[11/5 Event: Heat Dissipation Materials Seminar] A networking opportunity with heat management materials suppliers (Tokyo, in-person)
We will hold a "Thermal Material Seminar" for engineers considering the formulation of thermal materials such as electronic materials, adhesives, and ceramics. Participants will have the opportunity to hear presentations on products and technologies from sponsoring thermal material suppliers (fillers, resins) and engage in individual meetings and sample consultations. Please utilize this seminar and networking opportunity to aid in the search for optimal materials and efficient sample selection and arrangements.
■ Date: November 5, 2025 (Wednesday) 10:00 AM - 5:00 PM (Individual meetings from 3:00 PM to 5:00 PM are optional)
■ Venue: TKP Shinbashi Conference Center Hall 13C
★ Due to limited availability, participants from academic/research institutions, trading companies, and those in sales, planning, and purchasing roles are not eligible to attend.
Organizer: BYK Chemie Japan Co., Ltd. Business Development
Sponsors: Various raw material suppliers
Secretariat: BYK Chemie Japan Co., Ltd. Marketing Services
Contact: Marketing.BYK.Japan@altana.com TEL: 06-4797-1456

| Date and time | Wednesday, Nov 05, 2025 10:00 AM ~ 05:00 PM Individual meetings are optional from 15:00 to 17:00. |
|---|---|
| Capital | TKP Shinbashi Conference Center Hall 13C 1-3-1 Saiwaicho, Chiyoda-ku, Tokyo 100-0011, Japan |
| Entry fee | Free |
Inquiry about this news
Contact Us OnlineMore Details & Registration
Details & Registration



