Notice of Participation in the 2nd Kansai NePCON Japan Exhibition

Are you aiming for "zero missed leaks" in liquid filling processes? A new liquid leak inspection device utilizing flexible printed circuit boards (FPC)!

An FPC is installed at the mouth of "liquid-filled containers" flowing on production lines such as conveyor belts, enabling instant detection of minute liquid leaks. This contributes to the automation of line stoppages and the elimination of defective products. It is a new inspection solution that realizes "visualization" for quality improvement, cost reduction, and standardization of inspection processes. 【Features】 - High-precision surface detection that surpasses visual inspection capabilities - Inline installation on existing lines is possible (retrofit compatible) - Compatible with various shapes such as bottles, pouches, and nozzles - Eliminates reliance on specific personnel, enabling unmanned operation without the need for training - Automation and standardization of inspection processes through the supplementation of visual inspections - Addresses labor shortages with 24-hour unmanned inspections 【Benefits of Implementation】 - Increased efficiency and improved yield in pre-shipment inspections - Reduced risk of returns and recalls - Lower labor and training costs - Standardization of quality across overseas locations The FPC can be customized according to container shapes through in-house design and manufacturing.

• Sensors
• Filling and bottling machines
• Liquid and beverage filling machines

One-stop service for FPC design, manufacturing, implementation, and finished product assembly all provided by Taiyo Technorex!

We will support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜ 　☆ ～ ☆ ～ Do you have any of the following concerns? ～☆ ～ ☆ 　　• Looking for a reliable manufacturing partner for new product development 　　• Considering outsourcing as you do not have a manufacturing line 　　• Wanting to request complex board assembly and enclosure assembly, including FPC ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜ Our company has established a system that can consistently handle everything from design to implementation, assembly, inspection, and shipping, and we support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. You will be able to focus on development while efficiently bringing high-quality products to market. If you would like detailed materials or case studies about our EMS business, please feel free to contact us. We also welcome those who just want to take a look at the materials!

• Circuit board design and manufacturing
• EMS

Here is a brief introduction to the successful exhibition content.

<Main Exhibition Content> ◆FPC (Flexible Printed Circuit Board)◆ 　　~Touch, Compare, Experience FPC!~ 　　　●Comparison of weight between rigid boards and FPC 　　　●Reduction of board area through high-density wiring 　　　●Improved work efficiency with transparent FPC 　　　●Introduction of black coverlay, etc. 　　~Technical Topics~ 　　　●High-frequency compatible FPC / High-frequency analysis measurement... Proposing optimal designs and materials based on analysis results 　　　●Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring 　　　●Pattern via fill 4-layer FPC... Achieving high-density wiring and pad-on-via 　　　●6-layer stack via FPC... High-density wiring with stack via structure 　　~Our Initiatives~ 　　　●Introduction of "Space" related business 　　　●Demonstration of "Leak Detection Device" ◆Various Boards and Ceramic Material Systems◆ 　　　Introduction of AI technology, final appearance inspection equipment, and electrical inspection equipment 　　 (Semi-automatic appearance inspection equipment TY-VISION M105SC II) Live demonstration ◆Efficiency and Automation◆ 　　　Proposal for utilizing FA and collaborative robots 　　 (Appearance inspection system + ASSISTA = Efficiency) Live demonstration

• Printed Circuit Board
• Pharmaceutical containers and packaging
• Cosmetic containers and packaging

I would like to introduce the "Technical Information" related to FPC.

● 6-layer stacked via FPC Achieves further high-density wiring with a stacked via structure using via filling technology. Contributes to improved design flexibility by effectively utilizing wiring space. ● MSAP method Realizes high-precision and high-density fine wiring with enhanced plating. Excellent rectangularity of wiring cross-section allows for wiring formation as envisioned. ● Pattern via fill FPC Achieves high-density wiring and pad-on-via by combining MSAP and via filling methods. ● Fine pitch thick copper FPC Contributes to miniaturization of devices with large current and high-density wiring. ● High-frequency fluorine composite 3-layer FPC Combines noise countermeasures and miniaturization with fluorine composite material FPC that has excellent dielectric properties. Suitable for conversion from coaxial cables. ● High-frequency compatible FPC Proposes optimal design and materials based on analysis results. ● Transparent FPC An FPC with excellent light transmittance and heat resistance, capable of chip mounting. Allows for wiring routing without compromising product design.

• Printed Circuit Board

This is the company profile of Taiyo Technorex. (Company name change effective December 21, 2023)

Taiyo Industrial Co., Ltd. (Established December 1960) Taiyo Technolex Co., Ltd. (Name changed December 2023) [Thoughts Behind the New Company Name] The coined term "TECHNOLEX," derived from "Technology" and "Flexible," symbolizes the flexibility of our main product, FPC (Flexible Printed Circuit Board), as well as our commitment to adapt flexibly not only to conventional technologies but also to new technologies and areas such as technology trading. We are evolving beyond the confines of "industry" and looking towards a transition to a more global market.

• Printed Circuit Board
• Transport and handling robots
• Circuit Board Inspection Equipment

[Basic Knowledge] The standard manufacturing process of Taiyo Industry, which has focused on small quantities of a wide variety of products, has been documented!

This document introduces the manufacturing process of FPC (Flexible Printed Circuit) conducted by Taiyo Techno-Rex Co., Ltd. How are flexible printed circuit boards made? This material is intended for those who want to learn about FPC. It explains the manufacturing process after the design of standard specification FPC. [Contents (excerpt)] ■ Exposure ■ Through-hole drilling ■ Copper plating ■ Dry film lamination ■ Exposure * The PDF version is available for download. * A PowerPoint version is also available upon request.

• Printed Circuit Board
• Other electronic parts
• Other cable related products

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed

Features: ● Equipped with Intel Atom x7835RE/x7433RE ● LPDDR5x 8GB/16GB onboard ● eMMC 32GB/64GB onboard ● LVDS x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe x1 x 4 ● COMe Type 10 standard, 84mm x 55mm size ● Operating temperature -40 to 85℃ ● Optional items ECB-920A-0001: Development carrier board NANOCOM-ADN-FAN01: CPU fan NANOCOM-ADN-HSP01: Heat spreader (※ Heat dissipation is required in the enclosure)