The heat dissipation gap filler "TIA251GF-J" has been added to AD-Chemi.
The Momentive product "TIA251GF-J" is a two-component liquid silicone gap filler designed for heat dissipation and insulation sealing of electrical and electronic components. By mixing component (A) and component (B) in a 1:1 ratio and curing at room temperature or with heat, it hardens into a rubbery or gel-like state, adhering to various substrates. After curing, it exhibits excellent heat resistance, cold resistance, and weather resistance, demonstrating stable heat dissipation and electrical insulation over a wide temperature range.
Features:
- Excellent thermal conductivity, suitable for heat dissipation applications.
- Easy-to-use two-component system with a mixing ratio of 1:1 (weight ratio).
- Conforms to three-dimensional shapes.
- Remains soft and gel-like after curing, protecting components from various stresses.
- Equivalent to UL94 V-0.
*What is a gap filler?
A silicone gap filler is a thermally conductive material that fills the gaps between components to efficiently dissipate heat generated inside electronic devices. Based on silicone, it is soft and easily deformable, allowing it to adhere firmly to uneven components such as heat sinks, substrates, and power devices. This prevents insulation due to air layers and significantly reduces thermal resistance.
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