★★ "Recommended Ranking of Heat Dissipation Items" 1st to 2nd Place ★★
Hello. This is Hayashi from Koyama Co., Ltd. Today, I would like to introduce the "Comprehensive Recommended Ranking of Heat Dissipation Items" that can help with thermal management of electronic devices!
1. Thermal Pads / Thermal Sheets ... Overall Rating: ★★★★★ (High ease of use, cost performance, and versatility)
● Advantages: A wide variety of thicknesses / Insulating and flexible, does not damage circuit boards or chips / Suitable for filling gaps between heat sinks and components / Easy to use, even for beginners, just by applying it.
● Suitable Applications / Overall Review
Memory / VRAM / M.2 SSD / Power ICs / Driver ICs / General small devices
The most versatile and least likely to fail, a universal type.
2. Heat Sinks & Cooling Fans ... Overall Rating: ★★★★☆ (High effectiveness but requires installation space and secure mounting)
● Advantages: Physically dissipates heat to the outside air, resulting in high cooling performance / Fin structure provides a large surface area, enhancing heat dissipation / When combined with fans, it exhibits even higher cooling performance.
● Suitable Applications / Overall Review
High-power ICs / LED boards / CPUs / GPUs / High-heat modules
The strongest cooling method when space can be secured and mounted. However, since securing installation space and mounting is a prerequisite, the environments in which it can be used are limited.

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