Heat dissipation silicone

Momentive's "TIA235R" is a two-component addition-type liquid silicone rubber designed for heat dissipation and insulation sealing of electrical and electronic components. By mixing component (A) and component (B) in a 1:1 ratio and curing at room temperature or with heat, it hardens into a rubber-like material and adheres to various substrates. After curing, it exhibits excellent heat resistance, cold resistance, and weather resistance, demonstrating stable heat dissipation and electrical insulation properties over a wide temperature range.

When considering heat-dissipating silicone, the first thing that often draws attention is the value of "thermal conductivity (W/m·K)." While thermal conductivity is indeed an important indicator, in actual implementation environments, there are not a few cases where "even if the thermal conductivity on the catalog is high, the temperature does not decrease in the actual device." The reason for this is that heat dissipation performance is determined not by the physical properties of a single material, but by a combination of multiple factors such as: - Contact conditions - Compression conditions - Coating thickness - Interface conditions - Aging changes Therefore, understanding that "high thermal conductivity does not equal the optimal solution" is the starting point for selecting heat-dissipating materials. For more details, please refer to our company, AD-Chemi.

As the high integration, miniaturization, and high output of semiconductor devices rapidly advance, "thermal management" has become one of the most critical parameters that directly affects product reliability, lifespan, and safety, rather than being a secondary design issue. With the miniaturization of transistors, current density has been increasing year by year, and in the power device sector, the widespread adoption of SiC and GaN has led to higher allowable operating temperatures, while heat generation density (W/cm²) has certainly risen. As a result, issues such as increased junction temperature, the emergence of hotspots, and stress concentration due to temperature gradients have become more serious problems than ever before. For example: - Power modules in EVs and charging infrastructure - High-heat chips in AI accelerators and GPUs - High-density mounted boards in automotive ECUs - LED modules with increasing brightness - Industrial power supplies and inverters Despite being in different fields, they all share the commonality that we have entered an era where "thermal design determines the performance limits of products." This is not just about lowering temperatures... For more details, please refer to AD-Chemi.

In the manufacturing industry, particularly in the fields of electronics, semiconductors, and optics, as devices become more advanced and integrated, the operating environments and manufacturing processes are becoming increasingly harsh year by year. Specifically, challenges such as adapting to high-temperature processes represented by reflow and thermal treatment, ensuring material reliability and reproducibility due to miniaturization and high precision, and the increase of low surface energy materials like silicone rubber and fluororesin, which were traditionally difficult to bond, are becoming apparent. It is also true that the conventional acrylic adhesives, which have been mainstream, are beginning to show limitations in terms of heat resistance, durability, and substrate compatibility in response to these demands. Recently, silicone adhesives, specifically Pressure Sensitive Adhesives (PSA), have been gaining renewed attention as alternative and complementary technologies. - What are adhesives in the first place? - Typical applications of adhesives - Basic structure and design philosophy of PSA - What is silicone PSA? - Four reasons why silicone PSA is chosen - About Momentive's silicone PSA - Checkpoints for first-time consideration Please check our website for more details.