KOYAMA CO., LTD. Company Profile

Hello. This is Hayashi from Koyama Co., Ltd. Today, I would like to introduce the "Comprehensive Recommended Ranking of Heat Dissipation Items" that can help with thermal management of electronic devices! 1. Thermal Pads / Thermal Sheets ... Overall Rating: ★★★★★ (High ease of use, cost performance, and versatility) ● Advantages: A wide variety of thicknesses / Insulating and flexible, does not damage circuit boards or chips / Suitable for filling gaps between heat sinks and components / Easy to use, even for beginners, just by applying it. ● Suitable Applications / Overall Review Memory / VRAM / M.2 SSD / Power ICs / Driver ICs / General small devices The most versatile and least likely to fail, a universal type. 2. Heat Sinks & Cooling Fans ... Overall Rating: ★★★★☆ (High effectiveness but requires installation space and secure mounting) ● Advantages: Physically dissipates heat to the outside air, resulting in high cooling performance / Fin structure provides a large surface area, enhancing heat dissipation / When combined with fans, it exhibits even higher cooling performance. ● Suitable Applications / Overall Review High-power ICs / LED boards / CPUs / GPUs / High-heat modules The strongest cooling method when space can be secured and mounted. However, since securing installation space and mounting is a prerequisite, the environments in which it can be used are limited.

3. Graphite Thermal Diffusion Sheet / Pad ... Overall Rating: ★★★★☆ (Professional material for thin devices) ● Advantages: Thin (tens to hundreds of μm) and can be installed in tight spaces / High thermal diffusion performance in the plane direction / Minimal degradation, stable for long-term use / Many applications in smartphones and laptops ● Suitable Applications / Overall Review If you want to spread the heat from heat sources like smartphones, laptops, or M.2 SSDs across the chassis surface. A material that maximizes effectiveness in thin devices. However, thermal conduction in the thickness direction is weaker than that of metals. 4. Flocked Heat Dissipation (Heat exchange through flocking) ... Overall Rating: ★★☆☆☆ (Specialized for general applications) ● Advantages: High-efficiency heat exchange utilizing liquid film formation and evaporation/condensation / Highly effective with refrigerants and water cooling systems / Can increase surface area, making it effective for specific applications ● Suitable Applications / Overall Review Heat exchangers / Air conditioning and refrigerant circulation devices / Water cooling and evaporative cooling systems. A technology used at the level of heat exchangers in home appliances and factory equipment. Inquiries / Request for Materials ☎042-571-1911 (Contact: Nakasono) ● Please mention that you saw this on Ipros! ●

Recently, we have seen an increase in requests related to public institution bids. This is because our company serves as a primary agent for Trusco Nakayama Corporation and has dealings with numerous manufacturers, including As One Corporation and Sanko Industry Co., Ltd. As a result, we can accommodate a wide range of orders, from small quantities such as a box of screws, a single tool, a box of vinyl gloves, or a pair of shoe covers, to larger volumes. We can offer prices lower than market rates, so if you have any items you need, please feel free to contact us first.