Thorough Explanation of Curing Behavior Analysis and Evaluation Methods for Thermosetting Resins!

**Part 1**: Quantification Technology for the Curing Reactivity of Thermosetting Resins Using Reaction Rate Equations
Masaki Yoshii, Seiro Japan Co., Ltd.
This section introduces representative reaction evaluation techniques for thermosetting resins and presents various reaction rate equations as methods for quantifying the obtained reaction characteristics.
**Part 2**: Analysis and Evaluation Techniques for the Curing Behavior of Thermosetting Resins Using Thermal Analysis and Viscoelastic Measurement
Nobuaki Okubo, Hitachi High-Tech Science Corporation
This section explains the measurement of the curing behavior of thermosetting resins using DSC, TG, TMA, and DMA, as well as the analysis of the cured products, and introduces case studies of UV-curable resins analyzed by photochemical reaction DSC.
**Part 3**: Measurement and Evaluation Techniques for the Curing Behavior of Thermosetting Resins Using Dielectric Analysis (DEA)
Osamu Tsukamoto, Netch Japan Co., Ltd.
This lecture introduces the basics of dielectric analysis, practical measurement techniques, and application examples.
**Part 4**: Analysis of Curing Reactions of Cured Resins Using FT-IR and Raman Spectroscopy
Mamoru Komatsu, Thermo Fisher Scientific Inc.
This course covers the fundamentals of infrared and Raman spectroscopy, including equipment, sampling methods, and analysis examples.

Date and time | Tuesday, Nov 29, 2016 10:30 AM ~ 05:00 PM |
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Capital | Takahashi Building (Toho Land Co., Ltd.) Conference Room (3-2 Kanda Jinbocho, Chiyoda-ku, Tokyo) http://www.toho-tochi.jp/map.html |
Entry fee | Charge 49,800 yen |
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