安達新産業 Company Profile

We have added a standard stock lineup for the "bandpass filters using colored glass," which has been frequently inquired about! If you are considering a 900nm bandpass filter, please feel free to utilize it. This product is designed to maintain a consistent transmission rate even when the angle changes, and the waveform remains stable even if the angle is misaligned, thanks to the use of colored glass. ◆ About standard stock items from Adachi Shin Sangyo Co., Ltd. .. - I need a few pieces at different levels for urgent product development and performance testing... - I want to try a rough estimate for now... - I would like to make a slight change in shape for prototyping... Adachi Shin Sangyo sincerely addresses the voices of such customers! In today's world, where simulation technology has advanced, we will respond quickly to customer requests by providing standard stock items, so please feel free to contact us!

We would like to inform you that we will be exhibiting at the "Food Processing Technology Exhibition 2025" to be held on November 14, 2025 (Friday) at the Osaka Industry Creation Center (Organizer: Osaka Industrial Promotion Organization). 【About the Exhibition】 1) Date and Time: November 14, 2025 (Friday) 10:30 AM - 4:30 PM 2) Venue: Osaka Industry Creation Center, 3rd Floor, Booth No. 25 3) Exhibition Content: Coatings compliant with the Food Sanitation Act Solutions for issues such as burning and sticking that occur during the manufacturing process - Ceramic Coatings - Non-stick Coatings We will propose silicone defoamers. Controlling foam changes the quality. - Highly effective in small amounts, offering great economic efficiency. - Harmless to humans (low affinity for organic substances) - Proposals based on specific issues, including fast-acting and long-lasting types For more details, please check our company website.

In semiconductor manufacturing, TEG (Test Element Group) chips are essential for evaluating the accuracy and stability of processes. To detect subtle variations in the manufacturing line and improve yield, extremely high technology is required for the metallization (wiring formation) and patterning on TEG chips. In particular, SiC power devices are characterized by high voltage resistance, high-temperature operation, and high-frequency operation, and they exhibit different failure modes and mechanisms compared to silicon (such as breakdown under high electric fields, interface traps, and degradation originating from grain boundaries). Therefore, a TEG specifically for the SiC process is necessary. 【1】What is a TEG chip? - Purpose and Importance 【2】Key Technical Challenges in SiC Processing (Considerations during TEG Fabrication) 【3】Metallization Technology 【4】Patterning Technology 【5】Cross-Impact of SiC Device Technology and Market Summary For more details, please visit our website.