Technology will continue to provide "valuable products to our customers." We hope you will join us for our next event as well.

Mar 20, 2026

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Tokai Area Electrical and Electronic Web Technology Seminar Invitation

The start date for the 2026 "Tokai Area Electrical and Electronic WEB Technology Seminar" has been decided!

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The date for the "Tokai Area Electrical and Electronic WEB Technology Seminar" for the 2026 fiscal year has been decided. Registration has started, so if you are interested, please apply. Multiple participants from one company are allowed, so please make use of this opportunity to acquire basic knowledge. 【April】Basic Knowledge of Resistors 【May】Technical Course on Capacitors 【June】Basics of Motors and How to Choose the Optimal Driver 【July】Fundamentals of IC Socket and Connector Selection 【September】Basics of Magnets 【October】Failure Phenomena of Chip Resistors and Their Countermeasures 【November】Temperature Protection Design Using Thermal Fuses

Mar 20, 2026

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New Product Hand Magnet "YokeLite-100V"

Handmagna "YokeLite-100V" sales start - December 25, 2025

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NDT Mart & Rental Co., Ltd. began selling its new product, the handheld magnet "YokeLite-100V," on December 25, 2025. ◆ Handheld Magnet "YokeLite-100V" The YokeLite-100V is an AC handheld magnet (gap-type magnetizer) used for magnetic particle testing (MT). With a compact design weighing approximately 2.4 kg, it is easy to handle and allows for efficient non-destructive testing work on-site. It generates a powerful alternating magnetic field, supporting the detection of defects such as cracks in welds and on metal surfaces. It features a variable yoke structure, enabling flexible adaptation to various inspection targets, including curved surfaces, corners, and fillet welds. It ensures a lifting power of over 4.5 kg, providing sufficient magnetization capability required for magnetic particle testing. Additionally, by equipping optional UV lights or white lights, it can accommodate a wide range of inspection methods, including fluorescent magnetic particle testing and visual inspections, offering excellent cost performance. This handheld magnet is useful for defect inspection and quality control in the fields of manufacturing, plant equipment, and welding inspection. It combines lightweight design with high inspection performance, contributing to improved work efficiency.

Mar 20, 2026

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New Product: Electromagnetic Ultrasonic Thickness Gauge 'EMAT WIFI'

Started selling the electromagnetic ultrasonic thickness gauge 'EMAT WIFI' - January 19, 2026

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NDT Mart & Rental Co., Ltd. began selling its new electromagnetic ultrasonic thickness gauge, 'EMAT WIFI', on January 19, 2026. ◆ Electromagnetic Ultrasonic Thickness Gauge 'EMAT WIFI' The 'EMAT WIFI' is a thickness gauge that uses the electromagnetic ultrasonic (EMAT) method, which does not require a couplant (contact medium). Unlike conventional ultrasonic thickness gauges (UT), there is no need to apply a couplant; thickness measurements can be taken simply by placing the probe on the measurement target, making it ideal for beginners and screening in large-scale sites. It can measure materials with paint, scale, thick linings, and slight surface roughness, significantly reducing the hassle of pre-treatment. Additionally, it is equipped with WiFi communication capabilities, allowing for the confirmation and management of measurement data and waveforms in conjunction with smartphones and tablets. This facilitates smooth sharing of measurement results and data management on-site. It is optimal for measuring wall thickness and conducting corrosion inspections of plant equipment, piping, tanks, and steel structures. It contributes to the efficiency and reliability of thickness measurements in the field of non-destructive testing (NDT), such as maintenance inspections and equipment diagnostics.

Mar 20, 2026

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New Product: Dual Thickness Gauge 'CT3500'

Sales of the dual thickness gauge "CT3500" compatible with a maximum of 3.5mm will begin on January 28, 2026.

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  • PRODUCT

NDT Mart & Rental Co., Ltd. began sales of its new dual thickness gauge, the 'CT3500', on January 28, 2026. ◆ Dual Thickness Gauge 'CT3500' The 'CT3500' is a portable thickness gauge that supports a wide range of coating measurements from thin films to thick films. It employs a dual measurement method using electromagnetic and eddy current techniques, allowing for automatic differentiation between ferrous and non-ferrous substrates to measure coating thickness. The measurement range accommodates up to 3,500μm, making it suitable for measuring coatings from general painting to heavy anti-corrosion coatings and linings. With a measurement speed of approximately 0.2 seconds, it allows for efficient measurements even in inspection tasks that require multiple points. It is not only compact and easy to carry, but its display features an inclined design that is easy to see from both above and the front. Additionally, the upside-down display and background color (white/black) switching enhance visibility in dark, narrow, and outdoor environments, making it suitable for quality control within factories as well as for equipment inspections and painting checks in outdoor settings. It can be utilized for a wide range of applications, including painting management of bridges and steel structures, anti-corrosion coating measurements for pipes and tanks, and quality control in manufacturing sites. The 'CT3500' is a high-performance portable thickness gauge that provides stable measurements from thin to thick films, designed for field use.

Mar 20, 2026

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