Conformal coating agent

The food industry is currently undergoing a significant technological transformation. Traditional food manufacturing has relied heavily on the experience and operational know-how of craftsmen. However, in recent years, amidst new trends such as plant-based foods, precision fermentation, high-protein functional beverages, continuous production processes, and the smart factory movement, food manufacturing is evolving into a more precise process control industry. Within this change, issues that have previously been overlooked are becoming apparent. One of these issues is the presence of foam. Foam is not merely an aesthetic problem; in next-generation food factories, it can become a hindrance to process control. ◆ New challenges of foam in plant-based foods ◆ Foam stabilization in high-protein beverages ◆ The issue of foam in smart factories ◆ The defoaming solutions that Adachi New Industry Co., Ltd. aims for For more details, please check our company website.

Momentive's "TIG830SP" is a thermally conductive silicone oil compound. Compared to conventional oil compounds, it has less oil separation, contributing to high reliability. It also exhibits excellent thermal conductivity over a wide temperature range. *What is a thermally conductive silicone oil compound?* It is a grease-like composite material that is highly filled with thermally conductive fillers (typically metal oxides) based on silicone oil, used to enhance the heat dissipation efficiency of electronic components and heating elements. It is ideal for thermal design of electronic components that require both heat dissipation and insulation. Proper application amount and film thickness management are crucial for thermally conductive silicone oil compounds; too much will be extruded, while too little will increase thermal resistance. The application surface must be degreased to prevent poor adhesion. Caution is needed around optical components and contact areas due to the possibility of oil bleeding and volatility at high temperatures. Since it does not cure, it can easily shift due to vibration, making measures against misalignment, such as using frames or pads, effective. Additionally, it may swell some resins and rubbers, so prior evaluation is essential. For more details, please check our website.

The Momentive product "TIA251GF-J" is a two-component liquid silicone gap filler designed for heat dissipation and insulation sealing of electrical and electronic components. By mixing component (A) and component (B) in a 1:1 ratio and curing at room temperature or with heat, it hardens into a rubbery or gel-like state, adhering to various substrates. After curing, it exhibits excellent heat resistance, cold resistance, and weather resistance, demonstrating stable heat dissipation and electrical insulation over a wide temperature range. Features: - Excellent thermal conductivity, suitable for heat dissipation applications. - Easy-to-use two-component system with a mixing ratio of 1:1 (weight ratio). - Conforms to three-dimensional shapes. - Remains soft and gel-like after curing, protecting components from various stresses. - Equivalent to UL94 V-0. *What is a gap filler? A silicone gap filler is a thermally conductive material that fills the gaps between components to efficiently dissipate heat generated inside electronic devices. Based on silicone, it is soft and easily deformable, allowing it to adhere firmly to uneven components such as heat sinks, substrates, and power devices. This prevents insulation due to air layers and significantly reduces thermal resistance. For more details, please visit our website.

Momentive's "TIA0330" is a non-corrosive, fast-drying, heat-dissipating one-component room temperature curing silicone adhesive with reduced low molecular siloxanes. It reacts with moisture (water) in the air to cure into a rubber-like elastomer that excels in heat resistance, cold resistance, electrical insulation, weather resistance, and water resistance. It requires no mixing or heating, significantly simplifying the process from application to curing. Its semi-fluidity makes it suitable for automatic dispensing and it has excellent conformability to complex shapes. It is ideal for a wide range of electronic devices where heat dissipation is critical, such as automotive ECUs, inverters, communication base stations, and servers/PCs. At Adachi New Industries, we provide consistent technical support from material selection based on application to optimization of application conditions and prototype follow-up. If you have concerns regarding heat dissipation design or adhesive challenges, please feel free to consult us. *About the corrosion mechanism of general silicones Corrosion of copper-based metals by silicone occurs when moisture-curing silicones react with water vapor in the air, releasing by-products such as acetic acid and alcohol. When these components come into contact with the copper surface, they undergo a chemical reaction, forming copper oxide and corrosive compounds. Corrosion accelerates, especially in energized environments or high humidity, leading to poor conductivity and contact degradation.