Added the heat dissipation gap filler "TIS420C" to AD-Chemi.
We have added the heat-dissipating gap filler "TIS420C" to AD-Chemi. SILCOOLTIS420C is a high thermal conductivity gap filler provided by Momentive. It combines a high thermal conductivity of 4.2 W/m·K with gel-like flexibility, forming a stable thermal conduction path while minimizing stress on electronic components. It cures at room temperature and can accommodate 3D shapes and vertical surfaces, making it suitable for a wide range of applications including automotive, industrial equipment, and communication devices.
Features:
It demonstrates thermal conductivity, contributing to the long-term reliability of devices that generate heat. The surface cures to a rubber-like consistency while the interior has a mastic-like property. We offer materials that cure to a soft rubber or gel-like state. It retains its shape after application and does not drip. It conforms to three-dimensional shapes and can adapt to surfaces with varying heights. It is a product that requires low assembly pressure. It has minimal oil bleed and excellent reworkability. It excels in thermal conductivity (4.2 W/mK). It has excellent heat and cold resistance, and can be used in a wide temperature range of -40 to +150°C after curing. It has extremely low volatile content and excellent stability during heating.

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