Chromatic confocal technology, non-contact measurement for thickness measurement.

We will hold an online seminar as follows. In the continuously evolving semiconductor industry, the cutting-edge "next-generation semiconductors," which are currently advancing in miniaturization and integration, are attracting particular attention. Along with this, in the latest semiconductor manufacturing processes, it is essential to perform thickness control and shape measurement without causing damage such as scratches or contamination, and there is an increasing need for precise and accurate measurement techniques. In this seminar, we will introduce solutions for realizing cutting-edge semiconductor products, including a new application for thickness measurement using contact and non-contact sensors called "P3CF," as well as examples of nano-level thickness measurement and surface shape measurement (topography, warpage, etc.) using non-contact sensors. Date and Time: March 12, 2024 (Tuesday) 14:00 - 15:00 Instructor: Semiconductor Industrial Manager, Sales Development Department, Marpos Co., Ltd. Recommended for: - Customers engaged in semiconductor manufacturing - Customers facing challenges in wafer thickness measurement - Customers with issues in surface shape or dimensional measurement in semiconductor manufacturing processes How to apply: Please register using the application form below.

Our company will be exhibiting at the "Semiconductor and Sensor Packaging Exhibition (Nepcon Japan)" held at Tokyo Big Sight starting January 24, 2024 (Wednesday). (Booth number: E31-15) At this exhibition, we will introduce applications specifically designed for the semiconductor industry and non-contact measuring instruments that contribute to the reliability of the ever-evolving semiconductor manufacturing processes and the improvement of semiconductor performance. We cordially invite you to visit our booth and take a look. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Non-contact distance/thickness/thin film thickness measuring instrument (chromatic confocal technology) Please register for an admission badge via the URL below, and print it in color in advance before coming to the venue.* https://www.nepconjapan.jp/tokyo/ja-jp/register.html?code=0916133079345892-04F *Admission is by "pre-registration only."

Our company will be exhibiting at the "2nd Automotive World Autumn - EV, HV, and FCV Technology Exhibition" held at Makuhari Messe starting from September 13, 2023 (Booth Number: 5-34). At this exhibition, we will introduce the latest measurement and inspection technologies for EV production sites, focusing on the "Ultrasonic Weight Measurement System for Electrode Materials," which will be showcased for the first time in Japan. We cordially invite you to visit our booth and take a look. Exhibited Products: - Ultrasonic Weight Measurement System for Electrode Materials - Non-contact Measurement Device for Distance/Thickness of Electrode Materials - Press Processing Monitoring System - Electric Motor Function Testing System, among others.

Our company will be exhibiting at "Medtec Japan," which will be held at Tokyo Big Sight starting from Wednesday, April 19, 2023. (Booth number: 3305) At this exhibition, we will primarily showcase leak testers and various non-contact measuring devices. We support the improvement of manufacturing and production processes for medical devices and medical supplies, which require safety, high functionality, and performance guarantees. We invite you to visit our booth and take a look at our offerings. Exhibited products: - Air leak testers for various medical devices - Solvent application systems for disposable products - Inner and outer diameter thickness measurement bench (for transparent molded products) - Laser-based outer diameter measuring device - Image measuring instruments for implants and small precision parts, etc.