Development of conductive ink and plastic substrates for printed electronics - Improving adhesion and application expansion - Design of Ag ink and paste, printing circuits without disconnection, large-area printing processes.

【Course Overview】
New biosensors with functions such as ultra-thin, ultra-lightweight, and ultra-flexible designs are being actively researched to achieve higher biocompatibility. This course will introduce the manufacturing process of large-area sensors using printing processes. It will cover silver nanoparticle inks for low-temperature sintering high-resolution inkjet printing devices that can form devices on ultra-thin films at low temperatures, as well as the adhesion control of printed wiring that prevents disconnection even on ultra-flexible films.
Part 1: Large-area organic integrated circuit printing on ultra-thin films using printed electronics technology and sensor applications
【11:30-12:45】
Instructor: Yamagata University
Part 2: Polymer film substrate materials for printed electronics
【13:30-14:45】
Instructor: Toyobo Co., Ltd.
Part 3: Development of silver paste for gravure offset and printed electronics applications
【15:00-16:15】
Instructor: Satoshi Shiota, Head of the 2nd Department, 3rd Technical Development Division, DNP Fine Chemicals Co., Ltd.


Date and time | Friday, Jul 24, 2015 11:30 AM ~ 04:15 PM |
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Capital | Tokyo Chuo Ward Industrial Hall 4F, Meeting Room 2 [Tokyo, Chuo Ward] Toei Asakusa Line, Higashi-Nihonbashi Station, 4 minutes from B3 exit towards Asakusa-bashi/ Oshiage Toei Shinjuku Line, Bakuro-Yokoyama Station, 5 minutes via underground passage from B4 exit |
Entry fee | Charge |
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