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  1. Home
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  3. マーポス
  4. Notice of Participation in SEMICON JAPAN 2025
SEMINAR_EVENT UPDATE
  • Nov 14, 2025
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Nov 14, 2025

Notice of Participation in SEMICON JAPAN 2025

マーポス マーポス
Our company will exhibit at "SEMICON JAPAN 2025," which will be held at Tokyo Big Sight starting from December 17, 2025 (Booth Number: E4727). At this exhibition, we will introduce semiconductor industry-specific applications and non-contact measuring instruments that contribute to the reliability of semiconductor manufacturing processes and the improvement of semiconductor performance, which are continuously evolving. We warmly invite you to visit our booth and see our offerings. <Main Exhibited Products> - Visual blade inspection system for dicing processes - Non-contact high-precision thin film measurement device (interferometry technology) - Non-contact high-precision surface shape measurement device (chromatic confocal technology) - Contact/non-contact thickness measurement gauge for controlling wafer thickness during processing (interferometry technology)
Date and time Wednesday, Dec 17, 2025 ~ Friday, Dec 19, 2025
10:00 AM ~ 05:00 PM
Advance registration is required for entry to this exhibition.
Capital Tokyo Big Sight (East Exhibition Hall)
Entry fee Free Admission to this exhibition requires prior registration.
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Related product

VBI_s.jpg

Dicing Machine Sensor "VBI (Blade Inspection System)"

Achieving reduced cycle time in chip manufacturing and high quality! Sensors for blade monitoring during wafer cutting.

"VBI" monitors the blade during wafer cutting, ensuring high reliability and reducing waste. By measuring blade wear and shape in real-time, it achieves scrap reduction without stopping production. The interface unit connects two sensors. It is possible to perform the same function with both or to execute two different functions. *For more details, please refer to the PDF document or feel free to contact us.*

  • Sensors
  • Wafer
  • Other measurement, recording and measuring instruments

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Optical Interference Measuring Instrument 'NCG'

Shorten cycle time! A versatile and easy-to-use optical interference measuring instrument designed for convenience.

The "NCG" is a thickness measurement device using optical interference technology. It calculates and measures the thickness of layers through the interference caused by the reflection of light waves at the joint surface of the workpiece. It is designed to manage the thickness of different materials such as glass, plastic, and silicon wafers. This product can be connected to various machines, allowing for high-precision and high-speed management of component thickness, and can be used in dry or wet environments within the specified limits of the specifications, either on the machine or inside the machine. 【Features】 ■ Guarantees processing accuracy within the desired tolerance ■ Reduces cycle time ■ Control for maintaining stable production under controlled conditions ■ Compensation for mechanical variations ■ History of measurement results *For more details, please refer to the PDF document or feel free to contact us.

  • Other measurement, recording and measuring instruments
  • Optical Measuring Instruments

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High-precision non-contact gauge for measuring nano-layer film thickness 'NCG-R'

Thickness measurement is possible from thick wafers to ultra-thin wafers (less than 1μm).

Non-contact measurements with high precision are achieved without damaging the measured object. Thickness measurements can be performed with extremely high resolution on all types of surfaces and materials, including highly reflective surfaces. The NCG-R system, equipped with a dedicated optical sensor, is designed with high protection performance (such as an enclosure compliant with IP standards), making it suitable for a wide range of applications from post-manufacturing inspections to in-process inspections. Thickness measurements of thin films, coatings, and nano-layers are the standout features of the NCG-R system, demonstrating exceptional performance. The NCG-R controller (visible light type) is compatible with all types of sensor heads, achieving optimized performance tailored to the measurement range and operating environment (such as working distance and spot size).

  • Coating thickness gauge

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NCG-R_IPROS_280x280.jpg

Interferometer Controller "HORIZON"

Using interferometric (interferometer) technology, it is possible to measure the thickness of transparent and opaque films.

This is a series of controllers designed to measure thickness and distance in conjunction with optical sensor heads. Utilizing interferometric (interferometer) technology and a dedicated data processing software package, it provides a solution for accurate measurements even in situations where contact with the target area is not possible. With high precision and stability at the sub-micron level, it guarantees reliable measurements with excellent repeatability and accuracy. Additionally, it supports inline process control with real-time monitoring, contributing to improved production efficiency.

  • Coating thickness gauge

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STIL_icon01.jpg

Chromatic confocal technology, non-contact measurement for thickness measurement.

It is possible to produce high-quality work without damaging delicate work and without destructive testing. It is a fully synchronized system that is resilient to variations in work and environment.

Sensors and controllers using chromatic confocal measurement technology. We offer various options tailored to your work and environment. They are utilized in industries such as automotive, semiconductor, and glass worldwide. <Advantages> - Non-contact technology suitable for measuring soft or opaque materials (e.g., aluminum rolls, copper rolls, lithium-ion battery separators) - Capable of measuring layer thickness from 5µm - Wide measurement range suitable for inline use - High sensitivity and high precision (the reproducibility range of total thickness in actual applications is within 1µm) - Provision of measurement forks or a complete set of gauging equipment - Quick-SPC software option enables statistical processing and data transfer If you have the following challenges, please download the PDF and consult with us. - Variations in work or environment - Synchronization using multiple sensors - Mechanical alignment (tilt or misalignment) - Detailed understanding of measurements - Special applications requiring customization *For more details, please refer to the PDF document or feel free to contact us.

  • Sensors

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Related catalog(5)

Sensor for Dicing Machines 'VBI (Visual Blade Inspection System)'

Sensor for Dicing Machines 'VBI (Visual Blade Inspection System)'

PRODUCT
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Optical Interference Measuring Instrument 'NCG'

Optical Interference Measuring Instrument 'NCG'

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Non-contact sensor reflection measurement controller "NCG-R"

Non-contact sensor reflection measurement controller "NCG-R"

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Non-contact sensor interferometric controller "HORIZON"

Non-contact sensor interferometric controller "HORIZON"

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Chromatic confocal technology, non-contact measurement solution for thickness measurement 'STIL'

Chromatic confocal technology, non-contact measurement solution for thickness measurement 'STIL'

CATALOG
  • E-book viewing
  • Catalog download

Contact this catalog

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February 4 to February 6 | Shiba Park | Practical Solution Fair 2026 Exhibition

  • NEW
  • SEMINAR_EVENT

[Tokyo] The "Practical Solution Fair 2026," hosted by Otsuka Corporation, will be held from February 4 (Wednesday) to February 6 (Friday), 2026, in Tokyo, and from February 18 to February 19 (Thursday) in Osaka. We would like to inform you that paperlogic's electronic contract and paperlogic's construction document DX pocket will each have a booth at the event. The Practical Solution Fair is Otsuka Corporation's largest IT comprehensive exhibition held once a year. The theme is "Expanding with AI! Complete DX." Paperlogic will also promote the DX of your business document management using AI technology. [Event Information - Tokyo Venue] Date: February 4 (Wednesday) to February 6 (Friday), 2026 (Registration starts at 9:30 / Registration ends at 17:00 *Entry on the first day starts at 10:00) Venue: The Prince Park Tower Tokyo Address: 4-8-1 Shiba Koen, Minato-ku, Tokyo Participation Fee: Free (Pre-registration required) Deadline: Until 17:00 on the day of the event [How to Participate in the Tokyo Venue] To participate in the Practical Solution Fair, please proceed to the registration link from the related links. *An Otsuka ID is required for registration.

Jan 14, 2026

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Notice of Participation in the Fukushima Industrial Exchange Fair on January 22, 2026 (Thursday)

  • NEW
  • SEMINAR_EVENT

Our company will exhibit at the "Reiwa 7th Year Fukushima Industrial Exchange Fair," held at Pulse Iizaka, as our first exhibition to kick off 2026. This fair aims to expand new business transactions and create business opportunities within the region, as well as to promote interaction and collaboration with universities and support organizations. ★ Participating Industry Sectors Machinery, Electronics, Metals / Medical, Welfare / Robotics, Aerospace / Food Processing Environment, Energy / Information, IT / Universities, Support Organizations / Regional Municipalities On the day of the event, we will showcase a variety of popular injection-molded products and resin-cutting processed items, so please feel free to stop by the IIDA booth. 【Iida Manufacturing Co., Ltd. Fukushima No. 2 Factory】 〒969-1204 21-2 Mizukami, Nukazawa, Motomiya City, Fukushima Prefecture TEL: 0243-64-2320 FAX: 0243-64-2571

Jan 12, 2026

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2026/01/21 ◆Half-day Intensive Course ◆Loss Function (JIS Z 8403) Seminar

  • NEW
  • SEMINAR_EVENT

Method for determining inspection standards, standard values, and safety factors based on economic risk Practical introduction to a method of consideration that prevents profit and loss without relying on statistical distribution: Loss Function 【Half-Day Intensive Seminar】 -------------------------------------------------- https://www.rdsc.co.jp/seminar/260107 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ We will inform you about upcoming technical seminars with discounted participation fees. If you would like to apply for each seminar with a discount, please contact ikuma.fukui@wmjplab.com. * The discount on participation fees is available to anyone. * However, we do not accept participants who are technical consultants or instructors. * If you wish to have an in-house training session for the same seminar, please contact me directly. ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━

Jan 09, 2026

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2026/01/23 ◆ Engineering Artificial Intelligence Seminar

  • NEW
  • SEMINAR_EVENT

Introduction to Artificial Intelligence Application Development Led by Element Technologists Basics of Deep Neural Network Models and MT Systems, Minimization of Training Data, Development Implementation Procedures ~ Learning AI Application Know-How through "Automation of Development, Virtual Inspection, and Detection of Unknown Anomalies" ~ 【AI Construction Demo Included, Excel Materials on AI Construction and Calculation Methods Provided to Interested Parties】 ------------------------------------------------------------ https://johokiko.co.jp/seminar_chemical/AD260103.php ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ We will inform you about upcoming technical seminars with discounted participation fees. If you would like to apply for each seminar with a discount, please contact ikuma.fukui@wmjplab.com. * The discount on participation fees is available to anyone. * However, we do not accept applications from technical consultants or instructors. * If you wish to have an in-house training session for the same seminar, please contact me directly. ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━

Jan 09, 2026

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February 20, 2026 ◆ Loss Function (JIS Z 8403) Seminar

  • NEW
  • SEMINAR_EVENT

Method for determining inspection standards, standard values, and safety factors based on economic risks Practical introduction to a method for preventing profit and loss that does not rely on statistical distribution (loss function) [With PC exercises (using templates that can also be repurposed for in-house issue discussions)] ------------------------------------------------------------ https://www.science-t.com/seminar/B260220.html ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ We will inform you about upcoming technical seminars with discounts on participation fees. If you would like to apply for each seminar with a discount on the participation fee, please contact ikuma.fukui@wmjplab.com. * The discount on the participation fee is available to anyone. * However, we do not accept applications from technical consultants or instructors. * If you wish to have the same seminar as an in-house training, please contact me directly. ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━

Jan 09, 2026

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  • 首都圏最大級の工業技術・製品の総合見本市 テクニカルショウヨコハマ2026 第47回 工業技術見本市 時代をひらく新たな技術 2026年2/4(水)・5(木)・6(金) 10:00-17:00 来場者募集中
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